JP2020115588A - Resin mold and surface-mounting type light-emitting device, and manufacturing methods thereof - Google Patents

Abstract

To provide a surface-mounting type light-emitting device having a long life and an excellent mass productivity, and a mold used for the surface-mounting type light-emitting device.SOLUTION: A surface-mounting type light-emitting device comprises: a GaN-based light-emitting element 10 operable to emit blue light; a first resin mold 40 arranged by integrally molding a first lead 20 to place the light-emitting element 10 on, and a second lead 30 to be electrically connected with the light-emitting element 10; and a second resin mold 50 covering the light-emitting element 10 and including a YAG-based phosphor 80. In the first resin mold 40, a concave portion 40c having a bottom face 40a and a side face 40b is formed therein, and the second resin mold 50 is disposed in the concave portion 40c. The first resin mold 40 is shaped by transfer molding of a thermosetting resin such as an epoxy resin. For the second resin mold 50, a thermosetting resin such as a silicone resin is used.SELECTED DRAWING: Figure 1

Description

The present invention relates to a surface-mounted light-emitting device used for a lighting fixture, a display, a backlight of a mobile phone, a moving light auxiliary light source, and other general consumer light sources, a resin molding suitable for the light-emitting device, and a manufacturing method thereof.

A surface-mount light-emitting device using a light-emitting element is small, has high power efficiency, and emits bright colors. Further, since this light emitting element is a semiconductor element, there is no fear of breaking the ball. Furthermore, it has excellent initial drive characteristics and is resistant to vibration and repeated on/off lighting. Due to such excellent characteristics, a light emitting device using a light emitting element such as a light emitting diode (LED) or a laser diode (LD) is used as various light sources.

FIG. 11 shows a conventional surface mount light emitting device. A conventional surface mount light emitting device includes a light emitting element 210, a mounting lead frame 220 on which the light emitting element 210 is mounted, a connection lead frame 230 connected to the light emitting element 210 via a conductive wire, and most of each lead frame. And a molded body 240 for covering (for example, refer to Patent Document 1). In this surface-mount light-emitting device, a thermoplastic resin such as a liquid crystal polymer, PPS (polyphenylene sulfide), or nylon is often used as the light-shielding resin for the molded body 240 because the mass productivity is prioritized. Further, generally, since the thermoplastic resin used for the molded body 240 needs to have heat resistance capable of withstanding the heat of reflow soldering, semi-aromatic polyamide, liquid crystal polymer, and engineering polymers such as PPS are used. Generally, thermoplastic resins are produced by injection molding. This injection molding method has become the mainstream for providing a high-power surface-mounted light emitting device at low cost because of its high productivity.

Japanese Patent Application Laid-Open No. 11-087780 (Claims, [0020])

These thermoplastic engineering polymers used in the molded body 240 of the conventional surface-mount light emitting device have excellent heat resistance, but have poor light resistance because they have an aromatic component in the molecule. Further, since it does not have a hydroxyl group or the like for improving the adhesiveness at the terminal of the molecule, there is a problem that the lead frames 220, 230 and the translucent sealing resin 250 cannot be adhered. Further, the output of the light emitting element has been remarkably improved in recent years, and as the output of the light emitting element has been increased, the light deterioration of the molded body 240 has become remarkable. In particular, the adhesive interface between the translucent sealing resin 250 and the thermoplastic engineering polymer 240 is easily broken due to poor adhesiveness, leading to peeling. In addition, discoloration due to photodegradation proceeds even before peeling occurs, and the life of the light emitting device is significantly shortened.

In order to solve these problems, there is also a technique in which the molded body is made of an inorganic material that does not undergo photodegradation, such as ceramics. However, in a molded body using this ceramic, it is difficult to insert a lead frame having good thermal conductivity, and the thermal resistance value cannot be lowered. Further, the expansion coefficient of the resin is different from that of the translucent sealing resin by one order or more, so that reliability is not obtained.

From the above, it is an object of the present invention to provide a surface-mounted light emitting device having a long life and excellent mass productivity, and a molded body used for the surface-mounted light emitting device. Moreover, it aims at providing those manufacturing methods which are easy to manufacture.

In order to solve the above problems, the present inventor has conducted extensive studies and, as a result, has completed the present invention.

