DE102011114309B4 - Arrangement with at least one object to be packaged and a transport packaging and manufacturing method thereof - Google Patents

Abstract

Arrangement (1) with an article to be packaged (5) and a transport packaging (2), wherein the article (5) comprises a housing (50), wherein the
Transport packaging (2) has a cover layer (10), an intermediate layer (20) with the object (5) associated recess (230) and a cover sheet (30), wherein the intermediate layer (20) and the cover layer (10) made of cardboard or Consist of cardboard and
Here, the cover layer (10) is flat, with a first object (5) facing the main surface (100) is formed on this first main surface (100) of the cover layer (10) a plastic layer (130) is arranged and the cover layer (10) together Plastic layer (130) has a plurality of openings (150), on the plastic layer, the intermediate layer (20) is arranged with its second major surface (210) and in the recess (230) of the intermediate layer (20) of this recess associated with the object (5) is arranged on the plastic layer (130) and in this case the recess (230) not completely covered, but at least one additional surface (140) freispart, wherein the cover film (30) essential not on the plastic layer (130) to come to lie parts of the article (5 ), in this case largely applied to the housing (50) and wherein the cover film (30) with the first main surface (200) of the intermediate layer (20) and with the plastic layer (130) in the region of min at least one additional surface (140) is adhesively bonded.

Description

The invention describes an arrangement for the usually off-field transport of at least one object to be packaged as well as a manufacturing method for such an arrangement. For the purposes of this document, articles to be packaged are in particular electrotechnical products and, in particular, power semiconductor modules. In the following, therefore, the invention will be described by means of such power semiconductor modules without limiting the generality. In this case, a plurality of power semiconductor modules are preferably arranged in a one- or two-dimensional matrix in a transport packaging.

It is basically a variety of different transport packaging for power semiconductor modules, such as simple cardboard boxes or plastic blister with body and lid known. From the packaging of consumer goods so-called skin packaging is known. Simple cardboard boxes, for example, according to DE 39 09 898 A1 As a rule, they have the disadvantage that they do not adequately protect the power semiconductor modules against mechanical influences during transport. A further disadvantage is that such packaging must be opened by way of example for tests under a customs procedure and thus the power semiconductor modules can be touched directly, which may possibly lead to damage due to electrostatic discharge or due to the contact of sensitive surfaces, for example silver-coated connection elements.

The so-called Skin- packaging, as exemplified by the DE 199 28 368 A1 are known, form a basic starting point of this invention and are a combination of a carton with the plastic film enclosing the goods to be packaged. Such packages are known to have the significant disadvantage that they are not accessible to a simple operation of opening and removing the packaged Guts.

From the DE 10 2010 005 048 A1 a package for power semiconductor modules is known which has a cover layer, an intermediate layer, both preferably made of paper or cardboard, and a cover sheet. Here, the cover layer is formed flat with a first to be arranged power semiconductor module facing the main surface. On this first main surface of the cover layer, the intermediate layer is arranged with its second major surface. In the at least one recesses on the first main surface of the cover layer, the associated power semiconductor module is arranged, wherein the bottom element comes to rest on the first major surface of the cover layer, and wherein the cover sheet substantially overlaps essential parts of the housing of the at least one power semiconductor module and wherein further the cover film with the first main surface of the intermediate layer is connected. The disadvantage here is that when opening such a package, the intermediate and / or the top layer is mechanically damaged, since parts thereof adhere to the cover sheet. Due to these damages, particles of the intermediate and / or top layer may be present as contamination of the power semiconductor modules or of the working environment.

From the EP 0 547 518 A1 is a Skinverpackung consisting of a lower and a top film known, both of which consist of a clear film. The lower film is in this case perforated and connected by means of a heat seal with the cover film such that the cover film in the region of the heat seal cup-like engages in the perforation of the lower film.

The invention has for its object to improve such an arrangement with at least one object to be packaged and a transport packaging, in particular, the conditions for the removal can be met in environments with increased cleanliness requirements.

The object is achieved by an arrangement with the features of claim 1, and by a method according to claim 9. Preferred embodiments are described in the respective dependent claims.

