JP2020510311A - 反射終点検出を有するエッチング処理システム - Google Patents
反射終点検出を有するエッチング処理システム Download PDFInfo
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Abstract
Description
本出願は、2017年3月13日出願の「ETCH PROCESSING SYSTEM HAVING REFLECTIVE ENDPOINT DETECTION」と題する米国仮特許出願第62/470,850号の優先権を主張するものであり、開示内容の全てが、参照することにより本明細書に組み込まれる。本出願はまた、2017年4月10日出願の「ETCH PROCESSING SYSTEM HAVING REFLECTIVE ENDPOINT DETECTION」と題する米国仮特許出願第62/483,758号の優先権も主張するものであり、開示内容の全てが、参照することにより本明細書に組み込まれる。
Claims (15)
- エッチング処理システムであって、
基板支持部材の周囲にチャンバ本体を有するエッチングチャンバと、
前記基板支持部材の上のアライメント領域の方へ第1の光を放射する光源と、前記アライメント領域から前記第1の光の反射を受け取る光検出器と、を含む終点検出システムと
を備える、エッチング処理システム。 - 前記アライメント領域からの前記第1の光と第2の光の反射を結像させるカメラと、
前記チャンバ本体に装着され、前記アライメント領域の上のリッドウインドウを含むチャンバリッドであって、前記第1の光が前記リッドウインドウを通って前記アライメント領域の方へ伝わり、前記第1の光と前記第2の光の反射が前記リッドウインドウを通って前記光検出器と前記カメラの方へ伝わる、チャンバリッドと
を更に備える、請求項1に記載のエッチング処理システム。 - 前記第1の光を前記リッドウインドウを通して前記アライメント領域へ方向づけし、前記第1の光の反射を前記光検出器へ方向づけし、前記第1の光と前記第2の光の反射を前記カメラへ方向づけする集束光学部品を更に備える、請求項2に記載のエッチング処理システム。
- 前記集束光学部品は、前記第1の光を前記アライメント領域のビームスポット内に集束させる曲面ミラー又は複数のレンズのうちの一又は複数を含む、請求項3に記載のエッチング処理システム。
- 前記アライメント領域の前記ビームスポットのスポット配置を移動させるために、一又は複数の前記基板支持部材又は前記終点検出システムに動作可能に連結された調節機構を更に備える、請求項4に記載のエッチング処理システム。
- 前記集束光学部品は、前記第1の光と前記第2の光の反射を前記カメラへ方向づけする、前記カメラと前記リッドウインドウとの間のビームスプリッタを含む、請求項3に記載のエッチング処理システム。
- 前記第2の光を前記アライメント領域の方へ放射する第2の光源を更に備える、請求項2に記載のエッチング処理システム。
- 前記第1の光は前記基板支持部材の上面に対して直交するように前記アライメント領域の方へ伝わり、前記第2の光は前記上面に対して斜めに前記アライメント領域の方へ伝わる、請求項7に記載のエッチング処理システム。
- エッチングチャンバの基板支持部材上に基板を装着することであって、前記基板は、基層の上にエッチング層を有するアライメント領域と、前記エッチング層の上のパターンマスク層とを含み、前記パターンマスク層はアライメント開口部を含む、基板を装着することと、
前記アライメント領域の画像を見ること又は撮ることであって、前記画像は前記基板からのビームスポットの反射を含む、前記アライメント領域の画像を見ること又は撮ることと、
前記ビームスポットを前記アライメント開口部に対してアライメントすることと、
前記アライメント開口部を通る前記基層からの前記ビームスポットの反射に基づいて、エッチング処理の終点を決定することと
を含む方法。 - 前記アライメント開口部を通して前記エッチング層を、前記ビームスポットを前記アライメント開口部に対してアライメントした後に、前記エッチングチャンバによってエッチングすることを更に含む、請求項9に記載の方法。
- 終点検出システムの光源によって前記アライメント領域の方へ第1の光を放射することであって、前記ビームスポットは前記第1の光を含む、第1の光を放射することと、
第2の光源によって前記アライメント領域の方へ第2の光を放射することであって、前記画像は、前記アライメント領域からの前記第1の光と前記第2の光の反射の画像である、第2の光を放射することと
を更に含む、請求項10に記載の方法。 - 前記第1の光を基板上の前記ビームスポット内に集束させることを更に含む、請求項11に記載の方法。
- 前記第1の光を集束させることは、集束光学部品の曲面ミラー又は複数のレンズのうちの一又は複数によって行われる、請求項12に記載の方法。
- 前記エッチング処理の終点を決定することは、終点検出システムの光検出器によって前記ビームスポットの反射の大きさを検出することを含む、請求項9に記載の方法。
- 前記基板は前記パターンマスク層と前記基層との間にエッチング層を含み、前記終点を決定することは、前記エッチング層が前記アライメント開口部の下から除去された時点を検出することを含む、請求項14に記載の方法。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
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US201762470850P | 2017-03-13 | 2017-03-13 | |
US62/470,850 | 2017-03-13 | ||
US201762483758P | 2017-04-10 | 2017-04-10 | |
US62/483,758 | 2017-04-10 | ||
US15/909,650 US11022877B2 (en) | 2017-03-13 | 2018-03-01 | Etch processing system having reflective endpoint detection |
US15/909,650 | 2018-03-01 | ||
PCT/US2018/021082 WO2018169728A1 (en) | 2017-03-13 | 2018-03-06 | Etch processing system having reflective endpoint detection |
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JP7051888B2 JP7051888B2 (ja) | 2022-04-11 |
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JP (1) | JP7051888B2 (ja) |
KR (2) | KR102410496B1 (ja) |
CN (1) | CN110383449B (ja) |
TW (1) | TWI716672B (ja) |
WO (1) | WO2018169728A1 (ja) |
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JP2021077859A (ja) * | 2019-11-05 | 2021-05-20 | エスピーティーエス テクノロジーズ リミティド | リフレクトメトリ終了点イメージング装置及び方法 |
WO2024127987A1 (ja) * | 2022-12-13 | 2024-06-20 | 日新電機株式会社 | プラズマ処理装置、及びその処理方法 |
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JP7101577B2 (ja) * | 2018-09-21 | 2022-07-15 | 株式会社日本マイクロニクス | 検査方法及び検査システム |
CN112652566B (zh) * | 2020-12-30 | 2023-03-07 | 合肥晶合集成电路股份有限公司 | 一种集成电路的制备方法 |
US20230268235A1 (en) * | 2022-02-18 | 2023-08-24 | Applied Materials, Inc. | Endpoint detection in low open area and/or high aspect ratio etch applications |
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CN110383449B (zh) | 2023-06-27 |
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US20210263408A1 (en) | 2021-08-26 |
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US12007686B2 (en) | 2024-06-11 |
CN110383449A (zh) | 2019-10-25 |
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TW201843753A (zh) | 2018-12-16 |
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