DK2573006T3

DK2573006T3 - A device with at least one article to be wrapped, and a transport packaging and the method therefor

Info

Publication number: DK2573006T3
Application number: DK12182945.1T
Authority: DK
Inventors: Stefan Starovecky; Stefan Mengesdorf
Original assignee: Semikron Elektronik Gmbh
Priority date: 2011-09-23
Filing date: 2012-09-04
Publication date: 2015-02-16
Also published as: CN103010579B; ES2530499T3; EP2573006A1; DE102011114309A1; CN203211717U; DE102011114309B4; CN103010579A; EP2573006B1

Description

The invention describes an arrangement for mainly ex-works transportation of at least one article which is to be packaged, and also a production method for an arrangement of this kind. The articles which are to be packaged within the meaning of this document are, in particular, electrotechnical products and, in this case, power semiconductor modules in particular. In the text which follows, the invention will therefore be described using such power semiconductor modules without restricting the general nature of the said invention. In this case, it is preferred to arrange a plurality of power semiconductor modules in a one- or two-dimensional matrix in a transportation package.

In principle, a large number of different transportation packages for power semiconductor modules, such as simple cardboard boxes or plastic blisters having a base body and cover, are known. So-called skin packages are known from the packaging of goods for end consumers. Simple cardboard boxes, for example in accordance with DE 39 09 898 Al, generally have the disadvantage that they do not protect the power semiconductor modules sufficiently against mechanical effects during transportation. A further disadvantage is that such packaging has to be opened for example for inspections in the context of a customs procedure and, consequently, the power semiconductor modules can be touched directly, and this may possibly lead to damage on account of electrostatic discharge or on account of sensitive surfaces, for example silver-coated connection elements, being touched.

The so-called skin packages as are known from DE 199 28 368 Al, for example, form a basic starting point of this invention and are a combination of a cardboard box with a plastic film enclosing the product which is to be packaged. As is known, such packages have the significant disadvantage that it is difficult to provide a simple process for opening them and removing the packaged product. DE 10 2010 005 048 Al discloses a package for power semiconductor modules which has a cover layer and an intermediate layer, which are both composed of paper or paperboard, and a cover film. In this case, the cover layer is designed to be flat, with a first main surface facing the power semiconductor module which is to be arranged. The intermediate layer is arranged on this first main surface of the cover layer by way of its second main surface. The associated power semiconductor module is arranged in the at least one recess on the first main surface of the cover layer, wherein the base element of the said power semiconductor module comes to rest on the first main surface of the cover layer, and wherein the cover film covers substantial portions of the housing of the at least one semiconductor module in a bearing manner, and wherein the cover film is further connected to the first main surface of the intermediate layer. One disadvantage in this case is that, when opening a package of this kind, the intermediate and/or cover layer are/is mechanically damaged since portions of the said intermediate layer or cover layer stick to the cover film. On account of this damage, particles of the intermediate layer and/or cover layer can contaminate the power semiconductor modules or the operating environment. EP 0 547 518 A1 discloses a skin package consisting of a lower film and an upper film which both consist of a hard transparent film. The lower film is in this case perforated and connected to the cover film by means of heat sealing such that the cover film engages in the manner of a cup in the perforation of the lower film in the region of the heat sealing.

The invention is based on the problem of improving an arrangement of this kind having at least one article which is to be packaged and having a transportation package, wherein the preconditions for removal can specifically also be met in environments with increased requirements for cleanliness.

According to the invention, the problem is solved by an arrangement having the features of Claim 1, and also by a method according to Claim 10. Preferred embodiments are described in the respective dependent claims.