The present invention relates to a light emitting element, a first resin molded body integrally formed with a first lead for mounting the light emitting element and a second lead electrically connected to the light emitting element, and a light emitting element. A second resin molded body that covers the element, wherein the first resin molded body is formed with a recess having a bottom surface and a side surface, and the first resin molded body is formed. The first lead is exposed from the bottom surface of the concave portion of, and the light emitting element is mounted on the exposed portion, and the first resin molded body and the second resin molded body are thermosetting resins, The first resin molded body does not have an aromatic component in the molecule as much as possible, and the first resin molded body relates to a surface mount light emitting device molded by transfer molding.

The present invention relates to a light emitting element, a first resin molded body integrally formed with a first lead for mounting the light emitting element and a second lead electrically connected to the light emitting element, and a light emitting element. And a second resin molded body that covers the element, wherein the first lead has a first inner lead portion and a first outer lead portion. Has a light emitting element mounted thereon and is electrically connected to a first electrode of the light emitting element, and the first outer lead portion is exposed from the first resin molding. The second lead has a second inner lead portion and a second outer lead portion, and the second inner lead portion is electrically connected to the second electrode of the light emitting element. And the second outer lead portion is exposed from the first resin molded body, and the first resin molded body is formed with a recess having a bottom surface and a side surface. The first inner lead portion is exposed from the bottom surface of the recess, the light emitting element is mounted on the exposed portion, and the first resin molded body and the second resin molded body are thermosetting resins. The first resin molded body has no aromatic component in the molecule as much as possible, and the first resin molded body relates to a surface-mounted light-emitting device molded by transfer molding.

The back surface side of the first lead, which is opposite to the main surface side on which the light emitting element is mounted, is preferably exposed from the first resin molded body.

The back surface side of the first lead and the second lead opposite to the main surface side on which the light emitting element is mounted may be exposed from the first resin molded body.

It is preferable that the back surface exposed portion of the first lead and the back surface exposed portion of the second lead are substantially on the same plane.

The exposed portion on the back surface side of the first inner lead portion may be arranged so that the heat dissipation member is in contact therewith.

The first resin molded body preferably reflects 30% or more of the light from the light emitting element.

The first resin molded body is preferably formed of at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, and urethane resin.

The first resin molded body may be mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent substance, a reflective substance, and a light-shielding substance.

The second resin molded body may be mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent substance, and a reflective substance.

The present invention is a resin molded body obtained by integrally molding a first lead and a second lead, wherein the first lead has a first inner lead portion and a first outer lead portion. The first inner lead portion is disposed in the resin molded body, the first outer lead portion is exposed from the resin molded body, and the second lead is the second inner lead portion and the second inner lead portion. An outer lead portion, the second inner lead portion is disposed in the resin molded body, the second outer lead portion is exposed from the resin molded body, and the resin molded body has a bottom surface. A concave portion having a side surface is formed, the first inner lead portion and the second inner lead portion are exposed from the bottom surface of the concave portion of the resin molded body, and the resin molded body is a thermosetting resin, The resin molded body has as few aromatic components as possible in the molecule, and the resin molded body relates to a resin molded body molded by transfer molding.

The present invention is a resin molded body obtained by integrally molding a first lead and a second lead, wherein the first lead has a first inner lead portion and a first outer lead portion. The first inner lead portion is disposed in the resin molded body, the first outer lead portion is exposed from the resin molded body, and the second lead is the second inner lead portion and the second inner lead portion. An outer lead portion, the second inner lead portion is disposed on the resin molded body, the second outer lead portion is exposed to the outside from the resin molded body, and the resin molded body has a bottom surface. And a side surface are formed, and the first inner lead portion and the second inner lead portion are exposed from the bottom surface of the concave portion of the resin molded body, which is opposite to the main surface side where the concave portion is formed. The back surface side of the first inner lead part is exposed from the resin molded body, the resin molded body is a thermosetting resin, and the resin molded body does not have an aromatic component in the molecule as much as possible. Yes, the resin molded body relates to a resin molded body molded by transfer molding.

It is preferable that the back surface exposed portion of the first lead and the back surface exposed portion of the second lead are substantially on the same plane.

The thermosetting resin is preferably at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin and urethane resin.

It is preferable that the recess be provided with a slope that widens in the opening direction.

The resin molded body may be mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent substance, a reflective substance, and a light-shielding substance.

