JP2020511590A - ドーパント種をワークピース上に堆積する堆積方法、ドーパント種をワークピース内に注入する注入方法及びワークピースを処理するワークピース処理方法 - Google Patents
ドーパント種をワークピース上に堆積する堆積方法、ドーパント種をワークピース内に注入する注入方法及びワークピースを処理するワークピース処理方法 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/223—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
- H01L21/2236—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase from or into a plasma phase
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32422—Arrangement for selecting ions or species in the plasma
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
- H01J37/32706—Polarising the substrate
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/336—Changing physical properties of treated surfaces
- H01J2237/3365—Plasma source implantation
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- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
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Abstract
Description
Claims (15)
- ドーパント種をワークピース上に堆積する堆積方法であって、この堆積方法が、
ドーパント種を有する調整ガスをイオン源のプラズマチャンバ内に導入する工程及び
前記ドーパント種を個体形態で有するコーティングを前記プラズマチャンバの内面上に形成するために、前記調整ガスを前記プラズマチャンバ内でイオン化する工程
を有する調整処理を実行するステップと、
前記コーティングが形成された後に、前記ドーパント種を有さないワーキングガスを前記プラズマチャンバ内に導入する工程及び
前記プラズマチャンバ内で前記ワーキングガスをイオン化してイオンを生ぜしめるとともに前記コーティングをスパッタリングして、前記ドーパント種が前記ワークピース上に堆積されるようにする工程
を有する堆積処理を前記調整処理後に実行するステップと
を具える堆積方法。 - 請求項1に記載の堆積方法において、前記調整処理中は、前記ワークピースを前記プラズマチャンバ内に配置しないようにする堆積方法。
- 請求項1に記載の堆積方法において、前記ワーキングガスが不活性ガスを有するようにする堆積方法。
- ドーパント種をワークピース内に注入する注入方法であって、この注入方法が、
ドーパント種を有する調整ガスをイオン源のプラズマチャンバ内に導入する工程及び
前記ドーパント種を個体形態で有するコーティングを前記プラズマチャンバの内面上に形成するために、前記調整ガスを前記プラズマチャンバ内でイオン化する工程
を有する調整処理を実行するステップと、
前記ドーパント種が前記ワークピース上に堆積されるように前記コーティングをスパッタリングするステップと、
前記ドーパント種を前記ワークピース内に注入するステップと
を具える注入方法。 - 請求項4に記載の注入方法において、前記注入するステップが前記ワークピースを熱処理に曝す工程を有するようにする注入方法。
- 請求項5に記載の注入方法において、前記ワークピースを熱処理に曝す工程の前にこのワークピースの上にキャッピング層を堆積するようにする注入方法。
- 請求項4に記載の注入方法において、前記コーティングをスパッタリングするステップが、
前記ドーパント種を有さないワーキングガスを、前記コーティングが形成された後に前記プラズマチャンバ内に導入する工程及び
前記ワーキングガスを前記プラズマチャンバ内でイオン化してイオンを生ぜしめるとともに前記コーティングをスパッタリングして、前記ドーパント種が前記ワークピース上に堆積されるようにする工程
を有するようにする注入方法。 - 請求項7に記載の注入方法において、前記注入するステップが、前記ワーキングガスのイオンが前記ドーパント種を打ち込むように前記ワークピースを負にバイアスする工程を有するようにする注入方法。
- 請求項8に記載の注入方法において、この注入方法が更に、前記負にバイアスする工程の後に前記ワークピースを熱処理に曝す工程を有するようにする注入方法。
- 請求項9に記載の注入方法において、前記負にバイアスする工程の後で且つ前記熱処理に曝す工程の前に前記ワークピースの上にキャッピング層を堆積するようにする注入方法。
- 請求項7に記載の注入方法において、前記ワーキングガスが不活性ガスを有するようにする注入方法。
- ワークピースを処理するワークピース処理方法において、このワークピース処理方法が、
ワークピースをプラズマチャンバ内に配置する工程と、
前記ワークピースが前記プラズマチャンバ内に配置されている間に前記プラズマチャンバ内でワーキングガスを活性化することによりプラズマを生ぜしめ、このプラズマが前記プラズマチャンバの内面にコーティングされたドーパント種をスパッタリングさせるとともに前記ワークピース上に堆積させるようにする工程と
を有するワークピース処理方法。 - 請求項12に記載のワークピース処理方法において、前記ワーキングガスが不活性ガスを有するようにするワークピース処理方法。
- 請求項12に記載のワークピース処理方法において、このワークピース処理方法が更に、前記ワークピース上に堆積された前記ドーパント種を注入させる工程を有しているワークピース処理方法。
- 請求項12に記載のワークピース処理方法において、前記ワーキングガスは前記ドーパント種を有さないようにするワークピース処理方法。
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US201662419010P | 2016-11-08 | 2016-11-08 | |
US62/419,010 | 2016-11-08 | ||
US15/459,416 US10460941B2 (en) | 2016-11-08 | 2017-03-15 | Plasma doping using a solid dopant source |
US15/459,416 | 2017-03-15 | ||
PCT/US2017/052479 WO2018089104A1 (en) | 2016-11-08 | 2017-09-20 | Plasma doping using a solid dopant source |
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JP (1) | JP6915057B2 (ja) |
