JP2020503459A5 - - Google Patents

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Publication number
JP2020503459A5
JP2020503459A5 JP2019535815A JP2019535815A JP2020503459A5 JP 2020503459 A5 JP2020503459 A5 JP 2020503459A5 JP 2019535815 A JP2019535815 A JP 2019535815A JP 2019535815 A JP2019535815 A JP 2019535815A JP 2020503459 A5 JP2020503459 A5 JP 2020503459A5
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JP
Japan
Prior art keywords
acid
ethylenediamine
hydroxyethyl
copper
complexing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019535815A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020503459A (ja
JP7138108B2 (ja
Filing date
Publication date
Priority claimed from FR1663525A external-priority patent/FR3061601B1/fr
Application filed filed Critical
Publication of JP2020503459A publication Critical patent/JP2020503459A/ja
Publication of JP2020503459A5 publication Critical patent/JP2020503459A5/ja
Application granted granted Critical
Publication of JP7138108B2 publication Critical patent/JP7138108B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019535815A 2016-12-29 2017-12-26 銅電着溶液及び高アスペクト比パターンのためのプロセス Active JP7138108B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1663525 2016-12-29
FR1663525A FR3061601B1 (fr) 2016-12-29 2016-12-29 Solution d'electrodeposition de cuivre et procede pour des motifs de facteur de forme eleve
PCT/EP2017/084580 WO2018122216A1 (en) 2016-12-29 2017-12-26 Copper electrodeposition solution and process for high aspect ratio patterns

Publications (3)

Publication Number Publication Date
JP2020503459A JP2020503459A (ja) 2020-01-30
JP2020503459A5 true JP2020503459A5 (enExample) 2020-10-22
JP7138108B2 JP7138108B2 (ja) 2022-09-15

Family

ID=59579658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019535815A Active JP7138108B2 (ja) 2016-12-29 2017-12-26 銅電着溶液及び高アスペクト比パターンのためのプロセス

Country Status (9)

Country Link
US (1) US10883185B2 (enExample)
EP (1) EP3562975A1 (enExample)
JP (1) JP7138108B2 (enExample)
KR (1) KR102562158B1 (enExample)
CN (1) CN110168146B (enExample)
FR (1) FR3061601B1 (enExample)
IL (1) IL267531A (enExample)
TW (1) TWI737880B (enExample)
WO (1) WO2018122216A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110724983B (zh) * 2019-10-12 2022-02-08 天津大学 一种利用脉冲电沉积法制备纳米铜包覆碳化钨核壳结构粉体的方法
CN111041533B (zh) * 2019-12-31 2021-06-29 苏州清飙科技有限公司 电镀纯钴用电镀液及其应用
CN111244547B (zh) * 2020-01-21 2021-09-17 四川虹微技术有限公司 一种含芳香肟类添加剂的电解液及其制备方法和用途
US12070609B2 (en) * 2020-07-30 2024-08-27 Medtronic, Inc. Electrical component and method of forming same
KR20240172193A (ko) 2022-04-05 2024-12-09 맥더미드 엔쏜 인코포레이티드 상향식 구리 전기도금을 위한 촉진제를 포함하는 전해질
JP2025137155A (ja) * 2024-03-08 2025-09-19 三菱マテリアル株式会社 酸性電解銅めっき液

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6897151B2 (en) * 2002-11-08 2005-05-24 Wayne State University Methods of filling a feature on a substrate with copper nanocrystals
US6897152B2 (en) 2003-02-05 2005-05-24 Enthone Inc. Copper bath composition for electroless and/or electrolytic filling of vias and trenches for integrated circuit fabrication
JP4650275B2 (ja) * 2004-08-10 2011-03-16 日立金属株式会社 銅めっき被膜を表面に有する希土類系永久磁石
FR2890983B1 (fr) 2005-09-20 2007-12-14 Alchimer Sa Composition d'electrodeposition destinee au revetement d'une surface d'un substrat par un metal.
FR2890984B1 (fr) * 2005-09-20 2009-03-27 Alchimer Sa Procede d'electrodeposition destine au revetement d'une surface d'un substrat par un metal.
US7579274B2 (en) 2006-02-21 2009-08-25 Alchimer Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices
CN101275255A (zh) * 2007-12-20 2008-10-01 广州市二轻工业科学技术研究所 一种碱性无氰镀铜的维护方法
EP2305856A1 (en) * 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Process for applying a metal coating to a non-conductive substrate
JP2013091820A (ja) * 2011-10-24 2013-05-16 Kanto Chem Co Inc 銅層および/または銅合金層を含む金属膜用エッチング液組成物およびそれを用いたエッチング方法
FR2995912B1 (fr) * 2012-09-24 2014-10-10 Alchimer Electrolyte et procede d'electrodeposition de cuivre sur une couche barriere
KR101493358B1 (ko) * 2013-07-16 2015-02-13 한국생산기술연구원 무전해 구리도금액을 이용한 구리 도금층 형성방법
EP3080340B1 (en) * 2013-12-09 2018-04-18 Aveni Copper electrodeposition bath containing an electrochemically inert cation
US9869026B2 (en) * 2014-07-15 2018-01-16 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions

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