JP2020526914A - 半導体電力変換デバイスのための正の抵抗温度係数(ptc)を有するゲートネットワーク - Google Patents
半導体電力変換デバイスのための正の抵抗温度係数(ptc)を有するゲートネットワーク Download PDFInfo
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- JP2020526914A JP2020526914A JP2019570020A JP2019570020A JP2020526914A JP 2020526914 A JP2020526914 A JP 2020526914A JP 2019570020 A JP2019570020 A JP 2019570020A JP 2019570020 A JP2019570020 A JP 2019570020A JP 2020526914 A JP2020526914 A JP 2020526914A
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 170
- 239000004065 semiconductor Substances 0.000 title claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 claims abstract description 72
- 239000002184 metal Substances 0.000 claims abstract description 72
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 70
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 65
- 239000010410 layer Substances 0.000 claims description 74
- 239000000463 material Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 15
- 229910021332 silicide Inorganic materials 0.000 claims description 13
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 13
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 12
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 8
- 230000005669 field effect Effects 0.000 claims description 6
- 229920005591 polysilicon Polymers 0.000 claims description 6
- 229910005881 NiSi 2 Inorganic materials 0.000 claims description 3
- 229910019001 CoSi Inorganic materials 0.000 claims description 2
- 229910016006 MoSi Inorganic materials 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910008484 TiSi Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- FMQXRRZIHURSLR-UHFFFAOYSA-N dioxido(oxo)silane;nickel(2+) Chemical compound [Ni+2].[O-][Si]([O-])=O FMQXRRZIHURSLR-UHFFFAOYSA-N 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 239000011229 interlayer Substances 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- GNKTZDSRQHMHLZ-UHFFFAOYSA-N [Si].[Si].[Si].[Ti].[Ti].[Ti].[Ti].[Ti] Chemical compound [Si].[Si].[Si].[Ti].[Ti].[Ti].[Ti].[Ti] GNKTZDSRQHMHLZ-UHFFFAOYSA-N 0.000 claims 1
- 238000013459 approach Methods 0.000 description 28
- 210000000689 upper leg Anatomy 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 230000007423 decrease Effects 0.000 description 9
- 230000001052 transient effect Effects 0.000 description 9
- 230000008859 change Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 210000002414 leg Anatomy 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000003412 degenerative effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000008713 feedback mechanism Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000006903 response to temperature Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910021341 titanium silicide Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4916—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen
- H01L29/4925—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement
