CN203211717U - Arranging structure with at least one to-be-packaged article and transport package - Google Patents
Arranging structure with at least one to-be-packaged article and transport package Download PDFInfo
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- CN203211717U CN203211717U CN2012204917942U CN201220491794U CN203211717U CN 203211717 U CN203211717 U CN 203211717U CN 2012204917942 U CN2012204917942 U CN 2012204917942U CN 201220491794 U CN201220491794 U CN 201220491794U CN 203211717 U CN203211717 U CN 203211717U
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- article
- interlayer
- plastic layer
- epiphragma
- cap rock
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- Withdrawn - After Issue
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
- B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
- B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
- B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
- B65D75/325—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil
- B65D75/327—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil and forming several compartments
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
- B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
- B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
- B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
- B65D75/36—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed
- B65D75/367—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed and forming several compartments
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2575/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
- B65D2575/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by association or interconnecting two or more sheets or blanks
- B65D2575/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
- B65D2575/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
- B65D2575/3209—Details
- B65D2575/3218—Details with special means for gaining access to the contents
- B65D2575/3245—Details with special means for gaining access to the contents by peeling off the non-rigid sheet
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- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Buffer Packaging (AREA)
- Cartons (AREA)
Abstract
The utility model relates to an arranging structure with at least one to-be-packaged article and a transport package. The article comprises a shell and the transport package comprises a cover layer, a middle layer with a gap matching with the article and a cover film. The cover layer is a flat construction and comprises a first main surface facing the article. A plastic layer is arranged on the first main surface of the cover layer; the plastic layer and the cover layer are provided with a plurality of perforations; the second main surface of the middle layer is arranged on the plastic layer; the gap of the middle layer is matched and filled with the relative article; the article is arranged on the plastic layer with incomplete cover on the gap; at least one additional surface is left; the cover film covers the article main parts which are not arranged on the plastic layer and mostly stick closely to the shell; and the cover film is connected with a first main surface of the middle layer and connected with the plastic layer adhesively in at least one additional surface area. The improved arranging structure with at least one to-be-packaged article and a transport package can meet a prerequisite condition in terms of removal in environment with improved requirement for cleanness.
Description
Technical field
The utility model has been described and has been used for going out mostly the factory site
Transport the layout of at least one article to be packaged and at the manufacture method of such layout.Article to be packaged in the meaning of the literature are Eltec product and power semiconductor modular especially in the case in particular.Below, therefore describe the utility model by means of such power semiconductor modular, but be not that ubiquity of the present utility model is limited.In the case, preferably a plurality of power semiconductor modulars with the matrix arrangement of one dimension or bidimensional in transport package.
Background technology
Known in principle in a large number at the different transport package of power semiconductor modular, as have simple cardboard case packing or the plastic wrapping of matrix and lid.By at the packing of terminal consumer's commodity known so-called skin packaging (Skin-Verpackungen).For example the simple cardboard case packing according to DE3909898A1 generally have following shortcoming, that is, it can not protect power semiconductor modular to avoid mechanically influence in the situation of transportation fully.Other shortcoming is, such packing for example must be opened for the check in the framework of customs's program and may directly contact power semiconductor modular thus, this with possible mode can be based on electrostatic discharge or based on tactiosensible surface, for example cause through the connection element of silver coating damaging.
For example formed the basic departure point of this utility model by the known so-called skin packaging of DE19928368A1, and described skin packaging is the combination of the plastic film of cardboard and encirclement commodity to be packaged.This packing has following main shortcoming as everyone knows, that is, it is difficult for realizing the simple process of opening and taking out of the commodity through packing.
By the known packing at power semiconductor modular of DE102010005048A1, it has cap rock, interlayer (both are preferably made by paper or ground paper) and epiphragma.In the case, cap rock is configured with first interarea that faces power semiconductor modular to be arranged with being the face formula.This first interarea at cap rock is furnished with interlayer, and this interlayer has its second interarea.Arrange the power semiconductor modular of attaching troops to a unit to some extent at least one space on first interarea of cap rock, wherein, the base member of this power semiconductor modular is on first interarea of cap rock, and wherein, epiphragma covers the main portions of the housing of at least one power semiconductor modular with reclining, and wherein, epiphragma is connected with first interarea of interlayer in addition.In the case disadvantageously, interlayer and/or cap rock are mechanically damaged in the situation of opening such packing, because part wherein is attached on the epiphragma.Because may there be the particle as the pollution of power semiconductor modular or working environment of interlayer and/or cap rock in these damages.
