JP2020183229A - Protective cover and package - Google Patents

Abstract

To provide a new cover having a surface morphology to which electronic components are difficult to adhere.SOLUTION: The protective cover is a protective cover that covers a tray that houses electronic components in a concave housing, and when the arithmetic mean roughness of the surface facing the electronic components is Ra and the maximum height is Rz, the formula ( 1) 0.7 μm≤Ra≤5.0 μm Equation (2) Ra/Rz≤0.3 is satisfied.SELECTED DRAWING: Figure 8

Description

The present invention relates to a protective cover used for a member accommodating an electronic component.

Conventionally, an electronic component package has been devised for carrying electronic components such as active elements such as light emitting diodes and laser diodes and passive elements such as resistors, capacitors and coils without contamination until the process of mounting them on a mounting substrate. (See Patent Document 1). By heat-sealing the cover tape to the carrier tape having the concave portion for accommodating the electronic component, the electronic component package can carry the electronic component contained while being protected from contamination.

JP-A-2018-127256

In the conventional electronic component packaging body, when the cover tape is peeled from the carrier tape in order to take out the electronic component in the mounting process, the electronic component may be attached to the cover tape. In such a case, the electronic component may fall from the package or the electronic component may be turned upside down in the recess of the carrier tape. Therefore, in the above-mentioned electronic component packaging body, by forming a plurality of regularly arranged convex portions on the seal layer of the cover tape, the electronic component is attached to the cover tape when the electronic component is taken out in the mounting process. It is said that it can suppress.

However, in the cover tape of the electronic component packaging described above, etching metal provided in a grid pattern over the entire molded surface in order to form a plurality of regularly arranged convex portions in the seal layer without impairing transparency. You need to use a mold. In addition, it is necessary to arrange the cover tape so that the seal layer of the unprocessed cover tape is in contact with the molding surface of the etching die, and perform the press treatment under the conditions of a molding temperature of 90 ° C., a molding pressure of 20 MPa, and a molding time of 1 minute. There is also. Therefore, there is room for improvement from the viewpoint of the manufacturing cost of the cover tape.

The present invention has been made in view of these problems, and one of its exemplary purposes is to provide a new cover having a surface morphology to which electronic components are less likely to adhere.

In order to solve the above problems, the protective cover according to an embodiment of the present invention is a protective cover that covers a tray containing electronic components in a concave accommodating portion, and has an arithmetic mean roughness of a surface facing the electronic components. When Ra and the maximum height are Rz, the equation (1) 0.7 μm ≤ Ra ≤ 5.0 μm equation (2) Ra / Rz ≤ 0.3 is satisfied.

According to this aspect, the electronic component is less likely to adhere to the protective cover.

The protective cover may have irregularities on the surface facing the electronic component. This expands the options for the method of forming the unevenness as compared with the case where the unevenness is formed regularly.

The protective cover may have a total light transmittance of 80% or less. As a result, it is possible to prevent the protective cover from being forgotten to be placed.

Another aspect of the invention is a package. The package includes a tray in which a concave housing is formed, electronic components housed in the housing, and the protective cover described above. The protective cover may cover the surface of the tray to seal the electronic components.

According to this aspect, even if the electronic component housed in the tray accommodating portion moves and touches the protective cover during the transportation of the package, it is prevented from adhering to the protective cover as it is.

The depth D of the accommodating portion is larger than the height H of the electronic component. As a result, when the package is in a normal state, the electronic component does not touch the protective cover, so that the electronic component is less likely to adhere to the protective cover.

The electronic component is a light emitting element that emits ultraviolet rays, and the light emitting surface of the light emitting element is sealed with a sealing material. It may be. As a result, even if the sealing material that seals the light emitting surface is soft, the electronic components are less likely to adhere to the protective cover via the sealing material.

The sealing material may be a silicone resin. As a result, even if a silicone resin having good transparency, light resistance, and heat resistance to the ultraviolet light emitting element is used as the sealing material, the electronic components are less likely to adhere to the protective cover.

