JP2020166217A - 感光性樹脂組成物、ドライフィルム、硬化物、および電子部品 - Google Patents
感光性樹脂組成物、ドライフィルム、硬化物、および電子部品 Download PDFInfo
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- JP2020166217A JP2020166217A JP2019069328A JP2019069328A JP2020166217A JP 2020166217 A JP2020166217 A JP 2020166217A JP 2019069328 A JP2019069328 A JP 2019069328A JP 2019069328 A JP2019069328 A JP 2019069328A JP 2020166217 A JP2020166217 A JP 2020166217A
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- Prior art keywords
- bis
- dianhydride
- resin composition
- film
- alkali
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 66
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- 239000011347 resin Substances 0.000 claims abstract description 68
- 239000012948 isocyanate Substances 0.000 claims abstract description 46
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 40
- 125000003277 amino group Chemical group 0.000 claims abstract description 39
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 36
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 22
- 238000003776 cleavage reaction Methods 0.000 claims abstract description 10
- 125000000962 organic group Chemical group 0.000 claims abstract description 10
- 230000007017 scission Effects 0.000 claims abstract description 10
- 230000001588 bifunctional effect Effects 0.000 claims description 27
- 238000001035 drying Methods 0.000 claims description 13
- 239000003504 photosensitizing agent Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052802 copper Inorganic materials 0.000 abstract description 11
- 239000010949 copper Substances 0.000 abstract description 11
- 125000000524 functional group Chemical group 0.000 abstract description 11
- 239000004020 conductor Substances 0.000 abstract description 9
- 239000004642 Polyimide Substances 0.000 abstract description 8
- 229920001721 polyimide Polymers 0.000 abstract description 8
- 239000002243 precursor Substances 0.000 abstract description 7
- 239000003795 chemical substances by application Substances 0.000 abstract description 6
- 238000009413 insulation Methods 0.000 abstract 1
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- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 66
- -1 tetracarboxylic acid dianhydride Chemical class 0.000 description 59
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 42
- 239000002253 acid Substances 0.000 description 35
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- 150000008064 anhydrides Chemical class 0.000 description 14
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 14
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 14
- 239000000126 substance Substances 0.000 description 13
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 11
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
