JPH11198987A - Method and apparatus for packing semiconductor chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly efficient method for packingly which semiconductor chips do not crack nor break when the semiconductor chips are packed and carried and which does not need a lot of individual packing containers nor loading works. SOLUTION: A semiconductor wafer 2 fixed on a wafer fixing tool 100 is divided into a plurality of semiconductor chips 2a in such a way as to leave the outer shape of the wafer and a plurality of articles wherein an interlayer paper 6 and a cushioning material made of a cushioning sheet 7 are placed both sides of the wafer fixing tool 100 are prepd. and plastic-made base sheets 8 are arranged on the highest part and the lowest part to form a basic constitutional part and this basic constitutional part is placed in a storing bag and the inside of the bag is sealed by vacuum.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method and an apparatus for packaging semiconductor devices used for storing, transporting, or transporting semiconductor chips (individual semiconductor devices on which integrated circuits are formed).

[0002]

2. Description of the Related Art A conventional semiconductor chip packaging method and packaging apparatus will be described with reference to FIGS.

FIG. 4A is a plan view of a wafer fixing tool used for cutting a semiconductor wafer into semiconductor chips, and FIG. 4B is a cross-sectional view taken along line AA of FIG. is there.

In FIG. 4, a wafer fixing tool 100 is shown.
Comprises a pressure-sensitive adhesive sheet 1 and a fixing ring 3, on which a semiconductor wafer 2 is adhered and fixed. Fixing ring 3 arranged around adhesive sheet 1
Is for expanding and holding the pressure-sensitive adhesive sheet 1 so that the semiconductor wafer 2 can be easily cut, and is used together with the pressure-sensitive adhesive sheet 1. Line 4 indicates a cutting trace of a cutter blade of a wafer cutting device (not shown).

FIG. 5 is a perspective view showing the external appearance of an individual container in which the semiconductor chips 2a are arranged side by side. The individual container 5 is called a chip tray, and a semiconductor chip 2 is provided on a surface portion thereof.
A pocket 5a for storing a is provided.

Next, a conventional semiconductor chip packaging process will be described. Normally, the semiconductor wafer 2 cut into IC chips as shown in FIG.
The finished product is obtained through an assembly process such as an external electrode wiring process and a sealing process.

[0007] The completed semiconductor chip 2a is subjected to an inspection process, packed in a container such as a tube, tray, or embossed tape, and then subjected to interior work (bag filling, interior box packing work) and exterior work (cardboard cardboard etc.). Packing multiple inner boxes in the outer box) before shipment.

In recent years, in order to achieve even higher density mounting, the number of cases where customers are supplied with semiconductor chips instead of finished products from semiconductor manufacturers and assemble them in-house have been increasing.

In order to meet such needs, the following steps are performed as a method of shipping semiconductor chips. (1) The semiconductor chip 2a is picked up one by one from the wafer fixing tool 100 shown in FIG.
Into the pocket 5a. (2) A plurality of chip trays 5 in which the semiconductor chips 2a have been packed are stacked, and an empty chip tray 5 serving as a lid is finally placed. This is shown in FIG. (3) The chip tray group of (2) is fixed with binding parts (rubber rubber, tapes, etc.) not shown. (4) The bundled chip trays of (3) are packed in a moisture-proof bag (not shown) to perform deaeration sealing, and a plurality of the trays are packed in an inner bag box and an outer box while protecting with a cushioning material before shipping.

[0010]

Since the conventional packaging process for shipping semiconductor chips is configured as described above, there are the following problems. (1) Put the semiconductor chip 2a in the pocket 5 of the chip tray 5.
In the operation of packing into a, a device for mounting is required, and labor and cost are required. (2) As the mounting device, since the semiconductor chips 2a are picked up and handled one by one using a tool such as suction tweezers, the surface of the semiconductor chip 2a may be damaged. The pocket 5a of the chip tray 5
The semiconductor chip 2a may move inside the semiconductor chip, and the semiconductor chip 2a is easily cracked or chipped, and the quality of the semiconductor integrated circuit cannot be maintained. (3) The semiconductor chip 2a that fits in one of the chip trays 5
Is at most several tens, so a large number of chip trays is required.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and there is no need to pack semiconductor chips into a chip tray. Provided are a highly efficient semiconductor device packaging apparatus and a packaging method that do not require an individually packaged container.