KR (1) | KR102319152B1 (ja) |
CN (1) | CN109923641B (ja) |
TW (1) | TWI749077B (ja) |
WO (1) | WO2018089104A1 (ja) |
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US20240006158A1 (en) * | 2022-06-30 | 2024-01-04 | Applied Materials, Inc. | Co-doping to control wet etch rate of fcvd oxide layers |
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DE19616627A1 (de) * | 1996-04-26 | 1997-11-06 | Dynamit Nobel Ag | Anzündmischungen |
JP4013674B2 (ja) * | 2002-07-11 | 2007-11-28 | 松下電器産業株式会社 | プラズマドーピング方法及び装置 |
TW200402769A (en) * | 2002-08-02 | 2004-02-16 | Varian Semiconductor Equipment | Removal of plasma deposited surface layers by dilution gas sputtering |
US20050260354A1 (en) * | 2004-05-20 | 2005-11-24 | Varian Semiconductor Equipment Associates, Inc. | In-situ process chamber preparation methods for plasma ion implantation systems |
CN101160643B (zh) * | 2005-05-12 | 2012-04-18 | 松下电器产业株式会社 | 等离子体掺入方法和等离子体掺入设备 |
US7323401B2 (en) * | 2005-08-08 | 2008-01-29 | Applied Materials, Inc. | Semiconductor substrate process using a low temperature deposited carbon-containing hard mask |
US7713757B2 (en) | 2008-03-14 | 2010-05-11 | Applied Materials, Inc. | Method for measuring dopant concentration during plasma ion implantation |
US7858503B2 (en) * | 2009-02-06 | 2010-12-28 | Applied Materials, Inc. | Ion implanted substrate having capping layer and method |
US8501605B2 (en) * | 2011-03-14 | 2013-08-06 | Applied Materials, Inc. | Methods and apparatus for conformal doping |
KR101325773B1 (ko) | 2011-10-20 | 2013-11-04 | 한양대학교 산학협력단 | 플라즈마 이온 주입 공정 이온 도즈량 모니터링 방법 |
US9006065B2 (en) | 2012-10-09 | 2015-04-14 | Advanced Ion Beam Technology, Inc. | Plasma doping a non-planar semiconductor device |
US8889534B1 (en) * | 2013-05-29 | 2014-11-18 | Tokyo Electron Limited | Solid state source introduction of dopants and additives for a plasma doping process |
US9524849B2 (en) * | 2013-07-18 | 2016-12-20 | Varian Semiconductor Equipment Associates, Inc. | Method of improving ion beam quality in an implant system |
US9034743B2 (en) * | 2013-07-18 | 2015-05-19 | Varian Semiconductor Equipment Associates, Inc. | Method for implant productivity enhancement |
US9384937B2 (en) * | 2013-09-27 | 2016-07-05 | Varian Semiconductor Equipment Associates, Inc. | SiC coating in an ion implanter |
CN105849869B (zh) * | 2013-11-26 | 2017-08-11 | 瓦里安半导体设备公司 | 处理工件的方法 |
US9677171B2 (en) * | 2014-06-06 | 2017-06-13 | Varian Semiconductor Equipment Associates, Inc. | Method of improving ion beam quality in a non-mass-analyzed ion implantation system |
US9397011B1 (en) * | 2015-04-13 | 2016-07-19 | Lam Research Corporation | Systems and methods for reducing copper contamination due to substrate processing chambers with components made of alloys including copper |
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KR102319152B1 (ko) | 2021-11-01 |
KR20190069589A (ko) | 2019-06-19 |
TWI749077B (zh) | 2021-12-11 |
TW201830458A (zh) | 2018-08-16 |
WO2018089104A1 (en) | 2018-05-17 |
JP6915057B2 (ja) | 2021-08-04 |
US10460941B2 (en) | 2019-10-29 |
CN109923641B (zh) | 2022-11-29 |
US20180130659A1 (en) | 2018-05-10 |
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