JP2020124804A5 - - Google Patents

Download PDF

Info

Publication number
JP2020124804A5
JP2020124804A5 JP2020075214A JP2020075214A JP2020124804A5 JP 2020124804 A5 JP2020124804 A5 JP 2020124804A5 JP 2020075214 A JP2020075214 A JP 2020075214A JP 2020075214 A JP2020075214 A JP 2020075214A JP 2020124804 A5 JP2020124804 A5 JP 2020124804A5
Authority
JP
Japan
Prior art keywords
shaped glass
polishing
disk
glass substrate
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020075214A
Other languages
Japanese (ja)
Other versions
JP2020124804A (en
JP7003178B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2020075214A priority Critical patent/JP7003178B2/en
Priority claimed from JP2020075214A external-priority patent/JP7003178B2/en
Publication of JP2020124804A publication Critical patent/JP2020124804A/en
Publication of JP2020124804A5 publication Critical patent/JP2020124804A5/ja
Priority to JP2021214297A priority patent/JP7397844B2/en
Application granted granted Critical
Publication of JP7003178B2 publication Critical patent/JP7003178B2/en
Priority to JP2023147348A priority patent/JP2023165755A/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (11)

1つ又は複数の薄板ガラス基板を切り出すための円盤状ガラス基板の製造方法であって、
円形の2つの主表面を有するガラス素板である円盤状ガラス素板を準備することと、
前記円盤状ガラス素板の前記2つの主表面の各々の外縁部を面取りすることと、
面取りされた前記円盤状ガラス素板の前記2つの主表面を両面研削装置で研削することと、
研削された前記円盤状ガラス素板の前記2つの主表面を両面研磨装置で研磨することによって板厚が50〜500μmの円盤状ガラス基板を作製することとを含む
ことを特徴とする円盤状ガラス基板の製造方法。
A method for manufacturing a disk-shaped glass substrate for cutting out one or more thin glass substrates.
To prepare a disk-shaped glass base plate, which is a glass base plate having two circular main surfaces,
Chamfering the outer edges of each of the two main surfaces of the disk-shaped glass base plate
Grinding the two main surfaces of the chamfered disk-shaped glass base plate with a double-sided grinding device, and
A disc-shaped glass characterized in that a disc- shaped glass substrate having a plate thickness of 50 to 500 μm is produced by polishing the two main surfaces of the ground disc-shaped glass base plate with a double-sided polishing device. Substrate manufacturing method.
記円盤状ガラス基板の板厚は350μm以下である
ことを特徴とする請求項1に記載の円盤状ガラス基板の製造方法。
Method for producing a disk-shaped glass substrate of claim 1, the thickness of the pre-Kien discotic glass substrate is characterized in that at 350μm or less.
前記研磨することでは、前記研削された円盤状ガラス素板の2つの主表面を研磨することによって、直径が70〜210mmの円盤状ガラス基板を作製する
ことを特徴とする請求項1又は2に記載の円盤状ガラス基板の製造方法。
The polishing according to claim 1 or 2, wherein a disc-shaped glass substrate having a diameter of 70 to 210 mm is produced by polishing the two main surfaces of the ground disc-shaped glass base plate. The method for manufacturing a disk-shaped glass substrate according to the description.
前記研磨することでは、前記研削された円盤状ガラス素板の2つの主表面を研磨することによって、二乗平均平方根粗さRqが0.4nm以下の円盤状ガラス基板を作製する
ことを特徴とする請求項1から3のいずれか1項に記載の円盤状ガラス基板の製造方法。
The polishing is characterized in that a disk-shaped glass substrate having a root mean square roughness Rq of 0.4 nm or less is produced by polishing the two main surfaces of the ground disk-shaped glass base plate. The method for manufacturing a disk-shaped glass substrate according to any one of claims 1 to 3.
前記研磨することでは、前記研削された円盤状ガラス素板の2つの主表面を研磨することによって、平行度が1.0μm未満の円盤状ガラス基板を作製する
ことを特徴とする請求項1から4のいずれか1項に記載の円盤状ガラス基板の製造方法。
From claim 1, the polishing is characterized in that a disk-shaped glass substrate having a parallelism of less than 1.0 μm is produced by polishing two main surfaces of the ground disk-shaped glass base plate. The method for manufacturing a disk-shaped glass substrate according to any one of 4.
前記研磨することでは、前記研削された円盤状ガラス素板の2つの主表面を研磨することによって、平行度が0.5μm以下の円盤状ガラス基板を作製する
ことを特徴とする請求項5に記載の円盤状ガラス基板の製造方法。
5. The method of polishing is characterized in that a disk-shaped glass substrate having a parallelism of 0.5 μm or less is produced by polishing two main surfaces of the ground disk-shaped glass base plate. The method for manufacturing a disk-shaped glass substrate according to.
