JP2020521060A5 - - Google Patents
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- Publication number
- JP2020521060A5 JP2020521060A5 JP2020515821A JP2020515821A JP2020521060A5 JP 2020521060 A5 JP2020521060 A5 JP 2020521060A5 JP 2020515821 A JP2020515821 A JP 2020515821A JP 2020515821 A JP2020515821 A JP 2020515821A JP 2020521060 A5 JP2020521060 A5 JP 2020521060A5
- Authority
- JP
- Japan
- Prior art keywords
- noble metal
- salt formulation
- organic
- metal salt
- aqueous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2017/062434 WO2018215057A1 (en) | 2017-05-23 | 2017-05-23 | Noble metal salt preparation, a method for production thereof and use for electroplating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020521060A JP2020521060A (ja) | 2020-07-16 |
| JP2020521060A5 true JP2020521060A5 (https=) | 2020-08-27 |
Family
ID=58772561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020515821A Pending JP2020521060A (ja) | 2017-05-23 | 2017-05-23 | 貴金属塩調合物、それの製造方法及び電気メッキのための使用 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20200095693A1 (https=) |
| EP (1) | EP3443146B1 (https=) |
| JP (1) | JP2020521060A (https=) |
| KR (1) | KR20200010340A (https=) |
| CN (1) | CN110770371A (https=) |
| ES (1) | ES2773771T3 (https=) |
| WO (1) | WO2018215057A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3960898A1 (en) * | 2020-08-31 | 2022-03-02 | Atotech Deutschland GmbH & Co. KG | Compostion for depositing a palladium coating on a substrate |
| CN113897603B (zh) * | 2021-08-31 | 2023-09-05 | 信丰正天伟电子科技有限公司 | 一种耐腐蚀钯类化学镀液及其应用 |
| JP2023168652A (ja) * | 2022-05-16 | 2023-11-29 | 三菱マテリアル株式会社 | 電解金めっき液及びその製造方法並びに該めっき液を用いためっき方法 |
| JP7607180B1 (ja) * | 2024-07-17 | 2024-12-26 | 田中貴金属工業株式会社 | 金めっき方法、金めっき用組成物及びめっき液 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4663005A (en) * | 1985-11-15 | 1987-05-05 | Edson Gwynne I | Electropolishing process |
| JPS6324089A (ja) * | 1986-07-16 | 1988-02-01 | Tanaka Kikinzoku Kogyo Kk | 金の電解液 |
| US5302278A (en) | 1993-02-19 | 1994-04-12 | Learonal, Inc. | Cyanide-free plating solutions for monovalent metals |
| JP3365866B2 (ja) | 1994-08-01 | 2003-01-14 | 荏原ユージライト株式会社 | 非シアン性貴金属めっき浴 |
| US6251249B1 (en) | 1996-09-20 | 2001-06-26 | Atofina Chemicals, Inc. | Precious metal deposition composition and process |
| DE19928047A1 (de) | 1999-06-19 | 2000-12-21 | Gerhard Hoffacker | Schadstoffarme bis schadstoffreie wäßrige Systeme zur galvanischen Abscheidung von Edelmetallen und Edelmetall-Legierungen |
| JP3697181B2 (ja) * | 2001-07-27 | 2005-09-21 | 日本高純度化学株式会社 | 無電解金メッキ液 |
| KR100442519B1 (ko) * | 2002-04-09 | 2004-07-30 | 삼성전기주식회사 | 모듈화 인쇄회로기판의 표면처리용 합금 도금액 |
| JP2009191335A (ja) * | 2008-02-15 | 2009-08-27 | Ishihara Chem Co Ltd | めっき液及び電子部品 |
| DE102009024396A1 (de) | 2009-06-09 | 2010-12-16 | Coventya Spa | Cyanid-freier Elektrolyt zur galvanischen Abscheidung von Gold oder dessen Legierungen |
| TWI426157B (zh) * | 2011-05-18 | 2014-02-11 | 優勝奈米科技有限公司 | 剝金組成物以及使用方法 |
| JP5622678B2 (ja) * | 2011-07-14 | 2014-11-12 | 石原ケミカル株式会社 | イミダゾール環結合型オキシアルキレン化合物を含有するメッキ浴 |
| DE102012004348B4 (de) * | 2012-03-07 | 2014-01-09 | Umicore Galvanotechnik Gmbh | Verwendung von organischen Thioharnstoffverbindungen zur Erhöhung der galvanischen Abscheiderate von Gold und Goldlegierungen |
| JP6198343B2 (ja) | 2012-10-04 | 2017-09-20 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | ノンシアン系電解金めっき液 |
| DE102013215476B3 (de) | 2013-08-06 | 2015-01-08 | Umicore Galvanotechnik Gmbh | Elektrolyt zur elektrolytischen Abscheidung von Silber-Palladium-Legierungen und Verfahren zu deren Abscheidung |
| CN105316718A (zh) | 2014-07-31 | 2016-02-10 | 无锡永发电镀有限公司 | 一种亚硫酸盐无氰镀金的电镀液及电镀方法 |
| KR101733119B1 (ko) | 2014-08-25 | 2017-05-08 | 고지마 가가쿠 야쿠힌 가부시키가이샤 | 환원형 무전해 금도금액 및 그 도금액을 이용한 무전해 금도금 방법 |
| PL3159435T3 (pl) * | 2015-10-21 | 2018-10-31 | Umicore Galvanotechnik Gmbh | Dodatek do elektrolitów do stopu srebro-palladowego |
-
2017
- 2017-05-23 CN CN201780091162.2A patent/CN110770371A/zh not_active Withdrawn
- 2017-05-23 ES ES17725581T patent/ES2773771T3/es active Active
- 2017-05-23 WO PCT/EP2017/062434 patent/WO2018215057A1/en not_active Ceased
- 2017-05-23 US US16/616,225 patent/US20200095693A1/en not_active Abandoned
- 2017-05-23 JP JP2020515821A patent/JP2020521060A/ja active Pending
- 2017-05-23 EP EP17725581.7A patent/EP3443146B1/en active Active
- 2017-05-23 KR KR1020197037164A patent/KR20200010340A/ko not_active Withdrawn
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