INDUSTRIAL APPLICABILITY The present invention is directed to the production of a resin molded body in which a first lead and a second lead are integrally molded, and a recess having a bottom surface and a side surface is formed and which does not have an aromatic component in the molecule In the method, the upper die forms a recess corresponding to the recess of the resin molded body, and the first lead has a first inner lead portion and a first outer lead portion. The second lead has a second inner lead portion and a second outer lead portion, and has a first inner lead portion, a second inner lead portion, and a first inner lead portion corresponding to the bottom surface of the recess of the resin molded body. The outer lead part and the second outer lead part of the first mold are sandwiched between the upper mold and the lower mold, and a thermosetting resin is transferred to the recessed part sandwiched between the upper mold and the lower mold. The present invention relates to a method for producing a resin molded body, which includes a second step of being poured in by a molding step and a third step of molding a resin molded body by heating and hardening the poured thermosetting resin.

The present invention relates to a first resin molding in which a first lead and a second lead are integrally molded, and a concave portion having a bottom surface and a side surface is formed and which does not have an aromatic component in the molecule as much as possible. A method for manufacturing a surface mount light emitting device, comprising: a body, a light emitting element mounted on a first lead, and a second resin molded body that covers the light emitting element, wherein the upper mold is a first mold. A recess corresponding to the recess of the resin molded body is formed, the first lead has a first inner lead portion and a first outer lead portion, and the second lead is a second inner lead. A first inner lead portion and a second inner lead portion that correspond to the bottom surface of the recess of the first resin molded body, and the first outer lead portion and the second outer lead portion. The outer lead portion of No. 2 has a first step in which the upper die and the lower die are sandwiched, and a transfer molding step in which the first thermosetting resin is in the recessed portion sandwiched between the upper die and the lower die. By the second step, the poured first thermosetting resin is heated and cured to form the first resin molded body, the third step, and the upper die is removed. And the light emitting element is mounted on the first inner lead portion, the first electrode of the light emitting element and the first inner lead portion are electrically connected, and the second electrode of the light emitting element is attached. A fifth step of electrically connecting the electrode and the second inner lead portion, a sixth step of arranging the second thermosetting resin in the concave portion in which the light emitting element is mounted, The thermosetting resin of No. 2 is heated and cured, and the seventh step of molding the second resin molded body is performed.

As a result, it is possible to provide a surface-mounted light emitting device having a long life and excellent mass productivity, and a molded body used for the surface-mounted light emitting device.

It is a schematic sectional drawing which shows the surface mount type light emitting device which concerns on 1st Embodiment. It is a schematic plan view which shows the surface mount type light emitting device which concerns on 1st Embodiment. It is a schematic sectional drawing which shows the mounting state of the surface mount type light emitting device which concerns on 1st Embodiment. It is a schematic plan view which shows the surface mount type light emitting device which concerns on 2nd Embodiment. It is a schematic sectional drawing which shows the surface mount type light emitting device which concerns on 3rd Embodiment. It is a schematic sectional drawing which shows the surface mount type light emitting device which concerns on 4th Embodiment. It is a schematic sectional drawing which shows the surface mount type light emitting device which concerns on 5th Embodiment. It is a schematic sectional drawing which shows the mounting state of the surface mount type light emitting device which concerns on 5th Embodiment. It is a schematic sectional drawing which shows the surface mount type light emitting device which concerns on 6th Embodiment. (A)-(e) It is a schematic sectional drawing which shows the manufacturing process of the surface mount type light emitting device which concerns on 1st Embodiment. It is a schematic plan view which shows the conventional surface mount type light emitting device. It is a schematic sectional drawing which shows the conventional surface mount type light emitting device.

The present invention relates to a light emitting element, a first resin molded body integrally formed with a first lead for mounting the light emitting element and a second lead electrically connected to the light emitting element, and a light emitting element. A second resin molded body that covers the element, wherein the first resin molded body is formed with a recess having a bottom surface and a side surface, and the first resin molded body is formed. The first lead is exposed from the bottom surface of the concave portion of the substrate, the light emitting element is mounted on the exposed portion, and the first resin molded body and the second resin molded body are surfaces that are thermosetting resins. The present invention relates to a mounted light emitting device. The thermosetting resin preferably has no aromatic component in the molecule as much as possible.

This makes it possible to provide a surface-mounted light emitting device having excellent heat resistance and light resistance.

