US11615941B2
(en)
|
2009-05-01 |
2023-03-28 |
Advanced Energy Industries, Inc. |
System, method, and apparatus for controlling ion energy distribution in plasma processing systems
|
US9767988B2
(en)
|
2010-08-29 |
2017-09-19 |
Advanced Energy Industries, Inc. |
Method of controlling the switched mode ion energy distribution system
|
US9685297B2
(en)
|
2012-08-28 |
2017-06-20 |
Advanced Energy Industries, Inc. |
Systems and methods for monitoring faults, anomalies, and other characteristics of a switched mode ion energy distribution system
|
US10978955B2
(en)
|
2014-02-28 |
2021-04-13 |
Eagle Harbor Technologies, Inc. |
Nanosecond pulser bias compensation
|
US11539352B2
(en)
|
2013-11-14 |
2022-12-27 |
Eagle Harbor Technologies, Inc. |
Transformer resonant converter
|
US10020800B2
(en)
|
2013-11-14 |
2018-07-10 |
Eagle Harbor Technologies, Inc. |
High voltage nanosecond pulser with variable pulse width and pulse repetition frequency
|
CN109873621B
(zh)
|
2013-11-14 |
2023-06-16 |
鹰港科技有限公司 |
高压纳秒脉冲发生器
|
US10892140B2
(en)
*
|
2018-07-27 |
2021-01-12 |
Eagle Harbor Technologies, Inc. |
Nanosecond pulser bias compensation
|
US10483089B2
(en)
|
2014-02-28 |
2019-11-19 |
Eagle Harbor Technologies, Inc. |
High voltage resistive output stage circuit
|
US11430635B2
(en)
|
2018-07-27 |
2022-08-30 |
Eagle Harbor Technologies, Inc. |
Precise plasma control system
|
US11004660B2
(en)
|
2018-11-30 |
2021-05-11 |
Eagle Harbor Technologies, Inc. |
Variable output impedance RF generator
|
US10903047B2
(en)
|
2018-07-27 |
2021-01-26 |
Eagle Harbor Technologies, Inc. |
Precise plasma control system
|
US11824454B2
(en)
*
|
2016-06-21 |
2023-11-21 |
Eagle Harbor Technologies, Inc. |
Wafer biasing in a plasma chamber
|
US10373804B2
(en)
*
|
2017-02-03 |
2019-08-06 |
Applied Materials, Inc. |
System for tunable workpiece biasing in a plasma reactor
|
WO2018148182A1
(en)
|
2017-02-07 |
2018-08-16 |
Eagle Harbor Technologies, Inc. |
Transformer resonant converter
|
JP6902167B2
(ja)
|
2017-08-25 |
2021-07-14 |
イーグル ハーバー テクノロジーズ, インク.Eagle Harbor Technologies, Inc. |
ナノ秒パルスを使用する任意波形の発生
|
US10510575B2
(en)
|
2017-09-20 |
2019-12-17 |
Applied Materials, Inc. |
Substrate support with multiple embedded electrodes
|
US20190088518A1
(en)
*
|
2017-09-20 |
2019-03-21 |
Applied Materials, Inc. |
Substrate support with cooled and conducting pins
|
TWI744566B
(zh)
|
2017-11-17 |
2021-11-01 |
新加坡商Aes全球公司 |
用於在空間域和時間域上控制基板上的電漿處理之系統和方法,及相關的電腦可讀取媒體
|
TWI726258B
(zh)
|
2017-11-17 |
2021-05-01 |
新加坡商Aes全球公司 |
用於電漿處理之方法和系統以及相關的非暫時性電腦可讀取媒體
|
WO2019099937A1
(en)
|
2017-11-17 |
2019-05-23 |
Advanced Energy Industries, Inc. |
Improved application of modulating supplies in a plasma processing system
|
US10555412B2
(en)
|
2018-05-10 |
2020-02-04 |
Applied Materials, Inc. |
Method of controlling ion energy distribution using a pulse generator with a current-return output stage