The utility model content
The utility model namely, improves the such layout that has at least one article to be packaged and transport package based on following task, wherein, also can satisfy the precondition at taking-up especially in the environment that the spatter property that has raising requires.
The utility model provides a kind of article to be packaged and arrangement structure of transport package of having, wherein, described article have housing, it is characterized in that, described transport package has cap rock, have interlayer and the epiphragma of attaching troops to a unit in the space of described article, and in the case, described cap rock is face formula ground structure, be configured with first interarea that faces described article, be furnished with plastic layer and described cap rock has perforation together with plastic layer at described first interarea of described cap rock, described interlayer is arranged on the described plastic layer with its second interarea, and in the space of described interlayer, attach troops to a unit described item placement in described space on described plastic layer and not exclusively hide described space in the case, but at least one additional facet of having left a blank, wherein, what described epiphragma covered described article is not seated in part on the described plastic layer, abut in the case on the described housing, and wherein, described epiphragma is connected in the zone of at least one described additional facet with first interarea of described interlayer and with described plastic layer (130) with adhering.
Thought of the present utility model is based on the top mentioned packing of at least one article to be packaged, especially power semiconductor modular.Below, be not to limit ubiquity of the present utility model ground accordingly, only one of them is described as a reference in other words with a kind of article to be packaged respectively, wherein, also should be understood that the article to be packaged of a plurality of identical type respectively here.Article to be packaged, the connection element that namely power semiconductor modular especially to be packaged preferably has the substrate of base member, for example metal, the housing made by insulating material and the outside that is used for the power semiconductor structure element of relative bottom plate built-in electrical insulation ground layout contact.Wherein, the concept of power semiconductor modular also can broadly be understood here and for example also should be understood that disc semiconductor unit (Scheibenzellen).Transport package according to layout of the present utility model has cap rock, has interlayer and the epiphragma of attaching troops to a unit in the space of article to be packaged (having the space of attaching troops to a unit in the situation at a plurality of article respectively) with regard to it.The cap rock that preferably is configured to let out the combination board of electricity on its globality is face formula ground structure and forms the basis of transport package thus.Be furnished with plastic layer and item placement thereon at first interarea of this cap rock.The complex that is made of cap rock and plastic layer has a large amount of perforation aspect it that.
Similarly this plastic layer at cap rock is furnished with the interlayer that has at the space of the article of attaching troops to a unit.Following in the case is particularly preferred, namely, the edge in the space of interlayer only maximum 50%, preferably only maximum 25% ground directly abuts on the article of attaching troops to a unit and remaining part and the article at edge have spacing, and thus there at least one not covered additional facet respectively be configured to the part face of plastic layer.Advantageously, plastic layer and interlayer are with sealed ground of the material ways of connecting between them, stacked on top of each other loosely not.
Epiphragma covers the main portion of article to be packaged and abuts in housing in the case to a great extent and be not on the connection element of part on the plastic layer of cap rock, for example power semiconductor modular.Wherein the concept of housing also can be understood and the boundary outside of the article that ordinary representation is to be packaged at large here.In addition, epiphragma is connected with plastic layer adhesion ground with first interarea of interlayer and in the zone of at least one additional facet, wherein preferably, and adhesion ground, the surface of epiphragma self structure.To this alternatively, however first interarea that faces epiphragma of interlayer and plastic layer have the adhered layer that is connected for the epiphragma adhesion in possible mode also whole ground at least in the zone of additional facet.In the case preferably, with have being connected of plastic layer the adherence force of comparing with interlayer that is connected significantly little at least 2 times adherence force.Obviously, the complex that is made of cap rock and plastic layer is compared and is also had obviously stronger adherence force relative to each other being connected of the relative plastic layer of epiphragma.