[0012]

According to a first aspect of the present invention, there is provided a method of packaging a semiconductor chip, comprising: dividing a semiconductor wafer fixed to a wafer fixing tool into a plurality of semiconductor chips so that the outer shape of the wafer remains; Prepare a plurality of wafer fixing tools with both sides sandwiched between buffer materials such as interlayer paper and a buffer sheet, and arrange a substrate made of plastic or the like at the top and bottom to form the basic components, It is characterized in that the basic components are put in a storage bag and the inside of the bag is brought into close contact.

According to a second aspect of the present invention, there is provided an apparatus for packaging a semiconductor chip, comprising a wafer fixing tool in which a semiconductor wafer is divided and fixed to a plurality of semiconductor chips so that the outer shape of the semiconductor wafer remains. A basic component is formed by sandwiching both sides of the fixing tool between buffer materials such as interlayer paper and a buffer sheet, and arranging substrates on the uppermost and lowermost portions thereof, and forming the basic component in a storage bag. It is characterized in that the inside is brought into close contact.

The invention according to claim 3 is characterized in that the basic components are put in a storage bag and the inside of the storage bag is vacuum-sealed.

The invention according to claim 4 is characterized in that the basic components are put in a storage bag, put in an inner box, and a plurality of inner boxes are packed in an outer box.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a perspective view showing the basic components of a semiconductor chip packaging apparatus and a packaging method according to a first embodiment of the present invention, and FIG. 2 is a side view showing how the basic components overlap.

The semiconductor wafer 2 and the wafer fixing tool 100 shown in FIGS. 1 and 2 are the same as those shown in FIG. That is, the wafer fixing tool 100 is composed of the adhesive sheet 1 and the fixing ring 3, and the adhesive sheet 1
The semiconductor wafer 2 is adhered and fixed thereon. The semiconductor wafer 2 has already been cut into individual semiconductor chips 2a by a wafer cutting device (not shown), and the cut individual semiconductor chips 2a remain in the form of leaving the outer shape of the semiconductor wafer. It is in a state of being in close contact with the adhesive sheet 1. When the semiconductor wafer 2 is cut, the fixing ring 3 disposed around the adhesive sheet 1
The line 4 indicates a trace of a cutter blade of a wafer cutting device (not shown).

In the first embodiment, first, the wafer is cut into individual semiconductor chips 2a by a wafer cutting device (not shown), and the semiconductor chip 2a is in close contact with the adhesive sheet 1 while leaving the outer shape of the semiconductor wafer. A plurality of fixing tools 100 (see FIG. 4) are prepared. In order to protect the surface of the semiconductor chip 2a on the front and back sides of each wafer fixing tool 100, an interlayer paper 6 and a buffer sheet 7 such as urethane foam are interposed as buffer materials. Thereafter, a substrate 8 made of plastic or the like is disposed at the uppermost portion and the lowermost portion to form a basic component 9 in a sandwich state.

FIG. 3 is an explanatory view of a step of packing the above-mentioned basic components 9 in a bag and a box. In the figure, the basic constituent part 9 is put in a moisture-proof bag 10 made of an aluminum laminate structure or the like, the inside of the bag is evacuated, and the opening of the moisture-proof bag 10 is sealed with a heat seal or the like (a degassing seal, a nitrogen replacement seal, etc.). I do. Then, the sealed storage unit 11 is placed in the interior box 12, and the plurality of interior boxes 12 are packed in the exterior box 13.

As described above, according to the first embodiment, the work of packing each semiconductor chip 2a into the pocket 5a of the chip tray 5, which is a conventional problem, becomes unnecessary, and the labor and cost for the operation are increased. do not do. Further, at the time of packaging and transporting the semiconductor chips, it is not necessary to pick up and handle the semiconductor chips 2a one by one using a tool such as suction tweezers, so that the surface of the semiconductor chips 2a is not damaged.

