JP2020522008A - 搬入出機構及びリソグラフィー装置のワークテーブルの搬入出装置 - Google Patents
搬入出機構及びリソグラフィー装置のワークテーブルの搬入出装置 Download PDFInfo
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- JP2020522008A JP2020522008A JP2019564522A JP2019564522A JP2020522008A JP 2020522008 A JP2020522008 A JP 2020522008A JP 2019564522 A JP2019564522 A JP 2019564522A JP 2019564522 A JP2019564522 A JP 2019564522A JP 2020522008 A JP2020522008 A JP 2020522008A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70975—Assembly, maintenance, transport or storage of apparatus
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
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- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (10)
- 移動積載面に対して移動対象を搬入及び搬出するための搬入出機構において、
前記搬入出機構は、
連結ブロックと、板ばねと、板ばね変形駆動ユニットと、ローラーユニットとを含み、
前記板ばねは第1段と第2段とを含み、
前記第1段と前記第2段との間はヒンジ連結され、
前記第1段は前記連結ブロックを通じて前記移動対象に取り付けられ、且つ前記第2段は前記ローラーユニットに連結され、
前記板ばね変形駆動ユニットは前記第2段に前記移動積載面に向かって変形する駆動力を提供する、
ことを特徴とする搬入出機構。 - 前記第1段と前記第2段との間は可撓性ヒンジによってヒンジ連結を実現する、
ことを特徴とする請求項1に記載の搬入出機構。 - 前記板ばね変形駆動ユニットは、スライダー、可撓性リンク、V字状リンク、及び調整素子を含み、
前記スライダーは前記板ばねに設けられ、且つ前記板ばね上で摺動することができ、
前記可撓性リンクの一端は前記スライダーとヒンジ連結され、
前記可撓性リンクの他端は前記V字状リンクの一端にヒンジ連結され、
前記V字状リンクの他端は前記移動対象と接触し、
前記V字状リンクの先端は前記第2段とヒンジ連結され、
前記調整素子は前記スライダーと連結されて、前記スライダーの位置を調整する、
ことを特徴とする請求項1に記載の搬入出機構。 - 前記可撓性リンクは伸縮可能な構造である、
ことを特徴とする請求項3に記載の搬入出機構。 - 前記V字状リンクの前記移動対象に接触する一端に付勢ローラーがさらに設けられ、
前記V字状リンクは前記付勢ローラーを通じて前記移動対象に力を印加する、
ことを特徴とする請求項3に記載の搬入出機構。 - 前記付勢ローラーは前記移動対象に固定されるブラケットにより支持される、
ことを特徴とする請求項5に記載の搬入出機構。 - 前記調整素子はねじと制限ブロックとを含み、
前記ねじと前記スライダーはねじ山機構を構成し、前記制限ブロックは前記板バネに固定され、
前記ねじのねじ頭は前記制限ブロック内に制限され、前記ねじを調整することにより前記スライダー位置の移動を実現する、
ことを特徴とする請求項3に記載の搬入出機構。 - 前記ローラーユニットは、
ローラーブラケット、駆動ローラー、モーター、及び伝動装置を含み、
前記駆動ローラーは前記ローラーブラケットを通じて前記板バネに連結され、
前記伝動装置の一端は前記駆動ローラーに連結され、
前記伝動装置の他端は前記モーターに連結され、
前記モーターは前記伝導装置を通じて前記駆動ローラーを回転させる、
ことを特徴とする請求項1に記載の搬入出機構。 - リソグラフィー装置のワークテーブルを支持する底部フレームと、
前記底部フレームの下面に設けられる空気ばねと、
前記底部フレームの下面に設けられるエアクッション装置と、
前記底部フレームに接触する請求項1〜8のいずれか一項に記載の搬入出機構と、
を含むことを特徴とする、リソグラフィー装置のワークテーブルの搬入出装置。 - 複数組の前記搬入出機構は対をなし、且つ前記底部フレームの下面または側辺に対称的に配置される、
ことを特徴とする請求項9に記載のリソグラフィー装置のワークテーブルの搬入出装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710399702.5 | 2017-05-31 | ||
CN201710399702.5A CN108983552B (zh) | 2017-05-31 | 2017-05-31 | 一种移入移出机构及光刻机工件台移入移出装置 |
PCT/CN2018/088335 WO2018219217A1 (zh) | 2017-05-31 | 2018-05-25 | 一种移入移出机构及光刻机工件台移入移出装置 |
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JP2020522008A true JP2020522008A (ja) | 2020-07-27 |
JP7011670B2 JP7011670B2 (ja) | 2022-01-26 |
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US (1) | US10895814B2 (ja) |
JP (1) | JP7011670B2 (ja) |
KR (1) | KR102314620B1 (ja) |
CN (1) | CN108983552B (ja) |
TW (1) | TWI661278B (ja) |
WO (1) | WO2018219217A1 (ja) |
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CN107885037B (zh) * | 2016-09-30 | 2020-01-24 | 上海微电子装备(集团)股份有限公司 | 一种工件台移入移出装置 |
