JP2020517104A - アライナ装置及び方法 - Google Patents
アライナ装置及び方法 Download PDFInfo
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- JP2020517104A JP2020517104A JP2019554970A JP2019554970A JP2020517104A JP 2020517104 A JP2020517104 A JP 2020517104A JP 2019554970 A JP2019554970 A JP 2019554970A JP 2019554970 A JP2019554970 A JP 2019554970A JP 2020517104 A JP2020517104 A JP 2020517104A
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- workpiece
- aligner
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- gripping element
- edge gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Orthopedics, Nursing, And Contraception (AREA)
Abstract
Description
Claims (15)
- X−Y平面に延びる第1の端及び第2の端を有するアームを含むアライナチャックと、
ワークピースをそのエッジで保持するために離間している、前記第1の端の第1のエッジ把持要素及び前記第2の端の第2のエッジ把持要素と、
前記アームの中央領域に位置する中央ワークピースハンドリング要素であって、前記中央ワークピースハンドリング要素が前記第1のエッジ把持要素及び前記第2のエッジ把持要素よりもZ方向に高く延びるように、前記Z方向に高さを有する中央ワークピースハンドリング要素と
を含むワークピースアライナ装置。 - 前記装置が、前記ワークピースを前記アームから持ち上げるための別個のワークピースリフティング機構を含まない、請求項1に記載のワークピースアライナ装置。
- 前記第1のエッジ把持要素及び前記第2のエッジ把持要素が、平らな中実のワークピース又は中央開口部を内部に有する平らなワークピースのいずれかを保持するように構成される、請求項2に記載のワークピースアライナ装置。
- 前記中央ワークピースハンドリング要素が、平らな中実のワークピースを保持するように構成されるが、中央開口部を内部に有する平らなワークピースを保持するようには構成されない、請求項3に記載のワークピースアライナ装置。
- 前記中央ワークピースハンドリング要素が平らな中実のワークピースを保持しているとき、前記平らな中実のワークピースが、前記第1のエッジ把持要素及び前記第2のエッジ把持要素に接触しない、請求項4に記載のワークピースアライナ装置。
- 前記アームの回転を制御するコントローラを更に含む、請求項5に記載のワークピースアライナ装置。
- 前記コントローラは、ロボットブレードが前記第1のエッジ把持要素及び前記第2のエッジ把持要素によって保持される前記ワークピースを積載することができる第1の位置まで前記アームを回転させるように構成される、請求項6に記載のワークピースアライナ装置。
- 前記コントローラは、前記第1のエッジ把持要素及び前記第2のエッジ把持要素が、前記ロボットブレードと干渉するだろう第2の位置にあるとき、前記ロボットブレードが前記ワークピースを積載するのを防ぐように構成される、請求項7に記載のワークピースアライナ装置。
- 前記第1の位置及び前記第2の位置を記憶するメモリを更に含む、請求項8に記載のワークピースアライナ装置。
- アライナ装置でワークピースを処理する方法であって、
ロボットブレード上のワークピースを移動し、前記ロボットブレードを、第1の端及び前記第1の端の反対側の第2の端を有するアームを含むアライナチャックに向かって移動することであって、前記第1の端の第1のエッジ把持要素及び前記第2の端の第2のエッジ把持要素が前記ワークピースをそのエッジで保持するために離間しており、前記アームが、前記ワークピースの前記アライナチャックへの積載を許可する第1の半径方向の位置、及び前記ワークピースの前記アライナチャックへの積載を許可しない第2の半径方向の位置から移動可能である、ロボットブレード上のワークピースを移動し、ロボットブレードを、第1の端及び第1の端の反対側の第2の端を有するアームを含むアライナチャックに向かって移動することと、
前記アームが前記第1の半径方向の位置にあるか前記第2の半径方向の位置にあるかを確認することと、
前記アームが前記第1の半径方向の位置にあるときに、前記アライナチャックに前記ワークピースを積載することと
を含む方法。 - 前記アライナチャックに前記ワークピースを積載した後に前記アームを回転させて、前記ワークピースを位置合わせすることを更に含む、請求項10に記載の方法。
- 前記アームが前記第2の半径方向の位置にあるときに、前記ロボットブレードが前記アライナチャックに前記ワークピースを積載するのを防ぐことを更に含む、請求項10に記載の方法。
- 前記アームが前記第1の半径方向の位置に入るまで前記アームを回転させ、次いで前記アームが前記第1の半径方向の位置にあるときに、前記アライナチャックに前記ワークピースを積載することを更に含む、請求項10に記載の方法。
- 前記ワークピースを位置合わせすること
を更に含む、請求項13に記載の方法。 - 前記ワークピースがキャリア上のEUVレチクルブランクである、請求項14に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/481,679 US10522381B2 (en) | 2017-04-07 | 2017-04-07 | Aligner apparatus and methods |
US15/481,679 | 2017-04-07 | ||
PCT/US2018/025001 WO2018187137A1 (en) | 2017-04-07 | 2018-03-29 | Aligner apparatus and methods |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2020517104A true JP2020517104A (ja) | 2020-06-11 |
JP2020517104A5 JP2020517104A5 (ja) | 2021-05-06 |
JP7169987B2 JP7169987B2 (ja) | 2022-11-11 |
Family
ID=63711229
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019554970A Active JP7169987B2 (ja) | 2017-04-07 | 2018-03-29 | アライナ装置及び方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10522381B2 (ja) |
JP (1) | JP7169987B2 (ja) |
