JP2020136354A - スイッチング装置および電子機器 - Google Patents
スイッチング装置および電子機器 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
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Abstract
【解決手段】実施形態のスイッチング装置は、第一スイッチング素子と、第二スイッチング素子と、ホルダと、を有する。第一スイッチング素子および第二スイッチング素子は、並列に接続されている。第一スイッチング素子は、複数の端子を有する。第二スイッチング素子は、複数の端子を有し第一スイッチング素子から当該第一スイッチング素子の厚さ方向に離れて設けられる。ホルダは、第一スイッチング素子を収容するキャビティが設けられ第一スイッチング素子と第二スイッチング素子との間にキャビティの底部を有する保持部材と、キャビティに対向して保持部材上に設けられ第二スイッチング素子に電気的に接続された接続部と、接続部と第一スイッチング素子の端子とを接続する導体と、を有する。
【選択図】図1
Description
図1は、電子機器1の一部の断面図である。図1に示されるように、電子機器1は、スイッチング装置10と、回路基板20と、を備えている。電子機器1は、例えば、インバータ装置であるが、これには限定されない。
図9は、本実施形態の電子機器1Aの断面図である。図9に示されるように、ホルダ100Aは、回路基板20Aと接する保持部材110Aと、回路基板20Aとは接しない保持部材110と、を有している。本実施形態では、保持部材110Aの構成と、保持部材110の構成とが、相違している。保持部材110Aは、回路基板20Aと接続される接続部110fを有している。保持部材110は、第1実施形態の保持部材110と同様の構成を有している。また、保持部材110Aは、接続部110fを除き、保持部材110と同様の構成を有している。
Claims (6)
- 複数の端子を有した第一スイッチング素子と、
複数の端子を有し前記第一スイッチング素子から当該第一スイッチング素子の厚さ方向に離れて設けられた第二スイッチング素子と、
前記第一スイッチング素子を収容するキャビティが設けられ前記第一スイッチング素子と前記第二スイッチング素子との間に前記キャビティの底部を有する保持部材と、前記キャビティに対向して前記保持部材上に設けられ前記第二スイッチング素子に電気的に接続された接続部と、前記接続部と前記第一スイッチング素子の前記端子とを接続する導体と、を有するホルダと、
を有し、
前記第一スイッチング素子および前記第二スイッチング素子が並列に接続された、スイッチング装置。 - 前記導体は、前記保持部材を前記厚さ方向に貫通し前記厚さ方向の両端において露出し、
前記導体と前記端子とが前記厚さ方向に重なるとともに電気的に接続されかつ接合された、請求項1に記載のスイッチング装置。 - 前記ホルダは、前記厚さ方向に積層され同一構成を有した複数の前記保持部材を有した、請求項1または2に記載のスイッチング装置。
- 前記保持部材は、プリント配線板である、請求項1〜3のうちいずれか一つに記載のスイッチング装置。
- 複数の端子を有した第一スイッチング素子と、
複数の端子を有し前記第一スイッチング素子から当該第一スイッチング素子の厚さ方向に離れて設けられた第二スイッチング素子と、
前記第一スイッチング素子を収容するキャビティが設けられ前記第一スイッチング素子と前記第二スイッチング素子との間に前記キャビティの底部を有する保持部材と、前記キャビティに対向して前記保持部材上に設けられ前記第二スイッチング素子に電気的に接続された接続部と、前記接続部と前記第一スイッチング素子の前記端子とを接続する導体と、を有するホルダと、
を有し、前記第一スイッチング素子および前記第二スイッチング素子が並列に接続された、スイッチング装置と、
前記スイッチング装置が実装された回路基板と、
を備えた、電子機器。 - 前記回路基板には、前記スイッチング装置の少なくとも一部を収容した開口が設けられた、請求項5に記載の電子機器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019024803A JP7195964B2 (ja) | 2019-02-14 | 2019-02-14 | スイッチング装置および電子機器 |
CN201910603040.8A CN111642069B (zh) | 2019-02-14 | 2019-07-05 | 开关装置以及电子设备 |
US16/560,160 US10917972B2 (en) | 2019-02-14 | 2019-09-04 | Switching device and electronic device |
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JP2019024803A JP7195964B2 (ja) | 2019-02-14 | 2019-02-14 | スイッチング装置および電子機器 |
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JP2020136354A true JP2020136354A (ja) | 2020-08-31 |
JP7195964B2 JP7195964B2 (ja) | 2022-12-26 |
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US (1) | US10917972B2 (ja) |