CN113126451A (zh) * | 2021-04-01 | 2021-07-16 | 三河建华高科有限责任公司 | 大理石精密工作台气浮顶升机构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51103265U (ja) * | 1975-02-18 | 1976-08-18 | ||
JP2001018232A (ja) * | 1999-07-09 | 2001-01-23 | Mitsubishi Heavy Ind Ltd | エア浮上式金型交換搬送装置 |
CN101609263A (zh) * | 2009-07-22 | 2009-12-23 | 上海微电子装备有限公司 | 光刻机硅片台移动装置及采用该移动装置的光刻机 |
CN102830591A (zh) * | 2011-06-17 | 2012-12-19 | 上海微电子装备有限公司 | 光刻机硅片台驱动装置 |
WO2018059377A1 (zh) * | 2016-09-30 | 2018-04-05 | 上海微电子装备(集团)股份有限公司 | 一种工件台移入移出装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100400461B1 (ko) * | 2001-05-23 | 2003-10-01 | 엘지전자 주식회사 | 수직 노광 작업을 위한 로딩/언로딩 장치 |
KR101117429B1 (ko) * | 2003-10-31 | 2012-04-16 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
KR101421915B1 (ko) * | 2004-06-09 | 2014-07-22 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
JP5305251B2 (ja) | 2009-01-28 | 2013-10-02 | 株式会社ニコン | アライメント方法、露光方法、電子デバイスの製造方法、アライメント装置及び露光装置 |
CN102483580B (zh) * | 2009-08-20 | 2015-04-01 | 株式会社尼康 | 物体处理装置、曝光装置及曝光方法、以及元件制造方法 |
JP2011135026A (ja) * | 2009-11-27 | 2011-07-07 | Disco Abrasive Syst Ltd | ワークユニットの保持方法および保持機構 |
US20120315113A1 (en) * | 2010-02-05 | 2012-12-13 | Tokyo Electron Limited | Substrate holder, substrate transfer apparatus, and substrate processing apparatus |
CN102563330B (zh) * | 2010-12-30 | 2016-07-06 | 上海微电子装备有限公司 | 工件台安全保护装置 |
CN106098605B (zh) * | 2016-06-20 | 2018-12-28 | 惠州市长盛俊电子有限公司 | 一种集成电路检测线上的导向装置 |
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- 2017-05-31 CN CN201710399702.5A patent/CN108983552B/zh active Active
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- 2018-05-25 WO PCT/CN2018/088335 patent/WO2018219217A1/zh active Application Filing
- 2018-05-25 KR KR1020197038972A patent/KR102314620B1/ko active IP Right Grant
- 2018-05-25 TW TW107118047A patent/TWI661278B/zh active
- 2018-05-25 US US16/618,317 patent/US10895814B2/en active Active
- 2018-05-25 JP JP2019564522A patent/JP7011670B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51103265U (ja) * | 1975-02-18 | 1976-08-18 | ||
JP2001018232A (ja) * | 1999-07-09 | 2001-01-23 | Mitsubishi Heavy Ind Ltd | エア浮上式金型交換搬送装置 |
CN101609263A (zh) * | 2009-07-22 | 2009-12-23 | 上海微电子装备有限公司 | 光刻机硅片台移动装置及采用该移动装置的光刻机 |
CN102830591A (zh) * | 2011-06-17 | 2012-12-19 | 上海微电子装备有限公司 | 光刻机硅片台驱动装置 |
WO2018059377A1 (zh) * | 2016-09-30 | 2018-04-05 | 上海微电子装备(集团)股份有限公司 | 一种工件台移入移出装置 |
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Publication number | Publication date |
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TW201903537A (zh) | 2019-01-16 |
CN108983552A (zh) | 2018-12-11 |
US10895814B2 (en) | 2021-01-19 |
JP7011670B2 (ja) | 2022-01-26 |
CN108983552B (zh) | 2020-01-24 |
WO2018219217A1 (zh) | 2018-12-06 |
US20200117103A1 (en) | 2020-04-16 |
TWI661278B (zh) | 2019-06-01 |
KR20200012977A (ko) | 2020-02-05 |
KR102314620B1 (ko) | 2021-10-18 |
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