If following is preferred for the protection of article to be packaged and these Eltec products are that relative electrostatic discharge as power semiconductor modular is preferred; that is, epiphragma by the outside that has or do not have metal evaporation can conduct maybe can let out the electricity
Plastic film is made.Also advantageously, however epiphragma at least range selector ground preferably intactly pellucidly the structure.
In addition preferably, interlayer and/or cap rock are made by ground paper or cardboard.To compare interlayer thinner and then when mechanically still less constructing rigidly when cap rock in addition, is favourable, in order to can easily unpack, this is undertaken by cap rock is mentioned by the remainder of transport package.
When the face method that is parallel to the interarea of cap rock and is parallel to housing at least one dimension when these article in a plurality of situations that are arranged in the article in one dimension matrix or the bidimensional matrix has greater than the spacing of the width of housing on this dimension towards each other, draw other embodiment preferred.Following thus is possible, that is, two such layouts make up and be combined into half spacing of two article with staggering relative to each other the master layout of the high packed bulk density of article relative to each other with first interarea of capping.
Preferably, in arrangement structure of the present utility model, epiphragma is connected with the adhesion of interlayer to have compares epiphragma and double at least high adherence force of being connected of intermediate coat.
Preferably, in arrangement structure of the present utility model, cap rock has the thickness from 0.2mm to 2mm, and interlayer has from 0.5 to 3mm thickness, and then the height of comparing article to be packaged has obviously less thickness.
The manufacturing of such layout is carried out by means of following manufacturing step of following successively in mode of the present utility model:
Plastic layer is arranged with first interarea of the cap rock of preferably being made by ground paper and be connected;
The a large amount of perforation of structure are extremely passed the complex that is made of cap rock and plastic layer outwardly by the surface;
Layout has the interlayer in space and article to be packaged, especially power semiconductor modular is arranged in this space, and wherein, at least one additional facet on plastic layer that is not covered by article is left a blank in the case.Preferably, interlayer and/or cap rock are made by ground paper or cardboard.Similarly following is favourable, that is, cap rock compare interlayer more unfertile land so that mechanically still less rigidly the structure;
Cover interlayer and article ground and arrange epiphragma.Advantageously, epiphragma heating power ground before applying low pressure is loaded.Preferably the elasticity of this epiphragma is enhanced in the case, and the sealed parcel property of the shape of article to be packaged is enhanced thus.
Advantageously, this epiphragma is made by the plastic film that maybe can let out electricity that can conduct of the outside that has or do not have metal evaporation.
Similarly following is preferred, that is, the surface that faces interlayer of epiphragma be adhesion, namely for example be configured with adhesive-layer.Alternatively, the layer of adhesion can be arranged on the zone to be hidden of cap rock, especially plastic layer and interlayer;
Low pressure is applied on second interarea of cap rock, is drawn onto epiphragma on interlayer, at least one additional facet and the article by perforation thus and has constructed and being connected of the adhesion of epiphragma.
The corresponding manufacturing of this layout in other words according to design plan of the present utility model by this layout is achieved as follows, that is, the cap rock that in the situation of unpacking, only has a plastic layer through arranging separate with epiphragma and in the case plastic layer be retained on the cap rock.Thus, cap rock is not damaged.Because cap rock is not connected with interlayer adhesion ground, so its surface is not damaged in the situation of unpacking yet.Thus, after unpacking, only there is unspoiled surface, also can not occur thus because the pollution of particle.
Description of drawings
Embodiment by Fig. 1 to Fig. 5 is described further solution of the present utility model.
Fig. 1 shows two according to layout of the present utility model with the three-dimensional representation form;
Fig. 2 shows manufacturing according to the key step of layout of the present utility model;
Fig. 3 shows the cross section of passing according to layout of the present utility model;
Fig. 4 and Fig. 5 show other cross section of passing according to layout of the present utility model.