|
US10607814B2
(en)
|
2018-08-10 |
2020-03-31 |
Eagle Harbor Technologies, Inc. |
High voltage switch with isolated power
|
US11222767B2
(en)
|
2018-07-27 |
2022-01-11 |
Eagle Harbor Technologies, Inc. |
Nanosecond pulser bias compensation
|
US11532457B2
(en)
|
2018-07-27 |
2022-12-20 |
Eagle Harbor Technologies, Inc. |
Precise plasma control system
|
US11302518B2
(en)
|
2018-07-27 |
2022-04-12 |
Eagle Harbor Technologies, Inc. |
Efficient energy recovery in a nanosecond pulser circuit
|
CN112805920A
(zh)
|
2018-08-10 |
2021-05-14 |
鹰港科技有限公司 |
用于rf等离子体反应器的等离子体鞘控制
|
US10991550B2
(en)
*
|
2018-09-04 |
2021-04-27 |
Lam Research Corporation |
Modular recipe controlled calibration (MRCC) apparatus used to balance plasma in multiple station system
|
US10703654B2
(en)
*
|
2018-11-07 |
2020-07-07 |
Pear Labs Llc |
Non-thermal multiple plasma gate devices
|
US11476145B2
(en)
|
2018-11-20 |
2022-10-18 |
Applied Materials, Inc. |
Automatic ESC bias compensation when using pulsed DC bias
|
CN113906677A
(zh)
|
2019-01-08 |
2022-01-07 |
鹰港科技有限公司 |
纳秒脉冲发生器电路中的高效能量恢复
|
US11955314B2
(en)
|
2019-01-09 |
2024-04-09 |
Tokyo Electron Limited |
Plasma processing apparatus
|
KR20200086826A
(ko)
*
|
2019-01-10 |
2020-07-20 |
삼성전자주식회사 |
플라즈마 처리 방법 및 플라즈마 처리 장치
|
WO2020154310A1
(en)
*
|
2019-01-22 |
2020-07-30 |
Applied Materials, Inc. |
Feedback loop for controlling a pulsed voltage waveform
|
US11508554B2
(en)
|
2019-01-24 |
2022-11-22 |
Applied Materials, Inc. |
High voltage filter assembly
|
NL2022999B1
(en)
*
|
2019-04-24 |
2020-11-02 |
Prodrive Tech Bv |
Voltage waveform generator for plasma processing apparatuses
|
US11488796B2
(en)
*
|
2019-04-24 |
2022-11-01 |
Applied Materials, Inc. |
Thermal break for high-frequency antennae
|
KR20220031713A
(ko)
|
2019-07-12 |
2022-03-11 |
에이이에스 글로벌 홀딩스 피티이 리미티드 |
단일 제어식 스위치를 갖는 바이어스 공급부
|
CN112466735A
(zh)
*
|
2019-09-09 |
2021-03-09 |
东京毅力科创株式会社 |
基片支承器和等离子体处理装置
|
US11043387B2
(en)
|
2019-10-30 |
2021-06-22 |
Applied Materials, Inc. |
Methods and apparatus for processing a substrate
|
TWI778449B
(zh)
|
2019-11-15 |
2022-09-21 |
美商鷹港科技股份有限公司 |
高電壓脈衝電路
|
KR20230150396A
(ko)
|
2019-12-24 |
2023-10-30 |
이글 하버 테크놀로지스, 인코포레이티드 |
플라즈마 시스템을 위한 나노초 펄서 rf 절연
|
CN110936596A
(zh)
*
|
2019-12-27 |
2020-03-31 |
河南先途智能科技有限公司 |
低温等离子技术处理鞋材表面的工艺方法
|
US11462389B2
(en)
|
2020-07-31 |
2022-10-04 |
Applied Materials, Inc. |
Pulsed-voltage hardware assembly for use in a plasma processing system
|
US11901157B2
(en)
|
2020-11-16 |
2024-02-13 |
Applied Materials, Inc. |
Apparatus and methods for controlling ion energy distribution
|
US11798790B2
(en)
|
2020-11-16 |
2023-10-24 |
Applied Materials, Inc. |
Apparatus and methods for controlling ion energy distribution
|
US11495470B1
(en)
|
2021-04-16 |
2022-11-08 |
Applied Materials, Inc. |
