JP2020511791A - 変換材料 - Google Patents
変換材料 Download PDFInfo
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- JP2020511791A JP2020511791A JP2019549393A JP2019549393A JP2020511791A JP 2020511791 A JP2020511791 A JP 2020511791A JP 2019549393 A JP2019549393 A JP 2019549393A JP 2019549393 A JP2019549393 A JP 2019549393A JP 2020511791 A JP2020511791 A JP 2020511791A
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- 239000000463 material Substances 0.000 title claims abstract description 133
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 76
- 239000011159 matrix material Substances 0.000 claims abstract description 26
- 230000027756 respiratory electron transport chain Effects 0.000 claims abstract description 6
- 239000002245 particle Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 19
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 12
- 229910021389 graphene Inorganic materials 0.000 claims description 11
- 230000005611 electricity Effects 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 8
- 238000007711 solidification Methods 0.000 claims description 8
- 230000008023 solidification Effects 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000002800 charge carrier Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 238000005325 percolation Methods 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000002322 conducting polymer Substances 0.000 claims 1
- 229920001940 conductive polymer Polymers 0.000 claims 1
- 229920000547 conjugated polymer Polymers 0.000 claims 1
- 239000012705 liquid precursor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 description 20
- 239000000956 alloy Substances 0.000 description 20
- 230000000694 effects Effects 0.000 description 14
- 238000005304 joining Methods 0.000 description 11
- 238000009792 diffusion process Methods 0.000 description 8
- 239000002131 composite material Substances 0.000 description 7
- 238000001338 self-assembly Methods 0.000 description 7
- 230000006870 function Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000002086 nanomaterial Substances 0.000 description 4
- 238000010248 power generation Methods 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
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- 238000005476 soldering Methods 0.000 description 2
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- 238000002490 spark plasma sintering Methods 0.000 description 2
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- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 241000270728 Alligator Species 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
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- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000008571 general function Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
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- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002073 nanorod Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000010094 polymer processing Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 230000005676 thermoelectric effect Effects 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/856—Thermoelectric active materials comprising organic compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/854—Thermoelectric active materials comprising inorganic compositions comprising only metals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/855—Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/857—Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K2003/0856—Iron
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Abstract
Description
マトリックス材料(またはその前駆体)の用意、
第2相の材料とマトリックス材料(またはその前駆体)との混合、および
好ましくは直流電流を印加することによる、電子などの電荷キャリアの電位差を印加しながらの混合物の固化。
[イグネオ電気変換材料の調製]
(実施例1)
Claims (13)
- マトリックスを提供する第1相と、
電子の移動を提供するナノスケールまたはマイクロスケール材料を含み、アスペクト比が1より大きい粒子を含む第2相を含む(熱から電気への)エネルギー変換材料であって、
第2相は組成物全体に導電チャネルを提供し、