It should be noted that any combination of the above components and the conversion of the expression of the present invention between methods, devices, systems and the like are also effective as aspects of the present invention.

According to the present invention, it is possible to provide a new cover to which electronic components are hard to adhere.

It is sectional drawing for demonstrating the schematic structure of the package which concerns on this Embodiment. It is sectional drawing for demonstrating the shape of the accommodating part of a tray. 3 (a) to 3 (c) are schematic views for explaining a method of testing the performance of the protective cover. 4 (a) and 4 (b) are diagrams for explaining a pass / fail judgment when the performance of the protective cover is tested. It is a figure for demonstrating the change of Ra / Rz by the difference of the uneven form of a surface. 6 (a) and 6 (b) are views showing the results of observing the surface morphology of the protective cover according to the third embodiment with a scanning electron microscope. 7 (a) and 7 (b) are views showing the results of observing the surface morphology of the protective cover according to the fifth embodiment with a scanning electron microscope. 8 (a) and 8 (b) are views showing the results of observing the surface morphology of the protective cover according to Example 6 with a scanning electron microscope.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the description of the drawings, the same elements are designated by the same reference numerals, and duplicate description will be omitted as appropriate. In addition, the dimensional ratio of each component in each drawing does not necessarily match the dimensional ratio of the actual tray or package. Further, the configuration described below is an example, and does not limit the scope of the present invention at all.

(package)
First, a package (packaging body) for transporting electronic parts so as not to be contaminated will be described. FIG. 1 is a cross-sectional view for explaining a schematic configuration of a package according to the present embodiment.

As shown in FIG. 1, the package 10 has a tray 14 in which a plurality of concave accommodating portions 12 are formed, an electronic component 22 accommodated in the accommodating portion 12, and a tray 14 so as to seal the electronic component. A film-shaped protective cover 16 for covering the surface and a tray cover 18 are provided.

FIG. 2 is a cross-sectional view for explaining the shape of the accommodating portion 12 of the tray 14. The accommodating portion 12 is a square having a width W1 [mm] on one side of the bottom surface 12a, and the side wall 12c is inclined so as to narrow from the opening 12b toward the bottom surface 12a. Further, the electronic component 22 is accommodated in the accommodating portion 12. The electronic component 22 according to the present embodiment is a so-called UV-LED (Ultra Violet-Light Emitting Diode) chip provided with a light emitting element 22a that emits ultraviolet rays.

The width W2 [mm] of one side of the UV-LED chip according to the present embodiment is smaller than the width W1 of one side of the bottom surface 12a. The size of the width W1 and the width W2 is about 3 to 5 mm. Further, since the electronic component according to the present embodiment is very small and light, it is difficult to peel off when it comes into contact with the protective cover 16. Therefore, the depth D of the accommodating portion is larger than the height H of the electronic component. As a result, in the normal state (posture) of the package, the electronic component 22 does not touch the protective cover 16, so that the electronic component 22 is less likely to adhere to the protective cover 16. The depth D and the height H are about 1.5 to 3.0 mm.

The light emitting surface of the light emitting element 22a is sealed with a sealing material 22b from the viewpoint of durability and moisture resistance. Since the light emitting element 22a according to the present embodiment mainly emits ultraviolet rays, a silicone resin having good light resistance, heat resistance, and optical characteristics is preferable as the sealing material 22b. On the other hand, many silicone resins are soft, and when they adhere to the protective cover 16, they are difficult to peel off depending on the material and surface form of the protective cover. Therefore, if the protective cover 16 is peeled off from the tray 14 with the electronic component 22 attached to the protective cover 16 via the sealing material 22b, the electronic component 22 may fall from the tray 14 or be turned upside down inside the accommodating portion 12. It may happen.