Method of enhancing etching selectivity using a pulsed plasma
|
US11948780B2
(en)
|
2021-05-12 |
2024-04-02 |
Applied Materials, Inc. |
Automatic electrostatic chuck bias compensation during plasma processing
|
US11791138B2
(en)
|
2021-05-12 |
2023-10-17 |
Applied Materials, Inc. |
Automatic electrostatic chuck bias compensation during plasma processing
|
US11967483B2
(en)
|
2021-06-02 |
2024-04-23 |
Applied Materials, Inc. |
Plasma excitation with ion energy control
|
US20220399185A1
(en)
|
2021-06-09 |
2022-12-15 |
Applied Materials, Inc. |
Plasma chamber and chamber component cleaning methods
|
US11810760B2
(en)
|
2021-06-16 |
2023-11-07 |
Applied Materials, Inc. |
Apparatus and method of ion current compensation
|
US11569066B2
(en)
|
2021-06-23 |
2023-01-31 |
Applied Materials, Inc. |
Pulsed voltage source for plasma processing applications
|
US11776788B2
(en)
|
2021-06-28 |
2023-10-03 |
Applied Materials, Inc. |
Pulsed voltage boost for substrate processing
|
US11476090B1
(en)
|
2021-08-24 |
2022-10-18 |
Applied Materials, Inc. |
Voltage pulse time-domain multiplexing
|
US12106938B2
(en)
|
2021-09-14 |
2024-10-01 |
Applied Materials, Inc. |
Distortion current mitigation in a radio frequency plasma processing chamber
|
US20230130986A1
(en)
*
|
2021-10-21 |
2023-04-27 |
Applied Materials, Inc. |
Plasma processing chambers configured for tunable substrate and edge sheath control
|
US11664195B1
(en)
|
2021-11-11 |
2023-05-30 |
Velvetch Llc |
DC plasma control for electron enhanced material processing
|
US11694876B2
(en)
|
2021-12-08 |
2023-07-04 |
Applied Materials, Inc. |
Apparatus and method for delivering a plurality of waveform signals during plasma processing
|
US11942309B2
(en)
|
2022-01-26 |
2024-03-26 |
Advanced Energy Industries, Inc. |
Bias supply with resonant switching
|
US11670487B1
(en)
|
2022-01-26 |
2023-06-06 |
Advanced Energy Industries, Inc. |
Bias supply control and data processing
|
US12046448B2
(en)
|
2022-01-26 |
2024-07-23 |
Advanced Energy Industries, Inc. |
Active switch on time control for bias supply
|
US11688588B1
(en)
|
2022-02-09 |
2023-06-27 |
Velvetch Llc |
Electron bias control signals for electron enhanced material processing
|
US11972924B2
(en)
|
2022-06-08 |
2024-04-30 |
Applied Materials, Inc. |
Pulsed voltage source for plasma processing applications
|
CN115159865B
(zh)
*
|
2022-07-26 |
2023-05-09 |
艾瑞森表面技术(苏州)股份有限公司 |
一种防眩光的表面处理方法
|
US11978613B2
(en)
|
2022-09-01 |
2024-05-07 |
Advanced Energy Industries, Inc. |
Transition control in a bias supply
|
US12111341B2
(en)
|
2022-10-05 |
2024-10-08 |
Applied Materials, Inc. |
In-situ electric field detection method and apparatus
|
US11869747B1
(en)
|
2023-01-04 |
2024-01-09 |
Velvetch Llc |
Atomic layer etching by electron wavefront
|
JP7508758B1
(ja)
|
2024-02-08 |
2024-07-02 |
京都電機器株式会社 |
プラズマエッチング装置用パルス電源装置及びパルス電圧生成方法
|