JP2020189384A - 保持装置 - Google Patents
保持装置 Download PDFInfo
- Publication number
- JP2020189384A JP2020189384A JP2019096520A JP2019096520A JP2020189384A JP 2020189384 A JP2020189384 A JP 2020189384A JP 2019096520 A JP2019096520 A JP 2019096520A JP 2019096520 A JP2019096520 A JP 2019096520A JP 2020189384 A JP2020189384 A JP 2020189384A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- holding
- pressure
- holding table
- foreign matter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims abstract description 13
- 239000012530 fluid Substances 0.000 description 16
- 238000004140 cleaning Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Gripping On Spindles (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Dicing (AREA)
- Jigs For Machine Tools (AREA)
Abstract
Description
11a 表面
11b 裏面
13 分割予定ライン(ストリート)
15 デバイス
17 異物
2 保持装置(保持機構)
4 保持テーブル(保持手段)
4a 保持面
4b 凹部(吸引領域)
6 吸引路
8 バルブ
10 吸引源
12 バルブ
14 流体供給源
16 圧力測定器(圧力測定手段)
30 制御部(制御手段)
32 判定部
34 記憶部
Claims (1)
- 被加工物を保持する保持装置であって、
該被加工物を保持面で保持し、該保持面の該被加工物によって覆われる領域に形成された環状の吸引領域で該被加工物の外周領域を吸引する保持手段と、
該吸引領域と接続された吸引路の圧力を測定する圧力測定手段と、
該圧力測定手段によって測定された圧力が予め設定されたしきい値よりも低い場合は、該被加工物と該保持面との間に異物が存在しないと判定し、該圧力測定手段によって測定された圧力が該しきい値よりも高い場合は、該被加工物と該保持面との間に異物が存在すると判定する制御手段と、を備えることを特徴とする保持装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019096520A JP2020189384A (ja) | 2019-05-23 | 2019-05-23 | 保持装置 |
CN202010405783.7A CN111987033A (zh) | 2019-05-23 | 2020-05-14 | 保持装置 |
SG10202004614UA SG10202004614UA (en) | 2019-05-23 | 2020-05-18 | Holding apparatus |
TW109116507A TW202044481A (zh) | 2019-05-23 | 2020-05-19 | 保持裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019096520A JP2020189384A (ja) | 2019-05-23 | 2019-05-23 | 保持装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2020189384A true JP2020189384A (ja) | 2020-11-26 |
Family
ID=73441992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019096520A Pending JP2020189384A (ja) | 2019-05-23 | 2019-05-23 | 保持装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2020189384A (ja) |
CN (1) | CN111987033A (ja) |
SG (1) | SG10202004614UA (ja) |
TW (1) | TW202044481A (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020101596A1 (en) * | 2001-01-26 | 2002-08-01 | Samsung Electronics Co., Ltd. | Semiconductor wafer position detecting system, semiconductor device fabricating facility of using the same, and wafer position detecting method thereof |
-
2019
- 2019-05-23 JP JP2019096520A patent/JP2020189384A/ja active Pending
-
2020
- 2020-05-14 CN CN202010405783.7A patent/CN111987033A/zh active Pending
- 2020-05-18 SG SG10202004614UA patent/SG10202004614UA/en unknown
- 2020-05-19 TW TW109116507A patent/TW202044481A/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020101596A1 (en) * | 2001-01-26 | 2002-08-01 | Samsung Electronics Co., Ltd. | Semiconductor wafer position detecting system, semiconductor device fabricating facility of using the same, and wafer position detecting method thereof |
Also Published As
Publication number | Publication date |
---|---|
SG10202004614UA (en) | 2020-12-30 |
CN111987033A (zh) | 2020-11-24 |
TW202044481A (zh) | 2020-12-01 |
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