The specific embodiment
Fig. 1 has shown two according to the layout 1,1 ' that respectively has transport package 2 and a plurality of power semiconductor modular 5 of the present utility model with the three-dimensional representation form.Respectively show housing 50 and a plurality of connection element 60 by these power semiconductor modulars 5.Utilize their sightless base member 40(referring to Fig. 2, herein the substrate of metal), these power semiconductor modulars 5 are connected on the plastic layer 130 with the bidimensional matrix.Power semiconductor modular 5 is arranged in such a way on first interarea 100 of the cap rock 10 of separately transport package 2, that is, base member 40(is referring to Fig. 2) each is directly located thereon.
Following can be preferred equally, and the edge 220 in space 230 does not abut on the power semiconductor modular 5.Produce the additional facet 140 around power semiconductor modular 5 in the case.
Unshowned is the transparent epiphragma 30 of transport package 30 self, this epiphragma surrounds power semiconductor modular 5 except its base member 40, and this epiphragma is connected with second interarea 210 of interlayer 20 and with at least one additional facet 140 adhesion ground of plastic layer 130.If only be provided with additional facet 140 around power semiconductor modular 5 structure form thus around the connection of adhesion, this connections be similar to surround power semiconductor modular 5 airtightly and prevent certain environmental concerns, as moisture.
In the situation of a plurality of power semiconductor modulars 5 in the bidimensional matrix arrangements shown here, as in the situation of arranging at one dimension, be favourable equally in addition, arrange that when being illustrated in second here the transport package 2 under 1 ' the situation has punching 70(also with reference to Fig. 3 between power semiconductor modular 5 separately) so that when the separation of the power semiconductor modular 5 of packaging is simplified.
Fig. 2 has shown the main step according to the manufacturing of layout of the present utility model in four part illustrations.In first step, be furnished with plastic layer 130 and be connected with it enduringly at first interarea 100 of cap rock 10.In the case, cap rock 10 is made of ground paper or cardboard and has preferred thickness between 0.2mm and 2mm, and plastic layer is preferably by the PET(polyethylene terephthalate) or the PP(polypropylene) make and have preferred thickness in the scope between 5 μ m and 30 μ m.Be right after its this complex of ground and be provided with a large amount of perforation 150, they are extremely constructed outwardly by the surface.The diameter in this space preferably is between 0.1mm and the 1mm and allows to pass complex thus low pressure is applied on the opposed side.
In next step, arrange and have the interlayer 20 in space 230 and in these spaces, respectively arrange power semiconductor modular 5.Leave a blank in the case additional facet 140 on plastic layer 130, these additional facets be can't help power semiconductor modular 5 and are covered.In the case, interlayer 20 all is not connected with plastic layer 130 adhesion ground with separately power semiconductor modular 5.Carry out referring to the appropriate structures in the space 230 of Fig. 1 by separately the location of power semiconductor modular 5.
Next, epiphragma 30 being covered their ground on interlayer 20 and power semiconductor modular 5 arranges.Following in the case may be essential, that is, before directly being arranged on the power semiconductor modular and still epiphragma loaded at interval the location therewith with between 80 ° of C and the 160 ° of C, the temperature between 90 ° of C and 110 ° of C in particular.Thus, the elasticity of epiphragma is improved and then that follow and shape power semiconductor modular are sealed compares this and can obviously carry out in the situation that no temperature loads with improving temporarily.Following in addition is favourable, that is, those face adhesion ground, the surface structure of interlayer 20 and power semiconductor modular 5 at least.To this alternatively, first interarea 200 that faces epiphragma 30 of interlayer 20 has the adhered layer that is connected for epiphragma 30 adhesions at least with plastic layer 130 in the zone of additional facet 140.At this, this adhered layer utilization deposition (Abscheide) method, for example pressure method are executed cloth on the zone of additional facet.If be activated, this adhered layer can be executed cloth on plastic layer in whole ground this adhered layer heating power, or cloth is executed on whole ground except the zone that covers power semiconductor modular.
By applying by in the low pressure shown in a plurality of arrows at second interarea, 110 places of cap rock 10, be drawn onto on interlayer 20, additional facet 140 and the power semiconductor modular 5 by 150 epiphragmas 30 of boring a hole at these second interarea, 110 places.Constructed being connected of adhesion of interlayer and additional facet 140 and epiphragma 30 in the case.In the case importantly, at the confining force of the adhesion between epiphragma 30 and the interlayer 20 with at least 2 times of confining forces greater than the adhesion between epiphragma 30 and plastic layer 130.By this design plan following being avoided like that as described above, that is, cap rock 10 and interlayer 20 are not damaged in opening the situation of transport package.