The idea of the invention proceeds from the abovementioned packaging of at least one article which is to be packaged, in particular a power semiconductor module. In the text which follows, reference is made, without restricting the general nature in this respect, in each case to an article which is to be packaged or only an article of this kind is described, wherein an article is also in each case intended to be understood to mean a plurality of identical articles which are to be packaged. The article which is to be packaged, that is to say the power semiconductor module which is to be packaged in particular, preferably has a base element, by way of example a metal base plate, a housing which is composed of insulating material, and connection elements for making external contact with the power semiconductor components which are arranged internally and insulated from the base plate. In this case, the term "power semiconductor module" is understood in broad terms here too and, by way of example, is also intended to be understood to mean disc-type thyristors. The transportation package of the arrangement according to the invention has, for its part, a cover layer, an intermediate layer with a recess which is associated with the article which is to be packaged, in each case one associated recess in the case of a plurality of articles, and a cover film. The cover layer, which is preferably designed as a composite cardboard which is dissipative in its entirety, is of flat design and therefore forms the base of the transportation package. A plastic layer is arranged on a first main surface of the said cover layer, and the article is arranged on the said plastic layer. The composite comprising a cover layer and a plastic layer has, for its part, a large number of apertures.

The intermediate layer is likewise arranged on this plastic layer of the cover layer, with a recess for the associated article. In this case, it is particularly preferred if the edge of the recess in the intermediate layer rests only to the extent of at most 50%, preferably only to the extent of at most 25%, directly on the assigned article and the remaining portion of the edge is at a distance from the article and as a result forms at least one uncovered additional surface there, in each case as a subarea of the plastic layer. The plastic layer and the intermediate layer advantageously rest loosely one on the other without a cohesive connection between them.

The cover film covers substantial portions of the article which is to be packaged and in this case rests substantially on the housing and the portions which do not come to rest on the plastic layer of the cover layer, such as, for example, the connection elements of the power semiconductor module. In this case, the term "housing" is also to be understood generally here too and generally denotes the outer boundary of the article which is to be packaged. Furthermore, the cover film is adhesively connected to the first main surface of the intermediate layer and to the plastic layer in the region of the at least one additional surface, wherein it is preferred if the surface of the cover film itself is designed to be adhesive. As an alternative to this, a first main surface, which faces the cover film, of the intermediate layer and the plastic layer may have, at least in the region of the additional surface but possibly over their entire surface area too, an adhesion layer for adhesive connection to the cover film. In this case, it is preferred if the connection to the plastic layer has an adhesion force which is significantly lower, by a factor of at least two, than that of the connection to the intermediate layers. It goes without saying that the composite comprising the cover layer and the plastic layer has a significantly stronger adhesion force between the said layers than the connection between the cover film and the plastic layer.

For the protection of the articles which are to be packaged, and for protection against electrostatic discharge if the said articles are electrotechnical products such as power semiconductor modules, it is preferred if the cover film consists of a conductive or dissipative plastic film with or without a metal-vapour-deposited outer surface. It is likewise advantageous for the cover film to be designed to be transparent at least in sections, but preferably completely.

In this case, the intermediate layer and the cover layer consist of paperboard or cardboard. In addition, it is advantageous to be able to open the package in a simple manner, this being done by lifting the cover layer away from the rest of the transportation package, if the cover layer is designed to be thinner and therefore mechanically less rigid than the intermediate layer. A further preferred embodiment is produced if, in the case of a plurality of articles which are arranged in a one- or two-dimensional matrix, the said articles, in at least one dimension parallel to the main surface of the cover layer and parallel to a surface normal of the housing, are at a distance from one another which is greater than the width of the housing in this dimension. It is therefore possible to combine two arrangements of this kind with the first main surfaces of the cover surfaces in relation to one another and offset relative to one another by half the distance between two articles, to form an overall arrangement having a high packing density of the articles.

An arrangement of this kind is produced in line with the invention by means of the following successive production steps : • Arranging and connecting a plastic layer to a first main surface of a cover layer which is preferably composed of paperboard. • Forming a large number of apertures from surface to surface through the composite comprising the cover layer and the plastic layer. • Arranging an intermediate layer with a recess and an article which is to be packaged, in particular a power semiconductor module, in this recess, wherein at least one additional surface on the plastic layer is kept free in this case, the said additional surface not being covered by the article. The intermediate layer and the cover layer consist in this case of paperboard or cardboard. It is likewise advantageous if the cover layer is thinner and therefore mechanically less rigid than the intermediate layer. • Arranging a cover film so as to cover the intermediate layer and the article. The cover film is advantageously heat-treated before the negative pressure is applied. In this case, the elasticity of the said cover film is preferably increased, as a result of which the ability to enclose the article which is to be packaged in a form-fitting manner is improved.

