JP2020503231A5 - - Google Patents

Download PDF

Info

Publication number
JP2020503231A5
JP2020503231A5 JP2019535251A JP2019535251A JP2020503231A5 JP 2020503231 A5 JP2020503231 A5 JP 2020503231A5 JP 2019535251 A JP2019535251 A JP 2019535251A JP 2019535251 A JP2019535251 A JP 2019535251A JP 2020503231 A5 JP2020503231 A5 JP 2020503231A5
Authority
JP
Japan
Prior art keywords
silicon
crucible
gallium
indium
resistivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019535251A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020503231A (ja
JP7365900B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2017/068632 external-priority patent/WO2018125958A1/en
Publication of JP2020503231A publication Critical patent/JP2020503231A/ja
Publication of JP2020503231A5 publication Critical patent/JP2020503231A5/ja
Priority to JP2022151550A priority Critical patent/JP2022180551A/ja
Application granted granted Critical
Publication of JP7365900B2 publication Critical patent/JP7365900B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2019535251A 2016-12-28 2017-12-28 改善された抵抗率制御により単結晶シリコンインゴットを形成する方法 Active JP7365900B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022151550A JP2022180551A (ja) 2016-12-28 2022-09-22 改善された抵抗率制御により単結晶シリコンインゴットを形成する方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662439743P 2016-12-28 2016-12-28
US62/439,743 2016-12-28
PCT/US2017/068632 WO2018125958A1 (en) 2016-12-28 2017-12-28 Methods for forming single crystal silicon ingots with improved resistivity control

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022151550A Division JP2022180551A (ja) 2016-12-28 2022-09-22 改善された抵抗率制御により単結晶シリコンインゴットを形成する方法

Publications (3)

Publication Number Publication Date
JP2020503231A JP2020503231A (ja) 2020-01-30
JP2020503231A5 true JP2020503231A5 (enExample) 2021-01-28
JP7365900B2 JP7365900B2 (ja) 2023-10-20

Family

ID=61007847

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019535251A Active JP7365900B2 (ja) 2016-12-28 2017-12-28 改善された抵抗率制御により単結晶シリコンインゴットを形成する方法
JP2022151550A Withdrawn JP2022180551A (ja) 2016-12-28 2022-09-22 改善された抵抗率制御により単結晶シリコンインゴットを形成する方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022151550A Withdrawn JP2022180551A (ja) 2016-12-28 2022-09-22 改善された抵抗率制御により単結晶シリコンインゴットを形成する方法

Country Status (5)