第2相はバーブドテンドリルを含み、前記のバーブが略同一方向に配向してなるエネルギー変換材料。 - 前記第1相は、ポリマーなどの絶縁体を含む、請求項1に記載の変換材料。
- 前記第2相は、半導体材料または導電材料を含む、請求項1または2に記載の変換材料。
- 前記半導体材料は、カーボンナノチューブおよびグラフェンなどの材料から選択され、
前記導電材料は、金、銀、銅、および鉄などの金属、共役ポリマー、または定常構造内で電荷キャリアが自由に移動する材料から選択される、請求項3に記載の変換材料。 - 前記マトリックス相は、非導電性ポリマー、好ましくはアクリルポリマーを含む、前記請求項のいずれか一項に記載の変換材料。
- 前記第2相は、100μm以下の寸法を有する粒子を含む、請求項1〜5のいずれか一項に記載の変換材料。
- 第1相の材料溶液を第2相の材料と混合し、電流を印加しながら混合物を固化することを含む方法により得られる、請求項1〜6のいずれか一項に記載の変換材料。
- アクリルポリマーのマトリックス相と、その中に分散されたグラフェンフレークとを第2相として含む、請求項1〜7のいずれか一項に記載の変換材料。
- 請求項1〜8のいずれか一項に記載の変換材料と、2つの電極とを含む変換素子。
- 請求項9に記載の変換素子を含む変換モジュール。
- 請求項9に記載の変換素子を含む発電機。
- マトリックス相の液状前駆体の調製、
これと第2相の材料との混合、および
混合物の固化を含み、
固化中に直流電流を印加する、
請求項1〜8に記載の変換材料の製造方法。 - 前記第2相の重量含有量が、パーコレーションチャネルを確立するのに必要な量以上である、請求項12に記載の変換材料の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP17000385.9 | 2017-03-09 | ||
EP17000385.9A EP3373347A1 (en) | 2017-03-09 | 2017-03-09 | Conversion material |
PCT/EP2018/055890 WO2018162708A1 (en) | 2017-03-09 | 2018-03-09 | Conversion material |
Publications (2)
Publication Number | Publication Date |
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JP2020511791A true JP2020511791A (ja) | 2020-04-16 |
JP6975248B2 JP6975248B2 (ja) | 2021-12-01 |
Family
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Family Applications (1)
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Country Status (19)
Country | Link |
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US (1) | US10950775B2 (ja) |
EP (2) | EP3373347A1 (ja) |
JP (1) | JP6975248B2 (ja) |
KR (1) | KR102135539B1 (ja) |
AU (1) | AU2018231592B2 (ja) |
CA (1) | CA3055476A1 (ja) |
CY (1) | CY1122420T1 (ja) |
DK (1) | DK3398212T3 (ja) |
ES (1) | ES2759497T3 (ja) |
HR (1) | HRP20192231T1 (ja) |
HU (1) | HUE047892T2 (ja) |
IL (1) | IL269167B (ja) |
PL (1) | PL3398212T3 (ja) |
PT (1) | PT3398212T (ja) |
RS (1) | RS59726B1 (ja) |
RU (1) | RU2733815C1 (ja) |
SI (1) | SI3398212T1 (ja) |
TW (1) | TWI753126B (ja) |
WO (1) | WO2018162708A1 (ja) |
Families Citing this family (1)
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EP3373347A1 (en) | 2017-03-09 | 2018-09-12 | Riccardo Raccis | Conversion material |
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WO2010010783A1 (ja) * | 2008-07-22 | 2010-01-28 | コニカミノルタホールディングス株式会社 | 熱電変換素子 |
JP2010027895A (ja) * | 2008-07-22 | 2010-02-04 | Konica Minolta Holdings Inc | 熱電変換素子 |
JP2010095688A (ja) * | 2008-10-20 | 2010-04-30 | Three M Innovative Properties Co | 導電性高分子複合体及び導電性高分子材料を用いた熱電素子 |
JP2010515227A (ja) * | 2006-12-27 | 2010-05-06 | デイヴィッド・ブルース・ジオヒーガン | 透明導電性ナノ複合体 |
JP2011101047A (ja) * | 2002-09-30 | 2011-05-19 | Nanosys Inc | 大面積ナノ可能マクロエレクトロニクス基板およびその使用 |
WO2013047253A1 (ja) * | 2011-09-27 | 2013-04-04 | 日本電気株式会社 | 熱電変換素子及びその製造方法 |
JP2016058475A (ja) * | 2014-09-08 | 2016-04-21 | 富士フイルム株式会社 | 熱電変換素子 |
JP2016513369A (ja) * | 2013-02-14 | 2016-05-12 | ザ・ユニバーシティ・オブ・マンチェスターThe University Of Manchester | グラフェンを含む熱電材料およびデバイス |
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ES2759497T3 (es) | 2020-05-11 |
RU2733815C1 (ru) | 2020-10-07 |
KR20190121374A (ko) | 2019-10-25 |
SI3398212T1 (sl) | 2020-01-31 |
PT3398212T (pt) | 2020-01-06 |
EP3398212A1 (en) | 2018-11-07 |
US20200035895A1 (en) | 2020-01-30 |
PL3398212T3 (pl) | 2020-04-30 |
IL269167A (en) | 2019-11-28 |
RS59726B1 (sr) | 2020-02-28 |
CY1122420T1 (el) | 2021-01-27 |
AU2018231592A1 (en) | 2019-10-31 |
CA3055476A1 (en) | 2018-09-13 |
DK3398212T3 (da) | 2019-12-16 |
JP6975248B2 (ja) | 2021-12-01 |
EP3373347A1 (en) | 2018-09-12 |
TW201843851A (zh) | 2018-12-16 |
KR102135539B1 (ko) | 2020-07-17 |
US10950775B2 (en) | 2021-03-16 |
WO2018162708A1 (en) | 2018-09-13 |
AU2018231592B2 (en) | 2020-08-27 |
HUE047892T2 (hu) | 2020-05-28 |
IL269167B (en) | 2022-08-01 |
HRP20192231T1 (hr) | 2020-03-06 |
EP3398212B1 (en) | 2019-09-25 |
TWI753126B (zh) | 2022-01-21 |
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