This cover film advantageously consists of a conductive or dissipative plastic film with or without a metal-vapour-deposited outer surface.

It is likewise preferred if that surface of the cover film which faces the intermediate layer is of adhesive design, that is to say is designed with an adhesive layer, for example. As an alternative, an adhesive layer could be arranged on those regions of the cover layer, in particular of the plastic layer, and of the intermediate layer which are to be covered. • Applying a negative pressure to a second main surface of the cover layer, as a result of which the cover layer can be drawn by suction against the intermediate layer, the at least one additional surface and the article through the apertures and form adhesive connections with the cover film.

The refinement of the arrangement according to the invention and the corresponding production of the said arrangement have the result that, when the package is opened, only the cover layer with the arranged plastic layer is separated from the cover film and the plastic layer remains on the cover layer in the process. Therefore, the cover layer is not damaged. Since the cover layer is not adhesively connected to the intermediate layer, the surface thereof is also not damaged when the package is opened. Therefore, only undamaged surfaces are present when the package is opened, as a result of which no contamination by particles can occur either.

The solution according to the invention will be explained further with reference to the exemplary embodiments of Figs 1 to 5 .

Fig. 1 shows a three-dimensional illustration of two arrangements according to the invention.

Fig. 2 shows essential steps in the production of an arrangement according to the invention.

Fig. 3 shows a section through an arrangement according to the invention.

Figs 4 and 5 show a further section through an arrangement according to the invention.

Fig. 1 shows a three-dimensional illustration of two arrangements 1, 1' according to the invention, each having a transportation package 2 and a plurality of power semiconductor modules 5. The housing 50 and a plurality of connection elements 60 of the said power semiconductor modules 5 are illustrated in each case. These power semiconductor modules 5 are connected in a two-dimensional matrix on a plastic layer 130 by way of their base element 40 (not visible), see Fig. 2, in this case a metal base plate. The power semiconductor modules 5 are arranged on the first main surface 100 of the cover layer 10 of the respective transportation package 2 by virtue of the base element 40, see Fig. 2, coming to rest directly on the said first main surface in each case.

An intermediate layer 20 is arranged on this plastic layer 130 by way of its second main surface 210 without being adhesively connected to it. This intermediate layer 20 has a plurality of recesses 230 which are each associated with a power semiconductor module 5. In this case, the power semiconductor module 5 is arranged in the said recess 230 in such a way that the edge 220 of the recess 230 rests directly on the housing 50 of the power semiconductor module 5 only at a few sections. Therefore, additional surfaces 140 of the plastic layer 130 remain between the housing 50 of the power semiconductor module 5 and the edge 220 of the recess 230, as a result of which an intermediate region 240 is formed.

It may likewise be preferred if the edge 220 of the recess 230 does not rest against the power semiconductor module 5. In this case, an additional surface 140 is produced circumferentially around the power semiconductor module 5.

The transparent cover film 30 of the transportation package 30 itself, which surrounds the power semiconductor modules 5 with the exception of their base element 40 and which is connected to the second main surface 210 of the intermediate layer 20 and to the at least one additional surface 140 of the plastic layer 130 by adhesive bonding, is not illustrated. If only an additional surface 140 which is formed circumferentially around the power semiconductor module 5 is provided, a circumferential adhesive connection which virtually hermetically encloses the power semiconductor module 5 and is protected from certain environmental influences, such as moisture, is therefore produced.

In the case of a plurality of power semiconductor modules 5 in a two-dimensional matrix arrangement as illustrated here, it is further advantageous, similarly to in the case of a onedimensional arrangement, if the transportation package 2 illustrated here has a perforation 70 in the case of the second arrangement 1' between the respective power semiconductor elements 5, also see Fig. 3, in order to simplify separation of the packaged power semiconductor modules 5.