In the basic components 9 stored in the storage bag unit 11, the individual semiconductor chips 2a are fixed to the wafer fixing tool 100 and sandwiched between buffer materials such as interlayer paper 6 and buffer sheets 7. Since the uppermost and lowermost portions are protected by the substrate 8 and are vacuum-sealed in a sandwich state, the semiconductor chip 2a does not move, and cracking and chipping do not occur.

The wafer fixing tool 100 shown in FIG.
Is used as it is as a semiconductor chip individual container.
The accommodation efficiency of the semiconductor chip 2a per one becomes high,
Further, the chip tray 5 shown in FIG. 5 becomes unnecessary.

In the first embodiment, the interior box 12
Although the case using both the outer box 13 and the outer box 13 is shown, either of them may be omitted. The interior box 12 may contain a deoxidizing material, a desiccant, and the like.

[0024]

As described above, according to the present invention, the semiconductor wafer is packaged and transported in a state in which the semiconductor wafer has been cut into a plurality of semiconductor chips. This eliminates the necessity, and thus has the effect of reducing labor and labor costs. In addition, since semiconductor chips are not picked up and handled one by one by suction tweezers or the like when packaging and transporting the semiconductor chips, there is no possibility that the semiconductor chip surface is damaged.

In the basic components stored in the storage bag, the individual semiconductor chips are fixed to the wafer fixing tool, and are sandwiched between cushioning materials, the uppermost and lowermost portions are protected by the substrate, and the vacuum sealing is performed. As a result, the semiconductor chip does not move, and cracking and chipping do not occur.

Further, since the semiconductor chips are brought into close contact with the wafer fixing tool while leaving the outer shape of the semiconductor wafer and used as individual packaging containers, there is an effect that the efficiency of accommodating one semiconductor chip increases.

[Brief description of the drawings]

FIG. 1 is a perspective view showing basic components of a semiconductor chip packaging apparatus and a packaging method according to a first embodiment of the present invention.

FIG. 2 is a side view showing basic components of a semiconductor chip packaging device and a packaging method according to Embodiment 1 of the present invention;

FIG. 3 is an explanatory diagram of a step of bagging and boxing basic components according to the first embodiment of the present invention.

FIG. 4 is a plan view and a cross-sectional view of a tool used for cutting a semiconductor wafer into semiconductor chips.

FIG. 5 is a perspective view showing a conventional semiconductor chip packaging container.

[Explanation of symbols]

Reference Signs List 1 adhesive sheet, 2 semiconductor wafer, 2a semiconductor chip, 3 fixing ring, 6 interlayer paper, 7 buffer sheet, 8
Substrate, 9 basic components, 10 moisture-proof bag, 12 inner box, 13 outer box, 100 wafer fixing tool.

Claims (4)

[Claims] 1. A semiconductor wafer fixed to a wafer fixing tool is divided into a plurality of semiconductor chips so that the outer shape of the wafer remains, and a plurality of semiconductor chips having both sides of the wafer fixing tool sandwiched between cushioning materials are prepared. A method for packaging a semiconductor chip, comprising: forming a basic component by arranging a substrate at an uppermost portion and a lowermost portion thereof; placing the basic component in a bag; 2. A wafer fixing tool, wherein a semiconductor wafer is divided and fixed to a plurality of semiconductor chips so that the outer shape of the wafer remains, and both side portions of the plurality of wafer fixing tools are sandwiched between cushioning materials. A semiconductor chip packaging apparatus in which a substrate is disposed at the uppermost and lowermost portions to form a basic component, and the basic component is placed in a bag and the inside of the bag is brought into close contact. 3. The semiconductor chip packaging apparatus according to claim 2, wherein the basic components are put in a bag and the inside of the bag is vacuum-sealed. 4. The packaging of a semiconductor chip according to claim 2, wherein the basic components are put in a bag in an interior box, and a plurality of interior boxes are packed in an exterior box. apparatus.