JP2020192718A - セラミック成形体の分断方法 - Google Patents

セラミック成形体の分断方法 Download PDF

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Publication number
JP2020192718A
JP2020192718A JP2019099198A JP2019099198A JP2020192718A JP 2020192718 A JP2020192718 A JP 2020192718A JP 2019099198 A JP2019099198 A JP 2019099198A JP 2019099198 A JP2019099198 A JP 2019099198A JP 2020192718 A JP2020192718 A JP 2020192718A
Authority
JP
Japan
Prior art keywords
ceramic molded
molded body
dividing
break
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019099198A
Other languages
English (en)
Japanese (ja)
Inventor
武田　真和
Masakazu Takeda
真和 武田
百加 橋本
Momoka Hashimoto
百加 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2019099198A priority Critical patent/JP2020192718A/ja
Priority to TW109108560A priority patent/TW202042997A/zh
Priority to CN202010355272.9A priority patent/CN112008846A/zh
Priority to KR1020200053598A priority patent/KR20200136817A/ko
Publication of JP2020192718A publication Critical patent/JP2020192718A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/14—Apparatus or processes for treating or working the shaped or preshaped articles for dividing shaped articles by cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
JP2019099198A 2019-05-28 2019-05-28 セラミック成形体の分断方法 Pending JP2020192718A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019099198A JP2020192718A (ja) 2019-05-28 2019-05-28 セラミック成形体の分断方法
TW109108560A TW202042997A (zh) 2019-05-28 2020-03-16 陶瓷成型體的切割方法
CN202010355272.9A CN112008846A (zh) 2019-05-28 2020-04-29 陶瓷成型体的分割方法
KR1020200053598A KR20200136817A (ko) 2019-05-28 2020-05-06 세라믹 성형체의 분단방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019099198A JP2020192718A (ja) 2019-05-28 2019-05-28 セラミック成形体の分断方法

Publications (1)

Publication Number Publication Date
JP2020192718A true JP2020192718A (ja) 2020-12-03

Family

ID=73506601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019099198A Pending JP2020192718A (ja) 2019-05-28 2019-05-28 セラミック成形体の分断方法

Country Status (4)

Country Link
JP (1) JP2020192718A (ko)
KR (1) KR20200136817A (ko)
CN (1) CN112008846A (ko)
TW (1) TW202042997A (ko)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5060766A (ko) * 1973-09-28 1975-05-24
JPS5759705A (en) * 1980-09-30 1982-04-10 Ngk Spark Plug Co Method of cutting ceramic green sheet
JPS6129114A (ja) * 1984-07-18 1986-02-10 関西日本電気株式会社 積層セラミツク部品の製造方法
JPS6328607A (ja) * 1986-07-22 1988-02-06 株式会社クボタ 無機質板材の切断方法
JPH10156823A (ja) * 1996-11-29 1998-06-16 Kyocera Corp 分割溝を有するセラミック基板及びこれを用いた抵抗器
JP2003046206A (ja) * 2001-08-02 2003-02-14 Kyocera Corp 分割溝を有するセラミック基板及びその分割方法
JP2006326843A (ja) * 2005-05-23 2006-12-07 Murata Mfg Co Ltd セラミックグリーンブロックのカット装置およびカット方法
JP2009255504A (ja) * 2008-03-28 2009-11-05 Tokuyama Corp セラミックス基板
WO2014050884A1 (ja) * 2012-09-28 2014-04-03 株式会社アライドマテリアル 平刃状切断刃およびグリーンシート切断刃

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6039363B2 (ja) 2012-10-26 2016-12-07 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5060766A (ko) * 1973-09-28 1975-05-24
JPS5759705A (en) * 1980-09-30 1982-04-10 Ngk Spark Plug Co Method of cutting ceramic green sheet
JPS6129114A (ja) * 1984-07-18 1986-02-10 関西日本電気株式会社 積層セラミツク部品の製造方法
JPS6328607A (ja) * 1986-07-22 1988-02-06 株式会社クボタ 無機質板材の切断方法
JPH10156823A (ja) * 1996-11-29 1998-06-16 Kyocera Corp 分割溝を有するセラミック基板及びこれを用いた抵抗器
JP2003046206A (ja) * 2001-08-02 2003-02-14 Kyocera Corp 分割溝を有するセラミック基板及びその分割方法
JP2006326843A (ja) * 2005-05-23 2006-12-07 Murata Mfg Co Ltd セラミックグリーンブロックのカット装置およびカット方法
JP2009255504A (ja) * 2008-03-28 2009-11-05 Tokuyama Corp セラミックス基板
WO2014050884A1 (ja) * 2012-09-28 2014-04-03 株式会社アライドマテリアル 平刃状切断刃およびグリーンシート切断刃

Also Published As

Publication number Publication date
CN112008846A (zh) 2020-12-01
KR20200136817A (ko) 2020-12-08
TW202042997A (zh) 2020-12-01

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