前記面取りされた円盤状ガラス素板の外周端面及び面取り面以外の板厚をt1ミリメートル、
前記面取りされた円盤状ガラス素板の外周端面の板厚をt2ミリメートル、
したとき、
t1×0.15<t2<t1×0.4を満たす
ことを特徴とする請求項1から6のいずれか1項に記載の円盤状ガラス基板の製造方法。
The thickness of the chamfered disc-shaped glass base plate other than the outer peripheral end surface and the chamfered surface is t1 mm.
The thickness of the outer peripheral end face of the chamfered disk-shaped glass base plate is t2 mm.
When you and,
t1 × 0.15 <t2 <t1 × 0. The method for manufacturing a disk-shaped glass substrate according to any one of claims 1 to 6, wherein the method 4 is satisfied.
前記面取りされた円盤状ガラス素板の外周端面の板厚をt2ミリメートル、The thickness of the outer peripheral end face of the chamfered disk-shaped glass base plate is t2 mm.
前記研磨することによって作製される円盤状ガラス基板の外周端面及び面取り面以外の板厚をt3ミリメートル、としたとき、 When the plate thickness other than the outer peripheral end surface and the chamfered surface of the disk-shaped glass substrate produced by the polishing is t3 mm.
t3×0.5<t2 を満たす Satisfy t3 × 0.5 <t2
ことを特徴とする請求項1から7のいずれか1項に記載の円盤状ガラス基板の製造方法。 The method for manufacturing a disk-shaped glass substrate according to any one of claims 1 to 7, wherein the disk-shaped glass substrate is manufactured.
記研削すること及び前記研磨することでは、前記面取り面の少なくとも一部が残存する範囲の取り代で、前記円盤状ガラス素板の前記2つの主表面が研削されて研磨される
ことを特徴とする請求項1からのいずれか1項に記載の円盤状ガラス基板の製造方法。
Is by that and the polishing pre Symbol grinding, characterized in that at least a portion of the chamfered surface at the allowance range remaining, the two major surfaces of the disc-shaped glass workpieces are polished are ground The method for manufacturing a disk-shaped glass substrate according to any one of claims 1 to 8 .
前記研磨することによる取り代は、10〜150μmである
ことを特徴とする請求項1からのいずれか1項に記載の円盤状ガラス基板の製造方法。
The allowance due to polishing is disc-shaped glass substrate manufacturing method according to any one of claims 1 9, characterized in that a. 10 to 150 [mu] m.
前記研磨することは、
前記研削された円盤状ガラス素板の前記2つの主表面を前記両面研磨装置で研磨する第1研磨を施すことと、
前記第1研磨が施された円盤状ガラス素板の前記2つの主表面を前記両面研磨装置で研磨する第2研磨を施すこととを含み、
前記第1研磨と前記第2研磨とでは、それぞれの前記両面研磨装置に適用される研磨パッドと研磨スラリとの組み合わせが互いに異なる
ことを特徴とする請求項1から10のいずれか1項に記載の円盤状ガラス基板の製造方法。
The polishing is
The first polishing of polishing the two main surfaces of the ground disc-shaped glass base plate with the double-sided polishing device is performed.
The present invention includes performing a second polishing in which the two main surfaces of the disk-shaped glass base plate subjected to the first polishing are polished by the double-sided polishing apparatus.
Wherein said first and polishing in the second polishing, according to any one of claims 1 to 10 in combination with a polishing pad and a polishing slurry is applied to each of the double-side polishing apparatus are different from each other to each other How to manufacture a disk-shaped glass substrate.
JP2020075214A 2020-04-21 2020-04-21 Manufacturing method of disk-shaped glass substrate, manufacturing method of thin glass substrate, manufacturing method of light guide plate and disk-shaped glass substrate Active JP7003178B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2020075214A JP7003178B2 (en) 2020-04-21 2020-04-21 Manufacturing method of disk-shaped glass substrate, manufacturing method of thin glass substrate, manufacturing method of light guide plate and disk-shaped glass substrate
JP2021214297A JP7397844B2 (en) 2020-04-21 2021-12-28 Method for manufacturing a disc-shaped glass substrate, method for manufacturing a thin glass substrate, method for manufacturing a light guide plate, and disc-shaped glass substrate
JP2023147348A JP2023165755A (en) 2020-04-21 2023-09-12 Disk-shaped glass substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020075214A JP7003178B2 (en) 2020-04-21 2020-04-21 Manufacturing method of disk-shaped glass substrate, manufacturing method of thin glass substrate, manufacturing method of light guide plate and disk-shaped glass substrate