- H01L29/4933—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a silicon layer, e.g. polysilicon doped with boron, phosphorus or nitrogen with a multiple layer structure, e.g. several silicon layers with different crystal structure or grain arrangement with a silicide layer contacting the silicon layer, e.g. Polycide gate
-
- H—ELECTRICITY
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
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- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
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- H—ELECTRICITY
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823437—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823475—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type interconnection or wiring or contact manufacturing related aspects
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5228—Resistive arrangements or effects of, or between, wiring layers
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
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- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
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- H01L29/42312—Gate electrodes for field effect devices
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- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
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- H01L29/42312—Gate electrodes for field effect devices
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- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/42376—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the length or the sectional shape
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- H01L29/66234—Bipolar junction transistors [BJT]
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- H01L29/66333—Vertical insulated gate bipolar transistors
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- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
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Abstract
Description
Claims (21)
- 炭化ケイ素(SiC)電力変換デバイスであって、
前記SiC電力変換デバイスの活性領域に配置された、複数のSiC金属・酸化物・半導体ベース(MOSベース)トランジスタデバイスセルそれぞれの複数のゲート電極と、
前記SiC電力変換デバイスのゲートパッド・バス領域に配置されたゲートパッドと、
前記SiC電力変換デバイスの前記ゲートパッド・バス領域に配置されたゲートバスであって、前記ゲートバスは、前記ゲートパッドと、前記SiC電力変換デバイスの前記活性領域の前記複数のゲート電極の少なくとも一部との間に延びて電気的に接続するゲートバスと、
を含む、ゲートネットワークであって、
前記ゲートネットワークの、前記ゲートパッド、前記ゲートバス、前記複数のゲート電極、またはそれらの組み合わせの、少なくとも一部は、約2000パーツパーミリオン毎度C(ppm/℃)より大きい正の抵抗温度係数を有するゲートネットワークを備える、炭化ケイ素(SiC)電力変換デバイス。 - 前記正の抵抗温度係数は、約2250ppm/℃より大きい、請求項1に記載のデバイス。
- 前記正の抵抗温度係数は、約2400ppm/℃と3200ppm/℃との間である、請求項2に記載のデバイス。
- 前記ゲートネットワークの、前記ゲートパッド、前記ゲートバス、および前記複数のゲート電極の実質的にすべてが、実質的に同じ正の抵抗温度係数を有する、請求項1に記載のデバイス。
- 前記SiC電力変換デバイスは、150℃の接合部温度(Tj)で動作している全等価直列ゲート抵抗(Rg)であって、25℃のTjで動作している前記SiC電力変換デバイスのRgより少なくとも25%大きいものを有する、請求項1に記載のデバイス。
- 150℃のTjで動作している前記SiC電力変換デバイスのRgは、25℃のTjで動作している前記SiC電力変換デバイスのRgより約30%から40%大きい、請求項5に記載のデバイス。
- 前記ゲートネットワークは、金属シリサイド層の下方に配置された高度にドープされたポリシリコン層を含む、請求項1に記載のデバイス。