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- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 8
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- 239000010703 silicon Substances 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 239000012298 atmosphere Substances 0.000 description 7
- 150000004985 diamines Chemical class 0.000 description 7
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 6
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
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- 125000003118 aryl group Chemical group 0.000 description 6
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- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 4
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 4
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
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- 230000015572 biosynthetic process Effects 0.000 description 4
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 239000010419 fine particle Substances 0.000 description 4
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 229910010272 inorganic material Inorganic materials 0.000 description 4
- 239000011147 inorganic material Substances 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000007363 ring formation reaction Methods 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 description 3
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 125000004018 acid anhydride group Chemical group 0.000 description 3
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical class [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920002577 polybenzoxazole Polymers 0.000 description 3
- 238000011160 research Methods 0.000 description 3
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- 239000007921 spray Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 150000003457 sulfones Chemical class 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 2
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- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical group C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 2
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 2
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 2
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
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Abstract
Description
また、本発明の他の目的は、該樹脂組成物から得られる樹脂層を有するドライフィルム、該樹脂組成物または該ドライフィルムの樹脂層の硬化物、該硬化物を有する電子部品を提供することにある。
(一般式(1)中、Xは4価の有機基であり、Yは2価の有機基である)
(一般式(1)中、Xは4価の有機基であり、Yは2価の有機基である)
また、本発明の感光性樹脂組成物は、(D)2官能以上のブロックイソシアネートのイソシアネート基を介して、(A)アルカリ可溶性樹脂(ポリアミック酸)のカルボキシル基と(C)アミノ基を有するシランカップリング剤のアミノ基とが結合し、さらに(C)アミノ基を有するシランカップリング剤中の無機材料と反応する官能基(シラノール基)が、シリコンウエハと結合することで、得られる硬化物は優れた密着性を有するものとなる。