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2017251419A Division JP6695318B2 (en) 2017-12-27 2017-12-27 Disk-shaped glass substrate manufacturing method, thin glass substrate manufacturing method, light guide plate manufacturing method, and disk-shaped glass substrate

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021214297A Division JP7397844B2 (en) 2020-04-21 2021-12-28 Method for manufacturing a disc-shaped glass substrate, method for manufacturing a thin glass substrate, method for manufacturing a light guide plate, and disc-shaped glass substrate

Publications (3)

Publication Number Publication Date
JP2020124804A JP2020124804A (en) 2020-08-20
JP2020124804A5 true JP2020124804A5 (en) 2021-02-12
JP7003178B2 JP7003178B2 (en) 2022-01-20

Family

ID=72083379

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2020075214A Active JP7003178B2 (en) 2020-04-21 2020-04-21 Manufacturing method of disk-shaped glass substrate, manufacturing method of thin glass substrate, manufacturing method of light guide plate and disk-shaped glass substrate
JP2021214297A Active JP7397844B2 (en) 2020-04-21 2021-12-28 Method for manufacturing a disc-shaped glass substrate, method for manufacturing a thin glass substrate, method for manufacturing a light guide plate, and disc-shaped glass substrate
JP2023147348A Pending JP2023165755A (en) 2020-04-21 2023-09-12 Disk-shaped glass substrate

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2021214297A Active JP7397844B2 (en) 2020-04-21 2021-12-28 Method for manufacturing a disc-shaped glass substrate, method for manufacturing a thin glass substrate, method for manufacturing a light guide plate, and disc-shaped glass substrate
JP2023147348A Pending JP2023165755A (en) 2020-04-21 2023-09-12 Disk-shaped glass substrate

Country Status (1)