Further, by making the first resin molded body a thermosetting resin, it is possible to prevent peeling of the interface with the second resin molded body. This is because, unlike the thermoplastic resin, the thermosetting resin has a large number of reactive functional groups on its surface, so that a strong adhesive interface can be formed with the second resin molded body. Since the second resin molded body is made of a thermosetting resin, isotropic thermal expansion/contraction behavior similar to that of the first resin molded body can be obtained. It can be further reduced. Then, by making the second resin molded body a thermosetting resin of the same type as the first resin molded body, not only the adhesive strength is improved by reducing the interfacial tension, but also the curing reaction proceeds at the interface, resulting in extremely strong adhesion. It is possible to obtain the sex. Regarding the light resistance, since the composition of the three-dimensionally crosslinked thermosetting resin can be easily changed without impairing the heat resistance, aromatic components having poor light resistance can be easily eliminated. On the other hand, in a thermoplastic resin, heat resistance and an aromatic component are synonymous in fact, and a molded product that can withstand reflow soldering heat cannot be obtained without the aromatic component. Therefore, by using a thermosetting resin for the first resin molded body and the second resin molded body, the surface having an originally strong adhesive interface, excellent peeling resistance with little photodegradation, and less secular change. A mounted light emitting device can be obtained.

The second resin molded body is arranged in the recess in which the light emitting element is placed. Thereby, the light emitting element can be easily covered. Further, since the refractive index of the light emitting element and the refractive index in air are significantly different, the light emitted from the light emitting element is not efficiently output to the outside, whereas the second resin molded body covers the light emitting element. By doing so, the light emitted from the light emitting element can be efficiently output to the outside. Further, the light emitted from the light emitting element is applied to the bottom surface and the side surface of the concave portion, reflected, and emitted to the main surface side on which the light emitting element is mounted. As a result, the light emission output on the main surface side can be improved. Further, since the first lead is made of metal, the reflection efficiency of the light from the light emitting element can be improved rather than the case where the bottom surface of the recess is covered with the first resin molded body.

For example, an epoxy resin can be used for the first resin molded body and a hard silicone resin can be used for the second resin molded body.

The present invention relates to a light emitting element, a first resin molded body integrally formed with a first lead for mounting the light emitting element and a second lead electrically connected to the light emitting element, and a light emitting element. And a second resin molded body that covers the element, wherein the first lead has a first inner lead portion and a first outer lead portion. Has a light emitting element mounted thereon and is electrically connected to a first electrode of the light emitting element, and the first outer lead portion is exposed from the first resin molding. The second lead has a second inner lead portion and a second outer lead portion, and the second inner lead portion is electrically connected to the second electrode of the light emitting element. And the second outer lead portion is exposed from the first resin molded body, and the first resin molded body is formed with a recess having a bottom surface and a side surface. The first inner lead portion is exposed from the bottom surface of the recess, the light emitting element is mounted on the exposed portion, and the first resin molded body and the second resin molded body are thermosetting resins. The present invention relates to a surface mount light emitting device. The thermosetting resin preferably has no aromatic component in the molecule as much as possible. This makes it possible to provide a surface-mounted light emitting device having excellent heat resistance, weather resistance, and adhesion. Further, since the first resin molded body and the second resin molded body are molded by using the thermosetting resin, it is possible to prevent the peeling of the interface between the first resin molded body and the second resin molded body. You can Furthermore, since the first lead and the second lead having a predetermined length are bent and used, they can be easily electrically connected to the external electrode and can be mounted on an existing lighting fixture or the like and used as they are. ..

The back surface side of the first lead, which is opposite to the main surface side on which the light emitting element is mounted, is preferably exposed from the first resin molded body. When a current is applied to the surface mount light emitting device, the light emitting element emits light and the light emitting element generates heat. With this configuration, this heat can be efficiently released to the outside. In particular, since the heat from the light emitting element can be radiated to the outside in the shortest distance, the heat can be radiated extremely efficiently.

The back surface side of the first lead and the second lead opposite to the main surface side on which the light emitting element is mounted may be exposed from the first resin molded body. Thereby, the heat generated from the light emitting element can be efficiently radiated to the outside. Since the first lead and the second lead function as electrodes, they can be connected to the external electrodes very easily. In particular, when the thick first lead and second lead are used, even if the leads are not easily bent, they are easily mounted. Further, in the manufacturing process, since the first lead and the second lead are sandwiched by a predetermined mold, it is possible to reduce the occurrence of burrs and improve the mass productivity. However, it is not necessary that the entire back surface of the first lead and the second lead be exposed, and only the portion where burr generation is desired to be suppressed may be exposed.