従来から、アミノ基を有するシランカップリング剤が有するシラノール基がシリコンウエハとの密着性を向上させることができることは知られていた。しかしながら、従来、アミノ基を有するシランカップリング剤が、本発明のように、2官能以上のブロックイソシアネートと併用されることはなかった。このため、アルカリ可溶性樹脂(ポリアミック酸)とアミノ基を有するシランカップリング剤のアミノ基を結合させるためには、高い反応温度が必要であった。
本発明の感光性樹脂組成物は、(A)アルカリ可溶性樹脂を含む。本発明の(A)アルカリ可溶性樹脂は、下記一般式(1)で示される繰り返し単位を有したポリアミック酸、すなわちポリイミド前駆体であるが、加熱により構造中にアミド酸が脱水閉環してポリイミドを形成する。また、ポリアミック酸は、ポリベンゾオキサゾール前駆体であってもよい。
(一般式(1)中、Xは4価の有機基であり、Yは2価の有機基である)
本発明の感光性樹脂組成物は、(B)感光剤を含む。(B)感光剤としては、特に制限はなく、光酸発生剤や光塩基発生剤を用いることができる。光酸発生剤は、紫外線や可視光等の光照射により酸を発生する化合物であり、光塩基発生剤は、同様の光照射により分子構造が変化するか、または、分子が開裂することにより1種以上の塩基性物質を生成する化合物である。本発明においては、(B)感光剤として、光酸発生剤を好適に用いることができる。
本発明の感光性樹脂組成物は、(C)アミノ基を有するシランカップリング剤を含む。シラン系カップリング剤は、分子内に有機材料と反応する官能基と、無機材料と反応する官能基を同時に有する有機ケイ素化合物である。有機材料と反応する官能基としては、ビニル基、エポキシ基、スチリル基、メタクリロキシ基、アクリロキシ基、アミノ基、ウレイド基、クロロプロピル基、メルカプト基、ポリスルフィド基、イソシアネート基等が挙げられ、無機材料と反応する官能基は、アルコキシル基、アセトキシ基等が挙げられる。本発明におけるアミノ基を有するシランカップリング剤は、前記有機材料と反応する官能基としてアミノ基を有する。
本発明の感光性樹脂組成物は、(D)2官能以上のブロックイソシアネートを含む。この2官能以上のブロックイソシアネート化合物に含まれるブロックイソシアネート基は、イソシアネート基がブロック剤との反応により保護されて一時的に不活性化された基である。所定温度に加熱されたときにそのブロック剤が開裂してイソシアネート基が生成する。本発明においては、(D)2官能以上のブロックイソシアネートの開裂温度は150℃以上であり、このため、塗布工程後の120℃程度の乾燥工程では、2官能以上のブロックイソシアネートのイソシアネート基を介した反応が進行しない。このため、本発明の感光性樹脂組成物は現像性に優れる。
本発明の感光性樹脂組成物には、本発明の効果を損なわない範囲で、(A)アルカリ可溶性樹脂(ポリアミック酸)のカルボキシル基と架橋反応し、低温硬化性を向上するために公知の架橋剤、(A)アルカリ可溶性樹脂(ポリアミック酸)のイミド化反応を促進するために、公知の可塑剤や熱酸発生剤、光感度を向上させるために公知の増感剤、基材との接着性向上のため(C)アミノ基を有するシランカップリング剤以外のシランカップリング剤などの公知の密着剤などを配合することもできる。更に、本発明の感光性樹脂組成物に加工特性や各種機能性を付与するために、その他に様々な有機または無機の低分子または高分子化合物を配合してもよい。例えば、界面活性剤、レベリング剤、微粒子等を用いることができる。微粒子には、ポリスチレン、ポリテトラフルオロエチレン等の有機微粒子、シリカ、カーボン、層状珪酸塩等の無機微粒子が含まれる。また、本発明の感光性樹脂組成物に各種着色剤および繊維等を配合してもよい。
本発明の感光性樹脂組成物に用いられる溶剤は、(A)アルカリ可溶性樹脂、(B)感光剤、(C)アミノ基を有するシランカップリング剤、(D)2官能以上のブロックイソシアネートおよび他の成分を溶解させるものであれば特に限定されない。一例としては、N,N’−ジメチルホルムアミド、N−メチルピロリドン、N−エチル−2−ピロリドン、N,N’−ジメチルアセトアミド、ジエチレングリコールジメチルエーテル、シクロペンタノン、γ−ブチロラクトン、α−アセチル−γ−ブチロラクトン、テトラメチル尿素、1,3−ジメチル−2−イミダゾリノン、N−シクロヘキシル−2−ピロリドン、ジメチルスルホキシド、ヘキサメチルホスホルアミド、ピリジン、γ−ブチロラクトン、ジエチレングリコールモノメチルエーテルを挙げることができる。これらは単独で用いても、二種以上を混合して用いてもかまわない。使用する溶剤の量は、塗布膜厚や粘度に応じて適宜に定めることができる。例えば、(A)アルカリ可溶性樹脂100質量部に対し、50〜9,000質量部の範囲で用いることができる。
本発明のドライフィルムは、本発明の感光性樹脂組成物をフィルム(例えば支持(キャリア)フィルム)に塗布後、乾燥して得られる樹脂層を有するものである。この樹脂層を、基材に接するようにラミネートして使用される。
支持フィルムとしては、例えば2〜150μmの厚さのポリエチレンテレフタレート等のポリエステルフィルム等の熱可塑性フィルムが用いられる。
保護フィルムとしては、ポリエチレンフィルム、ポリプロピレンフィルム等を使用することができるが、樹脂層との接着力が、支持フィルムよりも小さいものが良い。
本発明の硬化物は、上述した本発明の感光性樹脂組成物を用い所定のステップにて硬化させたものである。その硬化物であるパターン膜は、公知慣用の製法で製造すればよく、例えば、(B)感光剤としての光酸発生剤を含有するポジ型感光性樹脂組成物の場合、次の各ステップにより製造する。
感光性樹脂組成物の塗膜が形成される基材に特に制限はなく、シリコンウエハ等の半導体基材、配線基板、各種樹脂、金属等に広く適用できる。
2,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン(BAPP)5.54g、4,4’−ジアミノジフェニルエーテル(ODA)3.30gをスクリュー管に測り取り、乾燥雰囲気(20℃、20%RH)でN−メチルピロリドン47mLに溶解させた。攪拌して溶解させたのち、乾燥雰囲気で4,4’−オキシジフタル酸無水物(ODPA)8.38gを徐々に加え、室温で一晩(16時間)反応させた。その後、5−ノルボルネン−2,3−ジカルボン酸無水物(NA)を加えて室温で8時間反応させアルカリ可溶性樹脂(A−1)を得た。アルカリ可溶性樹脂の数平均分子量(Mn)は8,500、重量平均分子量(Mw)は23,900、Mw/Mnは2.81であった。