Country Link
JP (3) JP7003178B2 (en)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10340056A (en) * 1997-06-06 1998-12-22 Canon Inc Head mounted video display device
JP2005263569A (en) 2004-03-19 2005-09-29 Asahi Glass Co Ltd Method for manufacturing synthetic quartz glass substrate for polysilicon tft
JP5090633B2 (en) 2004-06-22 2012-12-05 旭硝子株式会社 Glass substrate polishing method
JP4184384B2 (en) * 2006-03-16 2008-11-19 Hoya株式会社 Glass substrate for magnetic recording medium and magnetic recording medium
JP2008216835A (en) * 2007-03-07 2008-09-18 Epson Imaging Devices Corp Manufacturing method of thin substrate
JP2009035461A (en) * 2007-08-03 2009-02-19 Asahi Glass Co Ltd Method for manufacturing glass substrate for magnetic disk
US9753317B2 (en) * 2012-12-21 2017-09-05 Apple Inc. Methods for trimming polarizers in displays using edge protection structures
WO2014103986A1 (en) * 2012-12-28 2014-07-03 Hoya株式会社 Glass substrate for use in information recording medium and manufacturing method thereof
SG10201708325TA (en) 2013-02-08 2017-11-29 Hoya Corp Method for manufacturing magnetic-disk substrate, and polishing pad used in manufacture of magnetic-disk substrate
JP6129029B2 (en) * 2013-08-30 2017-05-17 株式会社ディスコ Wafer processing method
JP2015064920A (en) * 2013-09-25 2015-04-09 Hoya株式会社 Manufacturing method of glass substrate for magnetic disk
JP6287095B2 (en) 2013-11-19 2018-03-07 セイコーエプソン株式会社 Optical device and electronic apparatus
JP6441088B2 (en) 2015-01-13 2018-12-19 株式会社Sumco Silicon wafer manufacturing method and semiconductor device manufacturing method
JP6881301B2 (en) * 2015-06-12 2021-06-02 Agc株式会社 Glass plate manufacturing method
JP6628646B2 (en) 2016-03-11 2020-01-15 Hoya株式会社 Method of manufacturing substrate, method of manufacturing mask blank, and method of manufacturing transfer mask
JP6560155B2 (en) 2016-04-20 2019-08-14 信越化学工業株式会社 Polishing agent for synthetic quartz glass substrate and method for polishing synthetic quartz glass substrate
TWI771375B (en) 2017-02-24 2022-07-21 美商康寧公司 High aspect ratio glass wafer

Similar Documents

Publication Publication Date Title
TW201638287A (en) Grinding tool
TWI424484B (en) Wafer grinding method and wafer
US20100247977A1 (en) Subastrate for a magnetic disk and method of manufacturing the same
TWI610358B (en) Mirror honing wafer manufacturing method
JP2014233830A (en) Abrasive pad dresser and production method thereof, abrasive pad dressing device, and polishing system
JP6819853B2 (en) Disc-shaped flat glass and its manufacturing method
CN101583577A (en) Method for manufacturing glass substrate for magnetic disc
TW201538276A (en) Chemical mechanical polishing conditioner having different heights
TWI732864B (en) Scoring wheel
TWI684494B (en) Grinding stone
JP2015104771A5 (en) Manufacturing method of magnetic disk substrate and carrier for polishing treatment
JP2013202975A (en) Scribing wheel, and method for manufacturing same
JP5585269B2 (en) Method for manufacturing glass substrate for magnetic recording medium
JP2020124804A5 (en)
JP6085723B1 (en) Abrasive material and method for producing abrasive material
WO2009157306A1 (en) Apparatus for polishing both sides of glass substrate for magnetic disk, polishing method, and production process
WO2020209022A1 (en) Gallium oxide substrate, and gallium oxide substrate production method
JP6645935B2 (en) Substrate manufacturing method, substrate end surface processing apparatus, substrate end surface processing method, and grinding wheel
JP5911750B2 (en) Wafer support and manufacturing method thereof
JP4992306B2 (en) Work carrier, manufacturing method thereof and double-side polishing machine
JP2016007739A (en) Scribing wheel and manufacturing method of the same
TW201538275A (en) Chemical mechanical polishing conditioner with planarization
JP2010209371A (en) Carbon film coated member, method for forming carbon film, and cmp pad conditioner
JP2011140075A (en) Method of grinding glass substrate using double-sided grinding device and method of manufacturing glass substrate using the method of grinding
JP2009277347A (en) Manufacturing method of glass substrate for information recording medium