KR (1) | KR102493387B1 (ja) |
CN (1) | CN110582844B (ja) |
SG (1) | SG11201909298UA (ja) |
TW (1) | TWI751309B (ja) |
WO (1) | WO2018187137A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11047795B2 (en) * | 2019-06-03 | 2021-06-29 | Formfactor, Inc. | Calibration chucks for optical probe systems, optical probe systems including the calibration chucks, and methods of utilizing the optical probe systems |
JP7454959B2 (ja) * | 2020-03-03 | 2024-03-25 | 東京エレクトロン株式会社 | 基板搬送システムおよび大気搬送モジュール |
WO2021245956A1 (ja) * | 2020-06-05 | 2021-12-09 | ローツェ株式会社 | ウエハ搬送装置、およびウエハ搬送方法 |
JP2022104056A (ja) * | 2020-12-28 | 2022-07-08 | 東京エレクトロン株式会社 | 搬送装置 |
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JPH08181098A (ja) * | 1994-07-01 | 1996-07-12 | Ontrak Syst Inc | 基板ホルダ |
JP2001093828A (ja) * | 2000-07-14 | 2001-04-06 | Tokyo Electron Ltd | 処理システム |
JP2003100850A (ja) * | 2001-09-21 | 2003-04-04 | Assist Japan Kk | ウェハのアライナー装置 |
JP2005039046A (ja) * | 2003-07-14 | 2005-02-10 | Kawasaki Heavy Ind Ltd | エッジ保持アライナ |
JP2009515318A (ja) * | 2005-07-11 | 2009-04-09 | ブルックス オートメーション インコーポレイテッド | 高速基板配列装置 |
JP2010512025A (ja) * | 2006-12-06 | 2010-04-15 | アクセリス テクノロジーズ, インコーポレイテッド | 高生産性ウエハ連続処理末端装置 |
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US20030053904A1 (en) * | 2001-09-14 | 2003-03-20 | Naofumi Kirihata | Wafer aligner |
JP3674864B2 (ja) * | 2003-03-25 | 2005-07-27 | 忠素 玉井 | 真空処理装置 |
US7019817B2 (en) * | 2003-07-14 | 2006-03-28 | Kawasaki Jukogyo Kabuishiki Kaisha | Edge-holding aligner |
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JP2013006222A (ja) * | 2009-10-14 | 2013-01-10 | Rorze Corp | 薄板状物の把持装置、および薄板状物の把持方法 |
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-
2017
- 2017-04-07 US US15/481,679 patent/US10522381B2/en active Active
-
2018
- 2018-03-22 TW TW107109746A patent/TWI751309B/zh active
- 2018-03-29 JP JP2019554970A patent/JP7169987B2/ja active Active
- 2018-03-29 CN CN201880028467.3A patent/CN110582844B/zh active Active
- 2018-03-29 SG SG11201909298U patent/SG11201909298UA/en unknown
- 2018-03-29 WO PCT/US2018/025001 patent/WO2018187137A1/en active Application Filing
- 2018-03-29 KR KR1020197032802A patent/KR102493387B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08181098A (ja) * | 1994-07-01 | 1996-07-12 | Ontrak Syst Inc | 基板ホルダ |
JP2001093828A (ja) * | 2000-07-14 | 2001-04-06 | Tokyo Electron Ltd | 処理システム |
JP2003100850A (ja) * | 2001-09-21 | 2003-04-04 | Assist Japan Kk | ウェハのアライナー装置 |
JP2005039046A (ja) * | 2003-07-14 | 2005-02-10 | Kawasaki Heavy Ind Ltd | エッジ保持アライナ |
JP2009515318A (ja) * | 2005-07-11 | 2009-04-09 | ブルックス オートメーション インコーポレイテッド | 高速基板配列装置 |
JP2010512025A (ja) * | 2006-12-06 | 2010-04-15 | アクセリス テクノロジーズ, インコーポレイテッド | 高生産性ウエハ連続処理末端装置 |
Also Published As
Publication number | Publication date |
---|---|
SG11201909298UA (en) | 2019-11-28 |
TW201903934A (zh) | 2019-01-16 |
US20180294175A1 (en) | 2018-10-11 |
CN110582844B (zh) | 2023-08-22 |
KR102493387B1 (ko) | 2023-01-27 |
KR20190128742A (ko) | 2019-11-18 |
JP7169987B2 (ja) | 2022-11-11 |
TWI751309B (zh) | 2022-01-01 |
US10522381B2 (en) | 2019-12-31 |
WO2018187137A1 (en) | 2018-10-11 |
CN110582844A (zh) | 2019-12-17 |
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