JP (1) | JP7195964B2 (ja) |
CN (1) | CN111642069B (ja) |
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FR3127346A1 (fr) * | 2021-09-20 | 2023-03-24 | Psa Automobiles Sa | Element de commutation electrique pour interconnecter des barres de courant d’un systeme de distribution d’energie electrique |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57119548U (ja) * | 1981-01-16 | 1982-07-24 | ||
JPH0537121A (ja) * | 1991-01-30 | 1993-02-12 | Mitsui High Tec Inc | 半導体装置実装用基板およびこれを用いた半導体装置の実装方法 |
JPH08148635A (ja) * | 1994-11-21 | 1996-06-07 | Fujitsu Ltd | 半導体装置 |
JP2007019454A (ja) * | 2005-07-08 | 2007-01-25 | Samsung Electronics Co Ltd | チップ挿入型媒介基板の構造及びその製造方法、並びにこれを用いた異種チップのウェーハレベル積層構造及びパッケージ構造 |
JP2016197677A (ja) * | 2015-04-06 | 2016-11-24 | 三菱電機株式会社 | パワー半導体装置および車載用回転電機の駆動装置 |
JP2018081980A (ja) * | 2016-11-15 | 2018-05-24 | 株式会社東芝 | 半導体装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02229461A (ja) | 1989-03-02 | 1990-09-12 | Hitachi Maxell Ltd | 半導体装置 |
JP2002305284A (ja) | 2001-02-05 | 2002-10-18 | Mitsubishi Electric Corp | 半導体装置積層構造体 |
JP5273095B2 (ja) * | 2010-05-24 | 2013-08-28 | 株式会社デンソー | 半導体装置 |
JP5626567B2 (ja) | 2010-08-06 | 2014-11-19 | 株式会社ジェイテクト | 素子実装基板の組み立て方法 |
EP2988328B1 (en) * | 2014-08-19 | 2021-05-12 | ABB Schweiz AG | Power semiconductor module and method of manufacturing the same |
-
2019
- 2019-02-14 JP JP2019024803A patent/JP7195964B2/ja active Active
- 2019-07-05 CN CN201910603040.8A patent/CN111642069B/zh active Active
- 2019-09-04 US US16/560,160 patent/US10917972B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57119548U (ja) * | 1981-01-16 | 1982-07-24 | ||
JPH0537121A (ja) * | 1991-01-30 | 1993-02-12 | Mitsui High Tec Inc | 半導体装置実装用基板およびこれを用いた半導体装置の実装方法 |
JPH08148635A (ja) * | 1994-11-21 | 1996-06-07 | Fujitsu Ltd | 半導体装置 |
JP2007019454A (ja) * | 2005-07-08 | 2007-01-25 | Samsung Electronics Co Ltd | チップ挿入型媒介基板の構造及びその製造方法、並びにこれを用いた異種チップのウェーハレベル積層構造及びパッケージ構造 |
JP2016197677A (ja) * | 2015-04-06 | 2016-11-24 | 三菱電機株式会社 | パワー半導体装置および車載用回転電機の駆動装置 |
JP2018081980A (ja) * | 2016-11-15 | 2018-05-24 | 株式会社東芝 | 半導体装置 |
Also Published As
Publication number | Publication date |
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CN111642069A (zh) | 2020-09-08 |
JP7195964B2 (ja) | 2022-12-26 |
US10917972B2 (en) | 2021-02-09 |
CN111642069B (zh) | 2023-09-19 |
US20200267840A1 (en) | 2020-08-20 |
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