- 前記金属シリサイド層は、ケイ化モリブデン(MoSi2)、ケイ化タンタル(TaSi2)、ケイ化タングステン(WSi2)、ケイ化コバルト(CoSi2)、ケイ化ニッケル(NiSi2)、ケイ化チタン(TiSi2)、またはそれらの組み合わせを含む、請求項7に記載のデバイス。
- 前記ゲートネットワークのシート抵抗は、2オーム毎スクエア(オーム/スクエア)と50オーム/スクエアとの間である、請求項1に記載のデバイス。
- 前記SiC電力変換デバイスの全等価直列ゲート抵抗(Rg)は、約1オームと約80オームとの間である、請求項1に記載のデバイス。
- 前記SiC電力変換デバイスのRgは、約3オームと約20オームとの間である、請求項10に記載のデバイス。
- 前記ゲートネットワークの前記ゲートパッドのみが、約2000ppm/℃より大きい前記正の抵抗温度係数を有し、前記ゲート電極は、大幅に低い正の抵抗温度係数を有する、請求項1に記載のデバイス。
- 前記ゲートパッド、前記ゲートバス、および前記複数のゲート電極のうち、1つのみが、前記正の抵抗温度係数を有する、請求項1に記載のデバイス。
- 前記ゲートパッドは、ゲート金属コンタクト領域に隣接して配置された複数の集積抵抗を有する集積抵抗ネットワークを含み、
前記複数のSiC MOSベーストランジスタデバイスセルは、前記デバイスの前記活性領域のそれぞれ異なる部分に配置され、
前記複数のゲート電極の第1部分は、前記複数の集積抵抗のうちの第1集積抵抗、前記ゲートバス、および前記ゲート金属コンタクト領域を介して、外部ゲート接続に電気的に接続され、
前記デバイスの前記活性領域の第2部分内の、前記複数のゲート電極の第2部分は、前記複数の集積抵抗のうちの第2集積抵抗および前記ゲートコンタクト領域を介して、前記外部ゲート接続に電気的に接続され、
前記第1集積抵抗および前記第2集積抵抗は、実質的に異なるそれぞれの抵抗値を有する、
請求項1に記載のデバイス。 - 前記複数のSiC MOSベーストランジスタデバイスセルは、複数の金属・酸化物・半導体電界効果トランジスタ(MOSFET)デバイスセルまたは複数の絶縁ゲートバイポーラトランジスタ(IGBT)デバイスセルである、請求項1に記載のデバイス。
- 炭化ケイ素(SiC)電力変換デバイスの半導体層の表面にゲートネットワークを形成することを含み、
前記ゲートネットワークは、
前記SiC電力変換デバイスの活性領域に配置された複数のSiC金属・酸化物・半導体ベース(MOSベース)トランジスタデバイスセルの複数のゲート電極と、
前記SiC電力変換デバイスのゲートパッド・バス領域に配置され、前記複数のゲート電極のそれぞれに電気的に接続されたゲートパッドと、を含み、
前記ゲートネットワークの少なくとも一部は、約2000パーツパーミリオン毎度C(ppm/℃)より大きい正の抵抗温度係数を有する、
方法。 - 前記ゲートネットワークを形成することは、
前記半導体層の前記表面上にゲート材料層を成膜することと、
前記ゲート材料層の一部を選択的にエッチングし、前記ゲートネットワークを形成することと、を含み、
前記ゲート材料層は、25℃で約3オーム毎スクエアと約6オーム毎スクエアとの間のシート抵抗を有する、
請求項16に記載の方法。 - 前記ゲート材料層を成膜することは、
ドープされたポリシリコン層を前記半導体層の前記表面上に直接成膜することと、
前記ドープされたポリシリコン層上にシリサイド層を成膜し、前記ゲート材料層を形成することと、を含み、
前記ドープされたポリシリコン層は、約2500オングストローム(Å)と4000Åとの間の厚さを有し、
前記シリサイド層は、約1500Åと4000Åとの間の厚さを有する、
請求項17に記載の方法。 - 前記複数のSiC MOSベーストランジスタデバイスセルのそれぞれについて、前記SiC電力変換デバイスの前記表面に隣接するボディ/ソースコンタクト領域、ウェル領域、およびソース領域を注入することにより、前記ゲートネットワークを形成する前に前記SiC電力変換デバイスの前記活性領域を製造することを含む、請求項16に記載の方法。
- 前記ゲートネットワークを形成する前に、前記SiC電力変換デバイスの前記活性領域の前記半導体層の前記表面にゲート誘電体を形成し、前記ゲートパッド・バス領域の前記SiC電力変換デバイスの前記表面にフィールド酸化膜層を形成することと、
前記ゲートネットワークを形成した後、前記ゲートネットワーク上に直接、前記SiC電力変換デバイスの前記表面上の層間絶縁膜(ILD)を形成することと、
前記SiC電力変換デバイスの前記表面に配置された前記ゲート誘電体、前記ILD、またはその両方の一部を選択的に除去して前記ゲートパッド・バス領域にゲートビアおよびバスビアを形成し、前記SiC電力変換デバイスの前記活性領域の前記複数のSiC MOSベーストランジスタデバイスセルのそれぞれの前記ボディ/ソースコンタクト領域を露出させることと、
前記SiC電力変換デバイスの前記活性領域の前記複数のSiC MOSベーストランジスタデバイスセルの前記ボディ/ソースコンタクト領域上に直接ソース金属を成膜するとともに、前記SiC電力変換デバイスの前記ゲートパッド・バス領域の前記ゲートビアの中にゲートパッド金属を成膜し、前記SiC電力変換デバイスの前記ゲートパッド・バス領域の前記バスビアの中にゲートバス金属を成膜することと、
を含む、請求項19に記載の方法。 - 炭化ケイ素(SiC)電力変換デバイスであって、
前記活性領域のそれぞれ異なる部分に配置された複数のSiC金属・酸化物・半導体ベース(MOSベース)トランジスタデバイスセルそれぞれの複数のゲート電極を備える、活性領域と、
集積抵抗ネットワークに隣接して配置されたゲート金属コンタクト領域を含むゲートパッドを備える、ゲートパッド・バス領域と、
前記ゲートパッドと、前記デバイスの前記活性領域の第1部分の前記複数のゲート電極の第1部分との間に延びる第1ゲートバスと、を備え、
前記複数のゲート電極の前記第1部分は、前記集積抵抗ネットワークの第1部分、および、前記第1ゲートバスを介して、前記ゲート金属コンタクト領域に電気的に接続され、
前記デバイスの前記活性領域の第2部分内の、前記複数のゲート電極の第2部分は、前記集積抵抗ネットワークの第2部分を介して、前記ゲート金属コンタクト領域に電気的に接続され、
前記集積抵抗ネットワークの前記第1部分の抵抗値は、前記集積抵抗ネットワークの前記第2部分の抵抗値と大幅に異なり、
前記複数のゲート電極、前記ゲートパッド、前記第1ゲートバス、またはそれらの組み合わせの、少なくとも一部は、約2000パーツパーミリオン毎度C(ppm/℃)より大きい正の抵抗温度係数を有する、
炭化ケイ素(SiC)電力変換デバイス。
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