The inventive idea is based on the above-mentioned packaging of at least one article to be packaged, in particular a power semiconductor module. In the following, reference will be made to an article to be packaged or only described to one without particular restriction of the generality, this also including a plurality of similar objects to be packaged to be understood. The article to be packaged, ie in particular the power semiconductor module to be packaged, preferably has a base element, for example a metallic base plate, a housing made of an insulating material and connection elements for external contacting of the power semiconductor components internally insulated from the base plate. Here, too, the term power semiconductor module is to be understood in a broad sense and by way of example disc cells should be understood. The transport packaging of the arrangement according to the invention in turn has a cover layer, an intermediate layer with a recess associated with the article to be packaged, with a plurality of objects in each case an associated recess, and a cover film. The, preferably as a deducible in its entirety Composite board formed, top layer is flat and thus forms the basis of the transport packaging. On a first main surface of this cover layer, a plastic layer and then the article is arranged. The composite of cover layer and plastic layer in turn has a plurality of openings.

Also on this plastic layer of the cover layer, the intermediate layer is arranged, with a recess for the associated object. It is particularly preferred if the edge of the recess of the intermediate layer only to a maximum of 50%, preferably only to a maximum of 25%, directly applied to the associated object and the remaining part of the edge has a distance from the object and thereby at least one uncovered there Each additional surface forms as a partial surface of the plastic layer. Advantageously, the plastic layer and the intermediate layer without a cohesive connection between them are loose on each other.

The cover film covers essential parts of the object to be packaged and in this case lies largely against the housing and the parts which do not lie on the plastic layer of the cover layer, for example the connection elements of the power semiconductor module. Here also the term housing is to be understood in general terms and generally refers to the outer boundary of the object to be packaged. Furthermore, the cover film is adhesively bonded to the first main surface of the intermediate layer and in the region of the at least one additional surface with the plastic layer, wherein it is preferred if the surface of the cover film itself is formed adhesive. Alternatively, a first cover sheet facing the main surface of the intermediate layer and the plastic layer at least in the region of the additional surface, but possibly also over the entire surface, have an adhesive layer for adhesive bonding with the cover sheet. In this case, it is preferred if the connection to the plastic layer has a substantially lower adhesive force by at least a factor of two than that to the intermediate layers. Of course, the composite of cover layer and plastic layer has a much stronger adhesive force to each other than the connection of the cover sheet to the plastic layer.

It is for the protection of the objects to be packaged and if they are electro-technical products such as power semiconductor modules are against electrostatic discharge preferred when the cover sheet consists of a conductive or dissipative plastic film with or without metallbedampfter outer surface. It is equally advantageous to form the cover film at least in sections, but preferably completely, transparently.

Furthermore, it is preferred if the intermediate layer and / or cover layer consists of cardboard or cardboard. In addition, it is advantageous to simply open the packaging, which is done by lifting the cover layer from the rest of the transport packaging, when the cover layer is thinner and thus mechanically less rigid than the intermediate layer.

A further preferred embodiment results if, in a plurality of objects arranged in a one- or two-dimensional matrix, these have a distance from one another in at least one dimension parallel to the main surface of the cover layer and parallel to a surface normal of the housing which is greater than the width of the housing in FIG this dimension. Thus, it is possible to combine two such arrangements with the first major surfaces of the top surfaces to each other and by half the distance between two objects offset from each other to form an overall arrangement of high packing density of the objects.

• • Anordnen und Verbinden einer Kunststoffschicht mit einer ersten Hauptfläche einer vorzugsweise aus Pappe bestehenden Decklage.
• • Ausbilden einer Vielzahl von Durchbrüchen von Oberfläche zu Oberfläche durch den Verbund aus Decklage und Kunststoffschicht.
• • Anordnen einer Zwischenlage mit einer Ausnehmung und von einem zu verpackenden Gegenstand, insbesondere einem Leistungshalbleitermodul, in dieser Ausnehmung, wobei hierbei mindestens eine Zusatzfläche auf der Kunststoffschicht freispart werden, die nicht von dem Gegenstand überdeckt sind. Vorzugsweise bestehen die Zwischenlage und / oder Decklage aus Pappe oder Karton. Ebenso ist es vorteilhaft wenn die Decklage dünner und damit mechanisch weniger starr ausgebildet ist als die Zwischenlage.
• • Anordnen einer Deckfolie, die Zwischenlage und den Gegenstand überdeckend. Vorteilhafterweise wird die Deckfolie vor dem Anlegen des Unterdrucks die thermisch beaufschlagt. Bevorzugt wird hierbei deren Elastizität erhöht, wodurch die formschlüssige Umhüllbarkeit des zu verpackende Gegenstandes verbessert wird. Vorteilhafterweise besteht diese Deckfolie aus einer leitfähigen oder ableitfähigen Kunststofffolie mit oder ohne metallbedampfter Außenfläche. Ebenso ist bevorzugt, wenn die der Zwischenlage zugewandte Oberfläche der Deckfolie adhäsive, also beispielhaft mit einer Klebeschicht ausgebildet ist. Alternativ könnte eine adhäsive Schicht auf den zu bedeckenden Bereichen der Decklage, insbesondere der Kunststoffschicht, und der Zwischenlage angeordnet sein.
• • Anlegen eines Unterdrucks an eine zweite Hauptfläche der Decklage, wodurch durch die Durchbrüche die Deckfolie an die Zwischenlage, die mindestens eine Zusatzfläche und den Gegenstand angesaugt werden und sich adhäsive Verbindungen mit der Deckfolie ausbilden.