It is preferable that the back surface exposed portion of the first lead and the back surface exposed portion of the second lead are substantially on the same plane. As a result, it is possible to improve the stability when mounting the surface mount light emitting device. Further, since the exposed portions are on the same plane, it is sufficient to mount and mount the surface-mount light-emitting device using solder on the external electrodes on the flat plate, and improve the mountability of the surface-mount light-emitting device. You can Furthermore, molding with a die becomes extremely easy.

The exposed portion on the back surface side of the first inner lead portion may be arranged so that the heat dissipation member is in contact therewith. The heat dissipation member can be arranged as an external member separately from the surface mount light emitting device, or the heat dissipation member can be attached integrally with the surface mount light emitting device. Thereby, the heat generated from the light emitting element is radiated to the outside through the heat radiating member, so that the heat radiating property can be further improved. Further, when the heat dissipation member is arranged as an external member, the mounting position of the surface mount light emitting device can be easily determined.

The first resin molded body is molded by transfer molding. While injection molding cannot form a complicated shape, transfer molding can form a molded body having a complicated shape. In particular, the first resin molded body having the concave portion can be easily molded.

The first resin molded body is preferably formed of at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, and urethane resin. Of these, epoxy resins, silicone resins and modified silicone resins are preferable, and epoxy resins are particularly preferable. As a result, it is possible to provide a surface-mounted light emitting device having excellent heat resistance, light resistance, adhesion, and mass productivity. Further, the use of a thermosetting resin for the first resin molded body can reduce the deterioration of the first resin molded body, as compared with the case where the thermoplastic resin is used for the first resin molded body. The life of the surface-mounted light emitting device can be extended.

The first resin molded body may be mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent substance, a reflective substance, and a light-shielding substance. Various substances are added according to the requirements of the first resin molded body. For example, there is a case where a resin having high translucency is used for the first resin molded body and a fluorescent substance is mixed with the first resin molded body. As a result, the fluorescent material absorbs the light emitted to the side surface or the bottom surface side of the light emitting element, converts the wavelength, and emits the light, so that a desired emission color can be realized as the entire surface mount light emitting device. For example, in order to uniformly disperse the emitted light, a filler, a diffusing agent, a reflective material, or the like may be added to the side surface or the bottom surface side of the light emitting element. For example, a light blocking resin may be mixed in order to reduce the light output from the back surface side of the surface mount light emitting device. In particular, the first resin molded body is preferably one in which titanium oxide, silica, and alumina are mixed in an epoxy resin. This makes it possible to provide a surface-mounted light emitting device having excellent heat resistance.

The second resin molded body may be mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent substance, and a reflective substance. Various substances are added according to the requirements of the second resin molded body. For example, a luminescent color different from the luminescent color emitted from the light emitting element can be realized by mixing the second resin molded body with a fluorescent substance. For example, white light can be realized by using a light emitting element which emits blue light and a fluorescent substance which emits yellow light. Further, a filler, a diffusing agent, or the like can be mixed in order to uniformly emit light.

The present invention is a resin molded body obtained by integrally molding a first lead and a second lead, wherein the first lead has a first inner lead portion and a first outer lead portion. The first inner lead portion is disposed in the resin molded body, the first outer lead portion is exposed from the resin molded body, and the second lead is the second inner lead portion and the second inner lead portion. An outer lead portion, the second inner lead portion is disposed in the resin molded body, the second outer lead portion is exposed from the resin molded body, and the resin molded body has a bottom surface. A recess having a side surface is formed, the first inner lead portion and the second inner lead portion are exposed from the bottom surface of the recess of the resin molded body, and the resin molded body is a resin that is a thermosetting resin. Regarding a molded body. As a result, it is possible to provide a resin molded body that is more excellent in heat resistance, light resistance, adhesion, etc. than when a resin molded body is molded using a thermoplastic resin. Further, it is possible to have a structure in which the light emitting element can be easily mounted.