Fig. 2 shows, in four partial diagrams, essential steps in the production of an arrangement according to the invention. In a first step, a plastic layer 130 is arranged on and permanently connected to the first main surface 100 of a cover layer 10. In this case, the cover layer 10 consists of paperboard or cardboard and has a preferred thickness of between 0.2 mm and 2 mm, while the plastic layer preferably consists of PET (polyethylene terephthalate) or PP (polypropylene) and has a preferred thickness in the range of between 5 pm and 30 pm. This composite is then provided with a large number of apertures 150 which are formed from surface to surface. The diameter of these recesses is preferably between 0.1 mm and 1 mm, and this allows a negative pressure to be applied to the opposite side through the composite.

In a next step, an intermediate layer 20 is provided with recesses 230 and a power semiconductor module 5 is arranged in each of these recesses. In this case, additional surfaces 140 on the plastic layer 130 are kept free, the said additional surfaces not being covered by the power semiconductor modules 5. Neither the intermediate layer 20 nor the respective power semiconductor module 5 are adhesively connected to the plastic layer 130 in this case. The power semiconductor modules 5 are positioned, see Fig. 1, by a suitable design of the respective recess 230.

Subsequently, a cover film 30 is arranged above the intermediate layer 20 and the power semiconductor modules 5 so as to cover them. In this case, it may be necessary to treat the cover film at a temperature of between 80°C and 160°C, in particular of between 90°C and 110°C, before direct arrangement on the power semiconductor modules and in a position which is still further away from this. As a result, the elasticity of the cover film is temporarily increased and therefore the subsequent form-fitting connection to the power semiconductor module is significantly improved in comparison to as would be the case without heat treatment. Furthermore, it is more advantageous for that surface which faces the intermediate layer 20 and the power semiconductor modules 5 to be of adhesive design. As an alternative to this, a first main surface (200), which faces the cover film (30), of the intermediate layer (20) and the plastic layer (130) can have an adhesion layer, for adhesive connection to the cover film (30), at least in the region of the additional surface (140). In this case, this adhesion layer is applied to the region of the additional surfaces using a deposition method, by way of example a pressure process. If this adhesion layer is thermally activated, it can be applied over the entire surface area of the plastic layer, or over the entire surface area with the exception of the regions which are covered by the power semiconductor modules.

By applying a negative pressure, which is illustrated by the arrows at the second main surface 110 of the cover layer 10, the cover film 30 is drawn by suction against the intermediate layer 20, the additional surfaces 140 and the power semiconductor modules 5 through the apertures 150 at this second main surface 110. In this case, the intermediate layer and the additional surfaces 140 form an adhesive connection to the cover film 30. It is important here for the adhesive holding force between the cover film 30 and the intermediate layer 20 to be greater than the adhesive holding force between the cover film 30 and the plastic layer 130 at least by a factor of 2. This refinement prevents, as described above, the cover layer 10 and the intermediate layer 20 from being damaged when the transportation package is opened.

Figure 3 shows, as a detail, a section along line A-A through an arrangement (1) according to the invention in accordance with Fig. 1. Here, the illustration shows the cover layer 10 of the transportation package 2 with the plastic layer 130 arranged on its first main surface 100. The power semiconductor module 5 which is to be packaged are arranged on the plastic layer 130 in a matrix-like manner at the same distance from one another. Only a base element 40, a housing 50 and a connection element 60 of the power semiconductor modules 5 which are to be packaged are illustrated.

It is advantageous for these power semiconductor modules 5 to be able to be arranged on the plastic layer 130 by way of their base element 40 which may usually be a metallic base plate or else directly the substrate of the internal circuit. However, this is not restrictive for the possibilities of arranging the power semiconductor module 5 in a manner rotated through 90° or 180° about one of its longitudinal axes. In the case of the refinement provided here, the connection elements 60 lie on that side of the power semiconductor module 5 which is opposite the cover layer 10.

The intermediate layer 20 is also illustrated, the second main surface 210 of the said intermediate layer not being adhesively connected to the first main surface 100 of the cover layer 10. The intermediate layer 20, like the cover layer 10 too, preferably but non-restrictively consists of paperboard or cardboard.