Therefore, the inventors of the present application have focused on the surface morphology of the surface of the protective cover 16 on the side facing the electronic component 22. For example, the encapsulant to which the protective cover according to the present embodiment is more effective is one having a hardness of A10 to A30 measured by a type A durometer conforming to JIS K 6253. 3 (a) to 3 (c) are schematic views for explaining a method of testing the performance of the protective cover. First, the electronic component 22 is placed on the electronic balance 24 (see FIG. 3A). Next, the protective cover 16 is brought into contact with the sealing material 22b of the electronic component 22 and pressed until the product weight reaches +500 mg while observing the display on the electronic balance (see FIG. 3B). After that, the protective cover 16 is pulled straight up at a constant speed (see FIG. 3C).

4 (a) and 4 (b) are diagrams for explaining a pass / fail judgment when the performance of the protective cover is tested. FIG. 4A shows a state in which the electronic component 22 remains attached to the protective cover 16 when the protective cover 16 pressed against the sealing material 22b is pulled straight up, and the protective cover 16 is used as the protective cover 16. It fails. Further, in FIG. 4B, the electronic component 22 is peeled off from the protective cover 16 while the protective cover 16 pressed against the sealing material 22b is being pulled straight up, but the rotation causes the upper surface of the sealing material 22b to rotate. Alternatively, it indicates a state of landing on the side surface, and is rejected as the protective cover 16. Then, as shown in FIG. 3C, the case where the electronic component 22 is kept in a normal posture in a state of being peeled off from the protective cover 16 is regarded as a pass.

(Example)
Protective covers made of the materials according to Examples 1 to 6 and Comparative Examples 1 to 5 were prepared. The specifications of each protective cover are shown in Table 1.

Ra indicates the arithmetic mean roughness [μm], and Rz indicates the maximum height [μm]. The x of the test result is the one that failed under the condition of the pulling speed of 2 mm / s shown in FIG. 3 (c) (the state shown in FIG. 4 (a) or 4 (b)), and the ◎ is the one of the pulling speed of 20 mm / s. Passed under the conditions, ◯ is unacceptable at a pulling speed of 20 mm / s, but passed under the conditions of a pulling speed of 2 mm / s.

From the results shown in Table 1, the present inventors have found that it is preferable that the protective cover 16 that covers the tray 14 in which the electronic component 22 is housed in the concave housing portion 12 has the following surface morphology. Specifically, when the arithmetic mean roughness of the surface of the protective cover 16 facing the electronic component 22 is Ra and the maximum height is Rz, the equation (1) 0.7 μm ≤ Ra ≤ 5.0 μm (1) 2) It is preferable that Ra / Rz ≦ 0.3 is satisfied. That is, the protective cover made of the material according to Examples 1 to 6 is less likely to have the electronic component 22 adhered to it, and the posture of the electronic component 22 is less likely to change when the protective cover 16 is peeled off.

Further, the point that Ra / Rz ≦ 0.3 is preferable as the surface form of the protective cover 16 is considered as follows. FIG. 5 is a diagram for explaining the change in Ra / Rz due to the difference in the uneven shape of the surface. As shown in FIG. 5, Ra / Rz becomes smaller as the unevenness of the rectangular wave, the sine wave, and the triangular wave becomes sharper. That is, the smaller the uneven shape of Ra / Rz, the smaller the proportion of the peak or valley bottom, and the smaller the area of contact between the sealing material 22b of the electronic component 22 and the contact surface of the protective cover 16. As a result, even if the electronic component 22 comes into contact with the protective cover due to vibration or the like while the package 10 is being conveyed, it is easily peeled off and returned to the normal position.

6 (a) and 6 (b) are views showing the results of observing the surface morphology of the protective cover according to the third embodiment with a scanning electron microscope. Note that the magnifications of FIGS. 6 (a) and 6 (b) are different.

Similarly, FIGS. 7 (a) and 7 (b) are views showing the results of observing the surface morphology of the protective cover according to Example 5 with a scanning electron microscope. Note that the magnifications of FIGS. 7 (a) and 7 (b) are different.