The production of such an arrangement takes place in an inventive manner by means of these successive production steps:

• Arranging and bonding a plastic layer to a first major surface of a preferably made of cardboard cover layer.
• • Forming a variety of breakthroughs from surface to surface through the composite of cover layer and plastic layer.
• • Arranging an intermediate layer with a recess and of an object to be packaged, in particular a power semiconductor module, in this recess, wherein in this case at least one additional surface are freed on the plastic layer, which are not covered by the object. Preferably, the intermediate layer and / or cover layer of cardboard or cardboard. It is also advantageous if the top layer is thinner and thus mechanically less rigid than the intermediate layer.
• • Place a cover sheet, covering the liner and the object. Advantageously, the cover sheet is applied thermally before the application of the negative pressure. In this case, their elasticity is preferably increased, whereby the positive Umhüllbarkeit of the article to be packaged is improved. Advantageously, this cover sheet consists of a conductive or dissipative plastic film with or without metal-coated outer surface. It is likewise preferred if the surface of the cover film facing the intermediate layer is adhesive, that is to say it is formed, for example, with an adhesive layer. Alternatively, an adhesive could be Layer on the areas to be covered of the cover layer, in particular the plastic layer, and the intermediate layer may be arranged.
• Applying a negative pressure to a second main surface of the cover layer, whereby the cover film is sucked through the apertures to the intermediate layer, the at least one additional surface and the article and form adhesive bonds with the cover film.

As a result of the configuration of the arrangement according to the invention or its corresponding production, it is achieved that, when the package is opened, only the cover layer with the plastic layer arranged is separated from the cover film and the plastic layer remains on the cover layer. Thus, the top layer is not damaged. Since the cover layer is not adhesively bonded to the intermediate layer, its surface is not damaged when opening the packaging. Thus, after opening the packaging, only undamaged surfaces are present, as a result of which no contamination by particles can occur.

• 1 zeigt in dreidimensionaler Darstellung zwei erfindungsgemäße Anordnungen.
• 2 zeigt wesentliche Schritte der Herstellung einer erfindungsgemäßen Anordnung.
• 3 zeigt einen Schnitt durch eine erfindungsgemäße Anordnung.
• 4 und 5 zeigt einen weiteren Schnitt durch eine erfindungsgemäße Anordnung.

The inventive solution is based on the embodiments of the 1 to 5 further explained.

• 1 shows a three-dimensional representation of two inventive arrangements.
• 2 shows essential steps of the production of an inventive arrangement.
• 3 shows a section through an inventive arrangement.
• 4 and 5 shows a further section through an arrangement according to the invention.

1 shows a three-dimensional representation of two inventive arrangements 1 . 1' each with a transport packaging 2 and a plurality of power semiconductor modules 5 , From these power semiconductor modules 5 are each the case 50 and a plurality of connection elements 60 shown. With its invisible floor element 40 , see. 2 , here a metallic base plate, these are power semiconductor modules 5 in a two-dimensional matrix on a plastic layer 130 connected. The power semiconductor modules 5 are on the first major surface 100 the top layer 10 the respective transport packaging 2 arranged by the floor element 40 , see. 2 each lie directly on top of it.