The intermediate layer 20 also has recesses 230, as a result of which the associated power semiconductor module 5 is encompassed in its lower region and fixed in its position. However, an additional surface 140 of the plastic layer 130 which is not covered by the power semiconductor module 5 or the intermediate layer 20 remains in this case. Provision is made over the entire circumference of the power semiconductor module 5 for the edge 220 of the recess 230 to rest to the extent of at most 50%, preferably only to the extent of at most 25%, directly on the associated power semiconductor module 5 and for the remaining portion of the edge 220 to be at a distance of at least 2 mm, preferably at least 5 mm, from the power semiconductor module 5 and therefore to form an intermediate region 240 above the additional surface 140. However, it is necessary for the said edge to rest directly on the said associated power semiconductor module at least at some points, preferably in the corners of the power semiconductor module 5, see Fig. 1, so that it is ensured that the power semiconductor module 5 are fixed in their position with respect to one another.

Here, exclusively for the sake of improved clarity, the cover film 30 is illustrated at a distance from the cover layer 10 and the intermediate layer 20 and also at a distance from the power semiconductor modules 5. Moreover, the cover film 30 is adhesively connected to the first main surface 200 of the intermediate layer 20, and also to the plastic layer 130 in the region of the additional surfaces 140. To the extent allowed by the flexibility of the cover film 30, the said cover film rests on the power semiconductor modules 5 and surrounds them in each case in the direction of the cover layer 10.

Typical dimensions for power semiconductor modules 5 of this kind are, without deriving a restriction therefrom, a length in the range of from 3 cm to 15 cm given a width 500 and a height of from 1 cm to 6 cm. The cover layer 10 of the transportation package 2 has a typical thickness of from 0.2 mm to 2 mm, the intermediate layer 20 has a thickness of from 0.5 to 3 mm, while the cover film 30 has a thickness of from 50 pm to 250 pm.

Designing the cover film 30 from a conductive or dissipative plastic layer with or without a metal-vapour-deposited outer surface and the cover layer 10 from a conductive or dissipative composite cardboard produces a transportation package 2 which affords a sufficient degree of protection against electrostatic charging. Since the cover film 30 is transparent at least in sections, but preferably completely, it is not necessary to open this protective packaging for various inspection purposes either.

The arrangement 1 according to the invention in accordance with Fig. 3 is furthermore designed in such a way that the distance 700 between the power semiconductor modules 5 is greater than the width 500 of a power semiconductor module 5, as a result of which it is possible to provide a second arrangement 1' (illustrated using a dotted line) in a manner offset by half the distance with respect to the first arrangement 1 and in a manner rotated through 180°, see Fig. 1, this resulting in a compact overall arrangement having a high packing density of the individual power semiconductor modules 5 at the same time as being adequately fixed with respect to one another.

Figs. 4 and 5 show a further section along line B-B through an arrangement 1 according to the invention in accordance with Fig. 1, wherein a particular advantage of the arrangement becomes evident. Fig. 4 once again shows a power semiconductor module 5 and also a portion of the transportation package 2. In this case, however, the cover layer 10, together with the plastic layer 130, is illustrated as being separate from the intermediate layer 20 in parts. This illustration corresponds to the situation of the transportation package 2 being opened in order to remove a power semiconductor module 5 therefrom. In this case, only the connection between the additional surface 140 of the plastic layer 130 and the cover film 30 in the intermediate region 240 is broken.

To this end, it is firstly necessary for the connection between the cover film 30 and the intermediate layer 20 to have a significantly higher adhesion force than the connection between the cover film 30 and the plastic layer 130. It is likewise advantageous if the the cover layer 10 is designed to be thinner and therefore mechanically less rigid than the intermediate layer 20, since the intermediate layer therefore remains virtually as a holder frame for the rest of the transportation package 2.

Fig. 5 then shows a further step of removing a power semiconductor module 5 from the transportation package 2. In this case, the intermediate layer 20 was pressed in the direction of the surface normal of its first main surface 200 until the intermediate layer 20 lies approximately on the plane which is formed by the upper face of the housing 50. During this displacement of the intermediate layer 20, the cover film 30 becomes at least partially detached from the housing 50 of the power semiconductor module 5, as a result of which the said power semiconductor module can be removed from the transportation package 2 in a simple manner and without using a tool.