2,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン(BAPP)4.35g、4,4’−ジアミノジフェニルエーテル(ODA)2.59gをスクリュー管に測り取り、乾燥雰囲気(20℃、20%RH)でN−メチルピロリドン47mLに溶解させた。攪拌して溶解させたのち、乾燥雰囲気で4,4’−オキシジフタル酸無水物(ODPA)9.31gを徐々に加え、室温で一晩(16時間)反応させた。その後、m−アミノフェノールを加えて室温で8時間反応させアルカリ可溶性樹脂(A−2)を得た。アルカリ可溶性樹脂の数平均分子量(Mn)は9,300、重量平均分子量(Mw)は22,400、Mw/Mnは2.41であった。
2,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン(BAPP)5.54g、4,4’−ジアミノジフェニルエーテル(ODA)3.30gをスクリュー管に測り取り、乾燥雰囲気(20℃、20%RH)でN−メチルピロリドン47mLに溶解させた。攪拌して溶解させたのち、乾燥雰囲気で4,4’−オキシジフタル酸無水物(ODPA)8.38gを徐々に加え、室温で一晩(16時間)反応させた。その後、トリメリット酸無水物を加えて室温で8時間反応させアルカリ可溶性樹脂(A−3)を得た。アルカリ可溶性樹脂の数平均分子量(Mn)は8,500、重量平均分子量(Mw)は23,900、Mw/Mnは2.81であった。
上記で合成したアルカリ可溶性樹脂(A−1)〜(A−3)100質量部に対して、表1示す各成分を表1に示す割合で配合し、さらに、アルカリ可溶性樹脂(A−1)〜(A−3)100質量部に対して30質量部のγ―ブチロラクトンを加え、完全に溶解させ感光性樹脂組成物のワニスを得た。なお、表1中の配合量はすべて不揮発成分換算の配合量である。
シリコンウエハ上に銅をスパッタリングし、それぞれ200〜500nmの厚みで形成された金属材料層を表面に有する基板(以降、銅スパッタ基板と呼ぶ)を用意した。ワニスを、スピンコーターを用いて銅スパッタ基板上塗布し、次いでホットプレートを用いて110℃で3分間乾燥させ、感光性樹脂組成物の乾燥膜(12μm)を得た。次に、イナートガスオーブン(光洋サーモシステム(株)製CLH−21CD−S)中、窒素雰囲気下、110℃で10分間加熱した後、150℃で30分間保持し、さらに昇温して200℃ で60分加熱して膜厚10μmの硬化膜を得た。
このようにして得た硬化膜に片刃を使用して1mm間隔で100マスの碁盤目状の切り込みをいれ、PCT装置を用いて121℃、2気圧の飽和条件で100時間PCT処理を行なった後、セロテープ(登録商標)による引き剥がしによって100マスのうち何マス剥がれたかを計測した。評価基準は以下の通りとした。
◎:剥がれ個数が0であった。
○:剥がれ個数が1であった。
△:剥がれ個数が2〜9であった。
×:剥がれ個数が10〜であった。
ワニスを、スピンコーターを用いてシリコンウエハ上に塗布し、110℃で3分間乾燥させ、感光性樹脂組成物の乾燥膜を得た。その後、イナートガスオーブン(光洋サーモシステム(株)製CLH−21CD−S)中、窒素雰囲気下、110℃で10分加熱した後、150℃で30分間保持し、さらに昇温して200℃で60分加熱して膜厚45μmの硬化膜を得た。
このようにして得た硬化膜を、PCT装置を用いて121℃、100%RH、60分の条件下で硬化膜を剥離した後、島津製作所社製のEZ−SXを用いた引張試験により破断伸びを測定した。評価基準は以下の通りとした。
◎:破断伸びが20%以上であった。
○:破断伸びが19〜10%であった。
△:破断伸びが9〜1%であった。
×:自立膜を得られなかった。
ワニスを、スピンコーターを用いて銅スパッタシリコン基板上に塗布し、ホットプレートで110℃3分間乾燥させて得た、厚さ12μmの感光性樹脂組成物の乾燥膜に、露光量800mJ/cm2のi線を照射し露光した後、2.38%テトラメチルアンモニウムヒドロキシド(TMAH)水溶液で80秒間現像し、水でリンスし、ポジ型パターンを得た。
このようにして得たポジ型パターンについて、光学膜厚計を用いて、現像前と現像後の膜厚を計測し、下記式により残膜率を求めた。
未露光部残膜率[%]=(未露光部現像後膜[μm]/未露光部現像前膜厚[μm])×100
評価基準は以下の通りとした。
○ :未露光部残膜率が110〜85%であった。
△ :未露光部残膜率が84〜70%であった。
× :未露光部残膜率が69%以下であった。
××:未露光部残膜率が110%超であった。
(*2):前述のアルカリ可溶性樹脂(A−2)(アミノフェノール末端ポリアミック酸)
(*3):前述のアルカリ可溶性樹脂(A−3)(トリメリット酸末端ポリアミック酸)
(*4):(株)三宝化学研究所製TKF−525、(以下の構造式である)
(*5):信越化学工業(株)製KBM−573、(以下の構造式で、アミノ基を有する)
(*6):信越化学工業(株)製KBM−603、(以下の構造式で、アミノ基を有する)
(*7):信越化学工業(株)製KBM−903、(以下の構造式で、アミノ基を有する)
(*8):信越化学工業(株)製KBM−3033、(以下の構造式で、アミノ基を有しない)
(*9):東ソー(株)製コロネート BI−301(開裂温度150℃)
(*10):東ソー(株)製コロネート BI−2507(開裂温度150−160℃)
(*11):旭化成(株)製デュラネート 17B−60P(開裂温度130℃)
Claims (4)
- (A)アルカリ可溶性樹脂と、
(B)感光剤と、
(C)アミノ基を有するシランカップリング剤と、
(D)2官能以上のブロックイソシアネートと、を含み、
前記(A)アルカリ可溶性樹脂が、下記一般式(1)で示される繰り返し単位を有したポリアミック酸を含み、
前記(D)2官能以上のブロックイソシアネートの開裂温度が150℃以上であることを特徴とする感光性樹脂組成物。
(一般式(1)中、Xは4価の有機基であり、Yは2価の有機基である) - フィルム上に、請求項1記載の感光性樹脂組成物を塗布、乾燥して得られる樹脂層を有することを特徴とするドライフィルム。
- 請求項1の感光性樹脂組成物、または請求項2記載のドライフィルムの樹脂層を硬化して得られることを特徴とする硬化物。
- 請求項3に記載の硬化物を有することを特徴とする電子部品。
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