On this plastic layer 130 is a liner 20 with its second major surface 210 arranged to be connected without adhesives. This liner 20 has a plurality of recesses 230 on, each a power semiconductor module 5 assigned. Here is the power semiconductor module 5 in this recess 230 arranged so that the edge 220 the recess 230 only a few sections directly to the housing 50 of the power semiconductor module 5 is applied. This leaves additional surfaces 140 the plastic layer 130 between the case 50 of the power semiconductor module 5 and the edge 220 the recess 230 , creating an intermediate area 240 is being trained.

It may also be preferred if the edge 220 the recess 230 not on the power semiconductor module 5 is applied. This creates an additional area 140 encircling the power semiconductor module 5 ,

Not shown is the transparent cover sheet 30 the transport packaging 30 itself, the power semiconductor modules 5 with the exception of its floor element 40 wraps around and with the second major surface 210 the liner 20 and with the at least one additional surface 140 the plastic layer 130 is adhesively connected. If only one circumferential around the power semiconductor module 5 trained additional area 140 is provided thus creates a circumferential adhesive connection, the power semiconductor module 5 hermetically encloses and protects from certain environmental influences, such as moisture.

In a plurality of power semiconductor modules shown here 5 In a two-dimensional matrix arrangement, as in the case of a one-dimensional arrangement, it is furthermore advantageous if the transport packaging 2 shown here in the second arrangement 1' between the respective power semiconductor components 5 a perforation 70 has, cf. also 3 to singulate the packaged power semiconductor modules 5 to simplify.

2 shows in four partial illustrations essential steps of the production of an inventive arrangement. In a first step is on the first main surface 100 a cover layer 10 a plastic layer 130 arranged and permanently connected to this. The top layer 10 consists of cardboard or cardboard and has a preferred thickness between 0.2 mm and 2 mm, while the plastic layer is preferably made of PET (polyethylene terephthalate) or PP (polypropylene) and has a preferred thickness in the range between 5 .mu.m and 30 .mu.m. Following this is this composite with a variety of breakthroughs 150 provided, which are formed from surface to surface. The diameter of these recesses is preferably between 0.1mm and 1mm, thereby allowing a negative pressure to be applied to the opposite side through the composite.

In a next step will be an intermediate layer 20 with recesses 230 and in each of these recesses, a power semiconductor module 5 arranged. Here are additional surfaces 140 on the plastic layer 130 freispart, not from the power semiconductor modules 5 are covered. Neither the liner 20 , nor the respective power semiconductor module 5 are here adhesive with the plastic layer 130 connected. The positioning of the power semiconductor modules 5 takes place, cf. 1 by a suitable design of the respective recess 230 ,

Subsequently, a cover sheet 30 above the liner 20 and the power semiconductor modules 5 these arranged overlapping. In this case, it may be necessary to apply the cover film at a temperature of between 80.degree. C. and 160.degree. C., in particular between 90.degree. C. and 110.degree. C., before direct placement on the power semiconductor modules and in a position which is still objectionable thereto. As a result, the elasticity of the cover film is temporarily increased and thus the subsequent positive connection with the power semiconductor module substantially improved than would be done without temperature. Furthermore, it is more advantageous at least that surface, that of the intermediate layer 20 and the power semiconductor modules 5 facing, formed adhesive. Alternatively, a first of the coversheet ( 30 ) facing main surface ( 200 ) of the intermediate layer ( 20 ) and the plastic layer ( 130 ) at least in the area of the additional area ( 140 ) an adhesive layer for adhesive bonding with the cover sheet ( 30 ) exhibit. This adhesive layer is applied to the area of the additional surfaces with a deposition, for example a pressure, process. If this adhesive layer is thermally activated, it can be applied over the entire surface of the plastic layer, or over the entire surface except for the areas covered by the power semiconductor modules.

By applying a negative pressure, represented by the arrows on the second main surface 110 the top layer 10 , becomes this second major surface 110 through the breakthroughs 150 the cover sheet 30 to the liner 20 , the additional surfaces 140 and the power semiconductor modules 5 sucked. This forms an adhesive connection of the intermediate layer and the additional surfaces 140 with the cover foil 30 out. What is essential here is that the adhesive holding force between the cover film 30 and the liner 20 at least by the factor 2 is greater than the adhesive holding force between the cover sheet 30 and the plastic layer 130 , As a result of this configuration, as described above, it is avoided that neither the cover layer 10 still the liner 20 when opening the transport packaging is damaged.