Claims

Device (1) having an article (5) to be wrapped and a transport wrapper (2), the article (5) having a housing (50), the transport wrapping (2) having a cover layer (10), an intermediate layer (20) having a recess (230) assigned to the object (5) and a cover film (30), the intermediate layer (20) and the covering layer (10) being made of cardboard or cardboard and the covering layer (10) being formed flat with a first facing the article (5) facing the main surface (100), where on this first main surface (100) of the covering layer (10) is provided a plastic layer (130) and the covering layer (10) and the plastic layer (130) have a plurality of perforations ( 150), where the intermediate layer (20) is arranged on its plastic layer with its second main surface (210) and where in the recess (230) the object (5) assigned to this recess is placed on the plastic layer (130) and thus does not cover the recess (230) completely, but on the other hand exposes at least one additional surface (140) where the cover film (30) does not cover essential parts of the the tooth (5), which rests on the plastic layer (130) and thereby extensively abuts the housing (50), and wherein the cover film (30) is adhered to the first main surface (200) of the intermediate layer (20) and with the plastic layer (130) in the region of the at least one additional surface (140).

Device according to claim 1, wherein the article (5) to be wrapped is an electrotechnical product, in particular a wiring semiconductor module.

Device (1) according to claim 1, wherein the plastic layer (130) and the intermediate layer (20) lie loosely on top of one another without a fixed connection.

Device according to claim 1, wherein the surface of the cover film facing the intermediate layer is formed adhesively or wherein a first main surface (200) of the intermediate layer facing the cover film (30) and the plastic layer (130) at least in the region of the additional surface (140) has an adhesive layer for adhesive connection to the cover film (30).

Device (1) according to claim 1, wherein the adhesive connection between the cover film (30) and the intermediate layer (20) has at least twice the adhesive capacity relative to the connection between the cover film (30) and the intermediate film (130).

Apparatus (1) according to claim 1, wherein the cover film (30) consists of a conductive or conductive plastic layer with or without metal insulated outer surface.

Device (1) according to claim 1, wherein the cover layer (10) is formed thinner and thus mechanically less rigid than the intermediate layer (20).

Device (1) according to claim 8, wherein the cover layer (10) has a thickness of 0.2 mm to 2 mm and the intermediate layer (20) has a thickness of 0.5 to 3 mm and thus has a substantially smaller thickness relative to the height of an object (5) to be wrapped.

Method of manufacturing a device (1) with an article (5) to be wrapped, the article (5) having a housing (50) and a transport package (2), characterized by these successive manufacturing steps: Positioning and connecting a plastic layer (130) with a first main surface (100) of a cover layer (10) consisting of cardboard or cardboard; Forming a plurality of surface-to-surface perforations (150) through the connection between cover layer (10) and plastic layer (120); Placing a cardboard or cardboard intermediate layer (20) with a recess (230) and an object (5) in this recess (230), where at least one additional surface (140) is exposed on the plastic layer (130) which is not is covered by the object (5); Positioning a cover film (30) which covers the intermediate layer (20) and the article (5); Applying a negative pressure to a second main surface (110) of the cover layer (10), thereby sucking through the perforations (150) the cover film (30) against the intermediate layer (20), the extra surfaces (140) and the object (5), and there adhesive bonds are formed with the cover film (30).

The method of claim 9, wherein - prior to application of the vacuum, the cover film (30) is thermally actuated.

The five-step method of claim 9, wherein the cover film (30) consists of a conductive or conductive plastic layer with or without metal insulated exterior surface.

The method of claim 9, wherein the cover layer (10) is formed thinner and thus mechanically less rigid than the intermediate layer (20).

The method of claim 10, wherein the surface (10) of the cover film (30) facing the intermediate layer (20) is formed adhesively, or wherein a first main surface (200) of the intermediate layer (20) facing the cover film (30) ), and the plastic layer (130) at least in the region of the additional surface (140) has an adhesive layer for adhesive connection to the cover film (30).