JP2020140978A - 素子実装基板の製造方法 - Google Patents
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Abstract
Description
基板上に素子が実装された素子実装基板を製造する方法であって、
仮固定材上に素子の一方の面を保持させて該素子を配列させた素子付仮固定材を準備する、素子付仮固定材準備工程(I)と、
該素子のもう一方の面が基板上に付着するように、該素子付仮固定材を該基板上に配置する、素子付仮固定材配置工程(II)と、
該基板上に付着した該素子から該仮固定材を剥離する仮固定材剥離工程(III)と、
を含む。
本発明の素子実装基板の製造方法は、基板上に素子が実装された素子実装基板を製造する方法である。本発明の素子実装基板の製造方法によれば、素子を高い位置精度で実装できるので、実装位置不良による歩留まり低下を解消できる。
素子付仮固定材準備工程(I)においては、仮固定材上に素子の一方の面を保持させて該素子を配列させた素子付仮固定材を準備する。
素子付仮固定材配置工程(II)においては、素子付仮固定材に保持された素子のもう一方の面が基板上に付着するように、素子付仮固定材を該基板上に配置する。図2に、素子付仮固定材配置工程(II)の説明図を示す。図2において、素子付仮固定材100は、素子10のもう一方の面10bが基板200の上に付着するように配置され、仮固定材付実装基板300が得られる。
仮固定材剥離工程(III)においては、基板上に付着した素子から仮固定材を剥離する。図3に、仮固定材剥離工程(III)の説明図を示す。図3において、素子付仮固定材配置工程(II)によって得られる仮固定材付素子実装基板300から、仮固定材20が剥離され、基板200上に素子10が実装された素子実装基板1000が得られる。
本発明の素子実装基板の製造方法の一つの実施形態(実施形態1)は、1種の素子を用い、素子付仮固定材準備工程(I)と素子付仮固定材配置工程(II)と仮固定材剥離工程(III)とをそれぞれ1回ずつ含むことにより、基板上に1種の素子が実装された素子実装基板を製造する方法である。代表的には、図3に示すような、基板200上に素子10が実装された素子実装基板1000である。この場合、基板200上に素子10が高い位置精度で実装される。
本発明の素子実装基板の製造方法の別の一つの実施形態(実施形態2)は、n種類(nは2以上の整数)の素子を用い、素子付仮固定材準備工程(I)と素子付仮固定材配置工程(II)と仮固定材剥離工程(III)とをそれぞれn回ずつ含むことにより、基板上にn種類の素子が実装された素子実装基板を製造する方法である。
本発明において採用し得る素子としては、本発明の効果を損なわない範囲で、任意の適切な素子を採用し得る。このような素子としては、代表的には半導体素子であり、例えば、LED、マイクロLED、ミニLEDなどが挙げられる。
本発明において採用し得る仮固定材としては、本発明の効果を損なわない範囲で、任意の適切な仮固定材を採用し得る。このような仮固定材としては、好ましくは、素子付仮固定材準備工程(I)において素子の一方の面を一時的に保持させることができ、素子付仮固定材配置工程(II)において素子を一時的に保持させた状態で該素子のもう一方の面を基板上に配置および付着させることができ、仮固定材剥離工程(III)において素子から剥離できるものである。
本発明において採用し得る基板としては、本発明の効果を損なわない範囲で、任意の適切な基板を採用し得る。このような基板としては、例えば、シリコン基板、多結晶シリコン基板、サファイヤ基板、シリコンカーバイド基板、化合物半導体(リン化ガリウム、ヒ化ガリウム、リン化インジウム、窒化ガリウム)基板、ガラスエポキシ基板、ポリイミドなどの有機材料基板、ガラス基板、セラミック基板、金属基板などが挙げられる。
配列したRGB素子の位置精度を評価した。RGB素子間の距離が50μm以内であれば○、50μmより大きいと×とした。
一方の面にダイアタッチフィルムを設けた20μmサイズのマイクロLEDのG素子のもう一方の面に、吸着性を有する厚み100μmのシリコーン発泡シートを貼り合せた。次に、厚み150μmのシリコン基板に、位置を調整してダイアタッチフィルムの面を貼り合せて圧着した。その後、シリコーン発泡シートをピール剥離した。
次に、一方の面にダイアタッチフィルムを設けた20μmサイズのマイクロLEDのR素子のもう一方の面に、吸着性を有する厚み100μmのシリコーン発泡シートを貼り合せ、ベイヤー配列となるように、上記シリコン基板に貼り合せて圧着した。その後、シリコーン発泡シートをピール剥離した。
さらに、一方の面にダイアタッチフィルムを設けた20μmサイズのマイクロLEDのB素子のもう一方の面に、吸着性を有する厚み100μmのシリコーン発泡シートを貼り合せ、ベイヤー配列となるように、上記シリコン基板に貼り合せて圧着した。その後、シリコーン発泡シートをピール剥離した。