Country Link
US (2) US10920337B2 (enExample)
JP (2) JP7365900B2 (enExample)
CN (1) CN110382748B (enExample)
TW (1) TWI745520B (enExample)
WO (1) WO2018125958A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10793969B2 (en) 2018-06-27 2020-10-06 Globalwafers Co., Ltd. Sample rod growth and resistivity measurement during single crystal silicon ingot production
US10781532B2 (en) 2018-06-27 2020-09-22 Globalwafers Co., Ltd. Methods for determining the resistivity of a polycrystalline silicon melt
WO2020131458A1 (en) * 2018-12-21 2020-06-25 Globalwafers Co., Ltd. Sample rod center slab resistivity measurement during single crystal silicon ingot production
US11739437B2 (en) 2018-12-27 2023-08-29 Globalwafers Co., Ltd. Resistivity stabilization measurement of fat neck slabs for high resistivity and ultra-high resistivity single crystal silicon ingot growth
US11585010B2 (en) * 2019-06-28 2023-02-21 Globalwafers Co., Ltd. Methods for producing a single crystal silicon ingot using boric acid as a dopant and ingot puller apparatus that use a solid-phase dopant
US20220359195A1 (en) * 2021-05-05 2022-11-10 Globalwafers Co., Ltd. Methods for forming an epitaxial wafer
CN115341271A (zh) * 2021-05-13 2022-11-15 内蒙古中环协鑫光伏材料有限公司 一种控制单晶电阻率轴向衰减速率的方法
US20230112094A1 (en) * 2021-10-11 2023-04-13 Globalwafers Co., Ltd. Modeling thermal donor formation and target resistivity for single crystal silicon ingot production
US12351938B2 (en) 2022-02-10 2025-07-08 Globalwafers Co., Ltd. Methods for producing a product ingot having low oxygen content
CN114690643B (zh) * 2022-05-31 2022-08-23 广东高景太阳能科技有限公司 基于掺镓单晶中镓含量的电阻率控制方法、系统及设备
CN115233292A (zh) * 2022-07-25 2022-10-25 北京麦竹吉科技有限公司 一种低电阻率硅单晶及其制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2847544A (en) * 1955-12-16 1958-08-12 Gen Electric Silicon semiconductive devices
DE3049376A1 (de) 1980-12-29 1982-07-29 Heliotronic Forschungs- und Entwicklungsgesellschaft für Solarzellen-Grundstoffe mbH, 8263 Burghausen Verfahren zur herstellung vertikaler pn-uebergaenge beim ziehen von siliciumscheiben aus einer siliciumschmelze
JPH1029894A (ja) * 1996-07-15 1998-02-03 Hitachi Ltd 単結晶シリコンの比抵抗調整方法および単結晶シリコン製造装置
JP2002226295A (ja) 2001-01-31 2002-08-14 Shin Etsu Handotai Co Ltd チョクラルスキー法によるシリコン単結晶製造工程の管理方法及びチョクラルスキー法による高抵抗シリコン単結晶の製造方法並びにシリコン単結晶
US8021483B2 (en) * 2002-02-20 2011-09-20 Hemlock Semiconductor Corporation Flowable chips and methods for the preparation and use of same, and apparatus for use in the methods
US7635414B2 (en) 2003-11-03 2009-12-22 Solaicx, Inc. System for continuous growing of monocrystalline silicon
FR2929960B1 (fr) 2008-04-11 2011-05-13 Apollon Solar Procede de fabrication de silicium cristallin de qualite photovoltaique par ajout d'impuretes dopantes
CN103249875B (zh) * 2010-09-03 2016-10-12 Gtatip控股有限责任公司 镓、铟、或铝掺杂单晶硅
CN102181919B (zh) * 2011-04-13 2012-12-26 天津市环欧半导体材料技术有限公司 一种控制直拉硅单晶头部电阻率的方法
MY173316A (en) 2011-04-14 2020-01-15 Gtat Ip Holding Llc Silicon ingot having uniform multiple dopants and method and apparats for producing same
CN102260900B (zh) 2011-07-14 2013-11-27 西安华晶电子技术股份有限公司 提高单晶硅纵向电阻率一致性的装置及其处理工艺
US20130047913A1 (en) * 2011-08-29 2013-02-28 Max Era, Inc. Method and Apparatus for Doping by Lane in a Multi-Lane Sheet Wafer Furnace
JP5470349B2 (ja) * 2011-10-17 2014-04-16 ジルトロニック アクチエンゲゼルシャフト p型シリコン単結晶およびその製造方法
JP2016503964A (ja) * 2012-12-31 2016-02-08 エムイーエムシー・エレクトロニック・マテリアルズ・ソシエタ・ペル・アチオニMEMC Electronic Materials, SpA インジウムドープシリコンウェハおよびそれを用いた太陽電池セル
JP6168011B2 (ja) * 2014-08-19 2017-07-26 信越半導体株式会社 単結晶育成装置及びその装置を用いた単結晶育成方法
JP6222013B2 (ja) 2014-08-29 2017-11-01 信越半導体株式会社 抵抗率制御方法
CN105887194A (zh) * 2016-05-30 2016-08-24 上海超硅半导体有限公司 一种n型单晶硅的生长方法

Similar Documents

Publication Publication Date Title
JP2020503231A5 (enExample)
Zhao et al. Gamma prime coarsening and age-hardening behaviors in a new nickel base superalloy
JP6553286B2 (ja) 単結晶成長方法
Liu et al. The roles of grain orientation and grain boundary characteristics in the enhanced superelasticity of Cu71. 8Al17. 8Mn10. 4 shape memory alloys
JP2017528404A5 (enExample)
JP2014011293A5 (enExample)
JP6419811B2 (ja) インゴットにおけるウェハの位置を決定する方法
Gong et al. Characterization of defects in mono-like silicon wafers and their effects on solar cell efficiency
JP2013119486A5 (enExample)
JP2016500641A (ja) 一様な抵抗を有するドーピングされたシリコンインゴットを形成する方法
JP2016108159A (ja) シリコン結晶の炭素濃度測定方法
TW201024478A (en) Silicon wafer and method for producing the same
Schmid et al. The effect of the growth rate on the microstructure of multi-crystalline silicon
US20170342596A1 (en) Method for heat treatment of silicon single crystal wafer
TW201542847A (zh) 硼摻雜的n型矽靶材
JP2019114633A5 (enExample)
Ai et al. Influence of withdrawal rate on last stage solidification path of a Mo-rich Ni3Al based single crystal superalloy
Trempa et al. Dislocation formation in seed crystals induced by feedstock indentation during growth of quasimono crystalline silicon ingots
JP2016018927A5 (enExample)
JP2014518535A5 (enExample)
CN105900220B (zh) 单晶硅晶圆的热处理方法
WO2019167294A1 (ja) シリコンウェーハの反り量の予測方法およびシリコンウェーハの製造方法
CN102146581A (zh) 直径至少450mm的硅半导体晶片的制造方法及直径450mm的硅半导体晶片
Knörlein et al. Internal gettering of iron at extended defects
Hofstetter et al. Iron management in multicrystalline silicon through predictive simulation: point defects, precipitates, and structural defect interactions