Similarly, FIGS. 8 (a) and 8 (b) are views showing the results of observing the surface morphology of the protective cover according to Example 6 with a scanning electron microscope. Note that the magnifications of FIGS. 8 (a) and 8 (b) are different.

As shown in FIGS. 6 to 8, it can be seen that at least the surface morphology of the protective cover according to Examples 3, 5 and 6 has relatively sharp irregularities. It is also known that the protective cover according to each embodiment has irregularities on the surface of the surface facing the electronic component 22. As a result, the options for the method of forming the unevenness are expanded as compared with the case where the unevenness is regularly formed by a mold or the like. In other words, roughening of the protective cover can be realized by using techniques such as sandblasting, kneading of filler, and etching with chemicals, without controlling the shape with an expensive mold, and reducing the manufacturing cost of the protective cover. it can.

The protective cover according to Example 5 is a cover film containing a filler. Therefore, the filler may be peeled off and transferred to the sealing material 22b. The filler adhering to the surface of the encapsulant becomes a factor of deteriorating the optical characteristics. Therefore, the protective cover is preferably made of a material that does not contain a filler.

Further, the protective cover made of the pouch film according to Example 1 and Example 6 has very good test results. The pouch film according to Example 1 and Example 6 has a total light transmittance of 80% or less. As a result, it is possible to prevent the protective cover from being forgotten to be placed.

As described above, in the package according to the present embodiment, even if the sealing material for sealing the light emitting surface of the UV-LED chip, which is an electronic component, is soft, the electronic component adheres to the protective cover via the sealing material. It becomes difficult to do. Further, even if the electronic component housed in the tray accommodating portion moves and touches the protective cover during the transportation of the package, it is prevented from adhering to the protective cover as it is.

Further, the protective cover according to the present embodiment can prevent the adhesion of the electronic component having the sealing material made of a material having low hardness and higher adhesiveness by reducing the contact area with the electronic component.

Although the present invention has been described above with reference to the above-described embodiment, the present invention is not limited to the above-described embodiment, and the present invention is not limited to the above-described embodiment, and the configuration of the embodiment may be appropriately combined or replaced. It is included in the present invention. Further, it is also possible to appropriately rearrange the combination and the order of processing in the embodiment based on the knowledge of those skilled in the art, and to add modifications such as various design changes to the embodiment, and such modifications are added. Such embodiments may also be included in the scope of the present invention.

In the above-described embodiment, the tray has been described as an example of the accommodating member for accommodating the electronic components in the package, but the package may be, for example, a tape reel.

Further, the method of roughening the surface of the protective cover can be any method as long as it is a matte treatment applicable to the film.

10 packages, 12 containments, 14 trays, 16 protective covers, 22 electronic components, 22a light emitting elements, 22b encapsulants.

Claims (7)

A protective cover that covers a tray that houses electronic components in a concave housing, where the arithmetic mean roughness of the surface facing the electronic components is Ra and the maximum height is Rz.
Equation (1) 0.7 μm ≤ Ra ≤ 5.0 μm
Equation (2) Ra / Rz ≤ 0.3
A protective cover characterized by satisfying. The protective cover according to claim 1, wherein the unevenness of the surface facing the electronic component is irregularly formed. The protective cover according to claim 1 or 2, wherein the total light transmittance is 80% or less. A tray with a concave housing and
Electronic components housed in the housing and
The protective cover according to any one of claims 1 to 3 is provided.
The protective cover is a package that covers the surface of the tray so as to seal the electronic component. The package according to claim 4, wherein the depth D of the accommodating portion is larger than the height H of the electronic component. The electronic component is a light emitting element that emits ultraviolet rays.
The light emitting surface of the light emitting element is sealed with a sealing material.
The package according to claim 4 or 5, wherein the encapsulant has a hardness of A10 to A30 measured by a JIS K 6253 compliant Type A durometer. The package according to claim 6, wherein the sealing material is a silicone resin.