以上のようにして、シリコン基板上にマイクロLEDのRGB素子が配列した素子実装基板(1)を得た。
実装の位置精度の評価結果は○であった。
仮固定材として、粘着力が大きいNo.375(日東電工株式会社製、包装用OPPテープ)を用いた以外は、実施例1と同様に行ったところ、シリコン基板上にマイクロLEDのRGB素子を配列することができなかった。
Claims (3)
- 基板上に素子が実装された素子実装基板を製造する方法であって、
仮固定材上に素子の一方の面を保持させて該素子を配列させた素子付仮固定材を準備する、素子付仮固定材準備工程(I)と、
該素子のもう一方の面が基板上に付着するように、該素子付仮固定材を該基板上に配置する、素子付仮固定材配置工程(II)と、
該基板上に付着した該素子から該仮固定材を剥離する仮固定材剥離工程(III)と、
を含む、
素子実装基板の製造方法。 - 前記素子がLEDチップである、請求項1に記載の素子実装基板の製造方法。
- 前記LEDチップがマイクロLEDチップである、請求項2に記載の素子実装基板の製造方法。
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JP2019033021A JP7266947B2 (ja) | 2019-02-26 | 2019-02-26 | 素子実装基板の製造方法 |
US17/421,798 US20220093816A1 (en) | 2019-02-26 | 2019-12-03 | Method for manufacturing element mounting substrate |
CN201980093144.7A CN113474901A (zh) | 2019-02-26 | 2019-12-03 | 元件安装基板的制造方法 |
KR1020217026673A KR20210129065A (ko) | 2019-02-26 | 2019-12-03 | 소자 실장 기판의 제조 방법 |
PCT/JP2019/047142 WO2020174797A1 (ja) | 2019-02-26 | 2019-12-03 | 素子実装基板の製造方法 |
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JP2010161221A (ja) | 2009-01-08 | 2010-07-22 | Sony Corp | 実装基板の製造方法、実装基板および発光装置 |
US10002856B1 (en) * | 2017-01-26 | 2018-06-19 | International Business Machines Corporation | Micro-LED array transfer |
CN111063649B (zh) * | 2019-12-03 | 2022-11-01 | 深圳市华星光电半导体显示技术有限公司 | Micro LED的转移方法及转移装置 |
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JP2010251360A (ja) * | 2009-04-10 | 2010-11-04 | Sony Corp | 表示装置の製造方法および表示装置 |
WO2017124332A1 (en) * | 2016-01-20 | 2017-07-27 | Goertek.Inc | Micro-led transfer method and manufacturing method |
JP2018074024A (ja) * | 2016-10-31 | 2018-05-10 | 凸版印刷株式会社 | 透光性無機led光源シート及びその製造方法並びに複合面状発光体 |
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US20190058081A1 (en) * | 2017-08-18 | 2019-02-21 | Khaled Ahmed | Micro light-emitting diode (led) display and assembly apparatus |
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KR20210129065A (ko) | 2021-10-27 |
TW202032818A (zh) | 2020-09-01 |
WO2020174797A1 (ja) | 2020-09-03 |
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