3 shows a section of a section along the line AA by an arrangement according to the invention ( 1 ) according to 1 , Shown here is the top layer 10 the transport packaging 2 with the on her first main surface 100 arranged plastic layer 130 , On the plastic layer 130 are matrix-like with the same distance from each other to be packaged power semiconductor module 5 arranged. Of the power semiconductor modules to be packaged 5 are just a floor element 40 , a housing 50 and a connection element 60 shown.

It is advantageous these power semiconductor modules 5 with its bottom element 40 , which may usually be a metallic base plate or directly the substrate of the internal circuit, on the plastic layer 130 to arrange. However, this is not limiting for the possibilities, the power semiconductor module 5 to be rotated by 90 ° or 180 ° about one of its longitudinal axes. In the embodiment provided here are the connection elements 60 on the top layer 10 opposite side of the power semiconductor module 5 ,

Also shown is the intermediate layer 20 whose second main surface 210 with the first main surface 100 the top layer 10 has no adhesive bond. Preferably but not limiting is the intermediate layer 20 as well as the top layer 10 made of cardboard or cardboard.

The liner 20 still has recesses 230 on, causing the associated power semiconductor module 5 in its lower part and fixed in its position. However, this leaves an additional area 140 the plastic layer 130 not from the power semiconductor module 5 or the liner 20 is covered. On the entire circumference of the power semiconductor module 5 it is intended that the edge 220 the recess 230 to a maximum of 50%, preferably only to a maximum of 25%, directly to the associated power semiconductor module 5 abuts and the remaining part of the edge 220 a distance of at least 2mm, preferably at least 5mm to the power semiconductor module 5 has and thus an intermediate area 240 above the additional area 140 formed. However, a direct concern is at least in some places, preferably in the corners of the power semiconductor module 5 , see. 1 , necessary to allow the fixation of the power semiconductor module 5 is ensured in their position to each other.

The cover sheet 30 is here for the sake of clarity only spaced from the cover 10 or the intermediate layer 20 and also spaced from the power semiconductor modules 5 shown. Incidentally, the cover sheet 30 with the first main surface 200 the liner 20 as well as the plastic layer 130 in the area of additional areas 140 adhesively connected. The cover sheet 30 is, as far as their flexibility allows, on the power semiconductor modules 5 and encloses them each to the cover layer 10 out.

Typical dimensions for such power semiconductor modules 5 are without limitation, a length in the range of 3cm to 15cm in one width 500 and height from 1 cm to 6cm. The top layer 10 the transport packaging 2 has a typical thickness of 0.2mm to 2mm, the intermediate layer 20 a thickness of 0.5 to 3mm, while the cover sheet 30 has a thickness of 50μm to 250μm.

Due to the design of the cover sheet 30 from a conductive or dissipative plastic layer with or without metallbedampfter outer surface and the cover layer 10 From a conductive or dissipative composite cardboard, creates a transport packaging 2 which provides adequate protection against electrostatic charge. Because the cover sheet 30 at least in sections, but preferably completely, is designed to be transparent, it is not necessary for various control purposes to open this protective packaging.

The inventive arrangement 1 according to 3 is further configured such that the distance 700 the power semiconductor modules 5 each other is greater than the width 500 a power semiconductor module 5 , whereby it is possible a second arrangement shown in dotted 1' offset by half the distance to the first arrangement 1 and to provide rotated by 180 °, cf. 1 , resulting in a compact overall arrangement with high packing density with sufficient fixation of the individual power semiconductor modules 5 gives each other.

4 and 5 shows a further section along the line BB by an inventive arrangement 1 according to 1 wherein a particular advantage of the arrangement becomes apparent. 4 again shows a power semiconductor module 5 as well as a part of the transport packaging 2 , Here, however, is the top layer 10 together with the plastic layer 130 partly from the liner 20 shown separately. This representation corresponds to the opening of the transport packaging 2 to a power semiconductor module 5 to be taken from this. Here, only the connection between the additional area 140 the plastic layer 130 and the cover sheet 30 in the intermediate area 240 separated.

For this it is necessary on the one hand, that connection between the cover sheet 30 and the liner 20 has a much higher adhesive force than the compound of the cover sheet 30 with the plastic layer 130 , It is also advantageous if the cover layer 10 thinner and thus mechanically less rigid than the intermediate layer 20 because thus the intermediate layer as a kind of holder frame of the rest of the transport packaging 2 persists.