Fig. 3 intercept ground has shown along line A-A and has passed the cross section according to layout 1 of the present utility model according to Fig. 1.Here show the cap rock 10 that is arranged in the plastic layer 130 on its first interarea 100 having of transport package 2.On plastic layer 130, being rectangularly has power semiconductor modular to be packaged 5 with the pitch arrangement that is equal to each other.Only show base member 40, housing 50 and connection element 60 by power semiconductor modular to be packaged 5.
Following is favourable, that is, this power semiconductor modular 5 is arranged on the plastic layer 130 with its base member 40, and this base member can be the base plate of metal usually or also can directly be the substrate of internal wiring.Yet this is not the restriction to following possibility, that is, power semiconductor modular 5 one of them in its longitudinal axis rotated 90 ° or 180 ° of ground layouts.Here in the situation of set design plan, connection element 60 be in power semiconductor modular 5 with cap rock 10 opposed sides on.
In addition, interlayer 20 has space 230, and the power semiconductor modular 5 of attaching troops to a unit thus is besieged and be fixed in its position in its lower area.Yet the additional facet 140 that keeps plastic layer 130 in the case, this additional facet be can't help power semiconductor modular 5 or interlayer 20 and are hidden.Whole periphery at power semiconductor modular 5 is set as follows, namely, edge 220 maximums 50% in space 230, preferably only maximum 25% ground directly abuts on the power semiconductor modular 5 of attaching troops to a unit, and the part relative power semiconductor module 5 of the reservation at edge 220 has at least 2mm, the spacing of 5mm and constructed zone line 240 thus on additional facet 140 at least preferably.Yet, directly recline at least at some positions, preferably in the turning of power semiconductor modular 5, be necessary referring to Fig. 1, therefore guarantee power semiconductor modular 5 fixing in their location relative to each other.
At the typical sizes of such power semiconductor modular 5 do not derive thus restrictedly be width 500 and height under the situation of 1cm to 6cm length in the scope of 3cm to 15cm.The cap rock 10 of transport package 2 has the typical thickness from 0.2mm to 2mm, and interlayer 20 has from 0.5 to 3mm thickness, and epiphragma 30 has from the thickness of 50 μ m to 250 μ m.
By by the outside that has or do not have metal evaporation can conduct or can let out
The design plan of the epiphragma 30 made of plastic layer and the design plan of the cap rock 10 made by the combination board that can conduct or can let out electricity produce following transport package 2, it provides and prevents that charged electrostatically from protecting fully.Yet because the epiphragma 30 preferred transparent structure fully in section ground at least, so even also need not to open this protection packing for different check purposes.
In addition, according to designing as follows according to layout 1 of the present utility model of Fig. 3, namely, power semiconductor modular 5 their spacing relative to each other 700 are greater than the width 500 of power semiconductor modular 5, following thus is possible, namely, what be shown in dotted line second arranges that 1 ' arranges 1 stagger half pitch and rotate 180 ° of ground (referring to Fig. 1) is set relative to first, draws when single power semiconductor modular 5 relative to each other the master layout that has the compactness of high packed bulk density in the fixing fully situation thus.
Fig. 4 and Fig. 5 have shown along line B-B and have passed other cross section according to layout 1 of the present utility model according to Fig. 1 that wherein, the special advantage of this layout becomes apparent.Fig. 4 has shown the part of power semiconductor modular 5 and transport package 2 again.Yet in the case, cap rock 10 partly illustrates with interlayer 20 dividually together with plastic layer 130.This diagram is corresponding to opening transport package 2, so as with power semiconductor modular 5 from wherein taking out.In the case, only being connected in the zone line 240 between the additional facet 140 of plastic layer 130 and epiphragma 30 separated.