5 now shows a further step of removing a power semiconductor module 5 from the transport packaging 2 , This was the liner 20 towards the surface normals of their first major surface 200 pressed until the liner 20 almost on the top of the case 50 level formed. In this shift of the liner 20 the cover foil dissolves 30 at least partially from the housing 50 of the power semiconductor module 5 making this easy and without application of tools from the transport packaging 2 can be removed.

Claims (13)

Arrangement (1) with an article to be packaged (5) and a transport packaging (2), wherein the article (5) comprises a housing (50), wherein the Transport packaging (2) has a cover layer (10), an intermediate layer (20) with the object (5) associated recess (230) and a cover sheet (30), wherein the intermediate layer (20) and the cover layer (10) made of cardboard or Consist of cardboard and Here, the cover layer (10) is flat, with a first object (5) facing the main surface (100) is formed on this first major surface (100) of the cover layer (10) a plastic layer (130) is arranged and the cover layer (10) together Plastic layer (130) has a plurality of openings (150), on the plastic layer, the intermediate layer (20) is arranged with its second major surface (210) and in the recess (230) of the intermediate layer (20) of this recess associated with the object (5) is arranged on the plastic layer (130) and in this case the recess (230) is not completely covered, but at least one additional surface (140) freispart, the cover film (30) essential not on the plastic layer (130) to come to lie parts of the article (5 ), in this case largely applied to the housing (50) and wherein the cover film (30) with the first main surface (200) of the intermediate layer (20) and with the plastic layer (130) in the region of min at least one additional surface (140) is adhesively bonded. Arrangement according to Claim 1 , wherein the object to be packaged (5) is an electrotechnical product, in particular a power semiconductor module. Arrangement (1) according to Claim 1 wherein the plastic layer (130) and the intermediate layer (20) loose on one another without a cohesive connection. Arrangement according to Claim 1 wherein the intermediate layer facing the cover sheet is adhesively formed or wherein a first of the cover sheet (30) facing the main surface (200) of the intermediate layer (20) and the plastic layer (130) at least in the region of the additional surface (140) an adhesive layer for adhesive connection having the cover sheet (30). Arrangement (1) according to Claim 1 , wherein the adhesive bond of the cover film (30) with the intermediate layer (20) has an adhesive force which is at least twice as high in comparison to the connection of the cover film (30) to the intermediate film (130). Arrangement (1) according to Claim 1 , wherein the cover film (30) consists of a conductive or dissipative plastic layer with or without metallbedampfter outer surface. Arrangement (1) according to Claim 1 , wherein the cover layer (10) thinner and thus mechanically less rigid than the intermediate layer (20). Arrangement (1) according to Claim 7 , wherein the cover layer (10) has a thickness of 0.2mm to 2mm and the intermediate layer (20) has a thickness of 0.5 to 3mm and thus have a substantially smaller thickness compared to the height of an article to be packaged (5). Method for producing an arrangement (1) with an object to be packaged (5), the object (5) having a housing (50), and a transport packaging (2) characterized by these successive production steps: arranging and connecting a plastic layer ( 130) having a first major surface (100) of a paperboard or cardboard top layer (10); Forming a plurality of apertures (150) from surface to surface through the composite of cover layer (10) and plastic layer (120); Arranging an intermediate layer (20) consisting of cardboard or paperboard with a recess (230) and an object (5) in this recess (230), whereby at least one additional surface (140) is left free on the plastic layer (130) is covered by the object (5); Arranging a cover sheet (30) covering the intermediate layer (20) and the article (5); Applying a negative pressure to a second main surface (110) of the cover layer (10), whereby the cover film (30) is sucked through the apertures (150) to the intermediate layer (20), the additional surfaces (140) and the article (5), and form adhesive bonds with the cover sheet (30). Method according to Claim 9 , wherein before the application of the negative pressure, the cover sheet (30) is thermally acted upon. Method according to Claim 9 , wherein the cover film (30) consists of a conductive or dissipative plastic layer with or without metallbedampfter outer surface. Method according to Claim 9 , wherein the cover layer (10) thinner and thus mechanically less rigid than the intermediate layer (20). Method according to Claim 10 wherein the intermediate layer (20) facing surface (10) of the cover film (30) is adhesively formed or wherein a first of the cover film (30) facing the main surface (200) of the intermediate layer (20) and the plastic layer (130) at least in the region Additional surface (140) have an adhesive layer for adhesive connection with the cover sheet (30).

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