On the one hand following for this reason is essential, that is, being connected between epiphragma 30 and interlayer 20 compared epiphragma 30 and had obvious higher adherence force being connected of plastic layer 130.Also advantageously, cap rock 10 is compared interlayer 20 than unfertile land and then structure rigidly still less mechanically, because interlayer keeps as the maintenance framework of the remainder of transport package 2 to a certain extent and exists thus.
Fig. 5 has shown other cross section that power semiconductor modular 5 is taken out now from transport package 2.In the case, interlayer 20 is pressed in the direction of the face normal direction of its first interarea 200, on interlayer 20 almost is in by the formed plane of the upper side of housing 50.Under this situation about moving of interlayer 20, epiphragma 30 is at least part of to be unclamped with housing 50 power semiconductor modular 5, and this power semiconductor modular can be easily and taken out from transport package 2 in the situation of serviceable tool not thus.
Claims (10)
1. layout (1) structure that has article to be packaged (5) and transport package (2), wherein, described article (5) have housing (50), it is characterized in that, described transport package (2) has cap rock (10), have interlayer (20) and the epiphragma (30) of attaching troops to a unit in the space (230) of described article (5), and in the case, described cap rock (10) is face formula ground structure, be configured with first interarea (100) that faces described article (5), be furnished with plastic layer (130) and described cap rock (10) has perforation (150) together with plastic layer (130) at described first interarea (100) of described cap rock (10), described interlayer (20) is arranged on the described plastic layer with its second interarea (210), and in the space (230) of described interlayer (20), attach troops to a unit and be arranged in described plastic layer (130) upward and not exclusively hide described space (230) in the case in the described article (5) in described space, but at least one additional facet (140) of having left a blank, wherein, what described epiphragma (30) covered described article (5) is not seated in part on the described plastic layer (130), abut in the case on the described housing (50), and wherein, described epiphragma (30) is connected in the zone of at least one described additional facet (140) with first interarea (200) of described interlayer (20) and with described plastic layer (130) with adhering.
2. layout according to claim 1 (1) structure is characterized in that, described article (5) to be packaged are the Eltec products.
3. layout according to claim 2 (1) structure is characterized in that, described article (5) to be packaged are power semiconductor modulars.
4. layout according to claim 1 (1) structure is characterized in that, described plastic layer (130) and described interlayer (20) be not there to be sealed ground of material ways of connecting, stacked on top of each other loosely.
5. layout according to claim 1 (1) structure, it is characterized in that, adhesion ground, the surface structure that faces described interlayer of described epiphragma, or wherein, first interarea (200) that faces described epiphragma (30) of described interlayer (20) has the adhered layer that is connected for described epiphragma (30) adhesion at least with described plastic layer (130) in the zone of described additional facet (140).
6. layout according to claim 1 (1) structure is characterized in that, described epiphragma (30) is connected with the adhesion of described interlayer (20) to have compares described epiphragma (30) and double at least high adherence force of being connected of described intermediate coat (130).
7. layout according to claim 1 (1) structure is characterized in that, described epiphragma (30) is made by the plastic layer that maybe can let out electricity that can conduct of the outside that has or do not have metal evaporation.
8. layout according to claim 1 (1) structure is characterized in that, described interlayer (20) and/or described cap rock (10) are made by ground paper or cardboard.
9. layout according to claim 1 (1) structure is characterized in that, described cap rock (10) compare described interlayer (20) more unfertile land so that mechanically still less rigidly the structure.
10. layout according to claim 9 (1) structure, it is characterized in that described cap rock (10) has to have from 0.5 to 3mm thickness and then the height of comparing article to be packaged (5) from the thickness of 0.2mm to 2mm and described interlayer (20) and has obviously less thickness.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011114309.6A DE102011114309B4 (en) | 2011-09-23 | 2011-09-23 | Arrangement with at least one object to be packaged and a transport packaging and manufacturing method thereof |
| DE102011114309.6 | 2011-09-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203211717U true CN203211717U (en) | 2013-09-25 |
Family
ID=46796445
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012204917942U Withdrawn - After Issue CN203211717U (en) | 2011-09-23 | 2012-09-24 | Arranging structure with at least one to-be-packaged article and transport package |
| CN201210359335.3A Active CN103010579B (en) | 2011-09-23 | 2012-09-24 | With at least one article to be packaged and the arrangement of transportation and packing and manufacture method |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210359335.3A Active CN103010579B (en) | 2011-09-23 | 2012-09-24 | With at least one article to be packaged and the arrangement of transportation and packing and manufacture method |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2573006B1 (en) |
| CN (2) | CN203211717U (en) |
| DE (1) | DE102011114309B4 (en) |
| DK (1) | DK2573006T3 (en) |
| ES (1) | ES2530499T3 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103010579A (en) * | 2011-09-23 | 2013-04-03 | 赛米控电子股份有限公司 | Assembly with at least one object to be packaged and a transport package and production method for same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019100951A1 (en) * | 2019-01-15 | 2020-07-16 | Osram Opto Semiconductors Gmbh | Storage device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4757895A (en) * | 1984-09-20 | 1988-07-19 | Gelzer John R | Article packaging system |
| DE8603299U1 (en) * | 1986-02-07 | 1986-07-31 | Siemens AG, 1000 Berlin und 8000 München | Belt packaging of SMD components |
| DE3909898A1 (en) | 1989-03-25 | 1990-09-27 | Semikron Elektronik Gmbh | PACKAGING CONTAINERS AND CUTS FOR THE PRODUCTION OF SUCH A CONTAINER |
| DE9115696U1 (en) | 1991-12-18 | 1992-03-05 | Hagner, Hans, 7295 Dornstetten | Skin packaging |
| ATE227232T1 (en) | 1998-06-22 | 2002-11-15 | Hawera Probst Gmbh | SALES PACKAGING |
| DE10204675A1 (en) * | 2002-02-06 | 2003-08-14 | Lohmann Therapie Syst Lts | Airtight skin packaging with high water vapor impermeability and aroma protection |
| US20040124119A1 (en) * | 2002-12-30 | 2004-07-01 | Ahn Seung Bae | Carrier tape for use in the automated parts-implanting machine for carrying parts therewith |
| DE102010005047B4 (en) * | 2010-01-20 | 2014-10-23 | Semikron Elektronik Gmbh & Co. Kg | Arrangement with at least one power semiconductor module and with a transport packaging |
| DE102010005048A1 (en) * | 2010-01-20 | 2011-07-21 | SEMIKRON Elektronik GmbH & Co. KG, 90431 | Arrangement with at least one power semiconductor module and with a transport packaging |
| DE102011114309B4 (en) * | 2011-09-23 | 2019-03-07 | Kartonveredlung Knapp GmbH | Arrangement with at least one object to be packaged and a transport packaging and manufacturing method thereof |
-
2011
- 2011-09-23 DE DE102011114309.6A patent/DE102011114309B4/en active Active
-
2012
- 2012-09-04 DK DK12182945.1T patent/DK2573006T3/en active
- 2012-09-04 EP EP12182945.1A patent/EP2573006B1/en active Active
- 2012-09-04 ES ES12182945T patent/ES2530499T3/en active Active
- 2012-09-24 CN CN2012204917942U patent/CN203211717U/en not_active Withdrawn - After Issue
- 2012-09-24 CN CN201210359335.3A patent/CN103010579B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103010579A (en) * | 2011-09-23 | 2013-04-03 | 赛米控电子股份有限公司 | Assembly with at least one object to be packaged and a transport package and production method for same |
| CN103010579B (en) * | 2011-09-23 | 2016-08-17 | 赛米控电子股份有限公司 | With at least one article to be packaged and the arrangement of transportation and packing and manufacture method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103010579A (en) | 2013-04-03 |
| DE102011114309A1 (en) | 2013-03-28 |
| ES2530499T3 (en) | 2015-03-03 |
| DK2573006T3 (en) | 2015-02-16 |
| CN103010579B (en) | 2016-08-17 |
| EP2573006A1 (en) | 2013-03-27 |
| DE102011114309B4 (en) | 2019-03-07 |
| EP2573006B1 (en) | 2014-11-12 |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20130925 Effective date of abandoning: 20160817 |
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| C25 | Abandonment of patent right or utility model to avoid double patenting |