The present invention is a resin molded body obtained by integrally molding a first lead and a second lead, wherein the first lead has a first inner lead portion and a first outer lead portion. The first inner lead portion is disposed in the resin molded body, the first outer lead portion is exposed from the resin molded body, and the second lead is the second inner lead portion and the second inner lead portion. An outer lead portion, the second inner lead portion is disposed on the resin molded body, the second outer lead portion is exposed to the outside from the resin molded body, and the resin molded body has a bottom surface. And a side surface are formed, and the first inner lead portion and the second inner lead portion are exposed from the bottom surface of the concave portion of the resin molded body, which is opposite to the main surface side where the concave portion is formed. The back surface side of the first inner lead portion is exposed from the resin molded body, and the resin molded body relates to the resin molded body which is a thermosetting resin. As a result, it is possible to provide a resin molded body that is more excellent in heat resistance, light resistance, adhesion, etc. than when a resin molded body is molded using a thermoplastic resin. Further, it is possible to have a structure in which the light emitting element can be easily mounted. Further, by exposing the first outer lead portion extending from the resin molded body, the heat generated from the light emitting element can be radiated to the outside.

It is preferable that the back surface exposed portion of the first lead and the back surface exposed portion of the second lead are substantially on the same plane. As a result, it is possible to provide a surface-mounted light emitting device using a resin molded body that is stable and easy to mount. Furthermore, it is easy to mold with a mold.

The thermosetting resin is preferably at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin and urethane resin. As a result, it is possible to provide a resin molded product that is inexpensive, has good mass productivity, and has excellent heat resistance and light resistance.

The resin molded body is molded by transfer molding. This makes it possible to form a recess having a complicated shape that is difficult to mold by injection molding.

The resin molded body may be mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent substance, a reflective substance, and a light-shielding substance. As a result, it is possible to provide a resin molded body that meets the requirements. For example, when a resin molded body having a function of diffusing light is desired, a filler or a diffusing agent is mixed. Further, when a wavelength is converted and a surface mount type light emitting device having a desired color tone is desired, a fluorescent substance is mixed. Further, in order to efficiently extract light from the light emitting element to the main surface side, when it is desired to suppress the transmission of light to the back surface side, a light shielding substance is mixed.

The present invention is a method for producing a resin molded body, which is formed by integrally molding a first lead and a second lead, and in which a recess having a bottom surface and a side surface is formed. The first lead has a first inner lead portion and a first outer lead portion, and the second lead has a second inner lead portion and a second inner lead portion. The first inner lead portion and the second inner lead portion, which correspond to the bottom surface of the recess of the resin molded body, and the first outer lead portion and the second outer lead portion, A first step of being sandwiched between the upper die and the lower die, and a second step of pouring a thermosetting resin into the recessed portion sandwiched between the upper die and the lower die by a transfer molding step, The thermosetting resin that has been poured is cured by heating, and a third step of molding a resin molded body is included.

As a result, the first inner lead portion and the second inner lead portion are sandwiched by the upper mold and the lower mold in the first step, so that flapping of these leads during transfer molding can be suppressed. Therefore, it is possible to manufacture a resin molded body which is free from burrs. Further, the first inner lead portion corresponding to the portion on which the light emitting element is placed can be exposed. Furthermore, since the main surface side and the back surface side of the first inner lead portion corresponding to the bottom surface of the recess are exposed, heat can be dissipated from the back surface side when the light emitting element is mounted, and heat dissipation can be improved.

Moreover, since the thermosetting resin is transfer-molded, it is possible to manufacture a resin molded body having a recess having a complicated shape. In addition, it is possible to manufacture a resin molded product having excellent mass productivity, heat resistance, light resistance, adhesiveness, and the like. The thermoplastic resin is solidified by heating to a melting temperature and then cooling. Therefore, the thermoplastic resin and the thermosetting resin are different in the cooling process and also different in whether or not they can be reversibly cured. Further, the thermoplastic resin has a high viscosity during processing and cannot form a complicated shape.

According to the present invention, a first resin molded body formed by integrally molding a first lead and a second lead and having a concave portion having a bottom surface and a side surface, and mounted on the first lead. What is claimed is: 1. A method of manufacturing a surface mount light emitting device, comprising: a light emitting element; and a second resin molded body that covers the light emitting element, wherein an upper die forms a recess corresponding to the recess of the first resin molded body. The first lead has a first inner lead portion and a first outer lead portion, and the second lead has a second inner lead portion and a second outer lead portion. The first inner lead portion and the second inner lead portion, which correspond to the bottom surface of the recess of the first resin molded body, and the first outer lead portion and the second outer lead portion are the upper die and the lower die. The first step of being sandwiched with the mold, the second step of casting the first thermosetting resin into the recessed portion sandwiched between the upper die and the lower die by the transfer molding step, and the second step. The first thermosetting resin is heated and cured to form a first resin molded body in a third step, the upper mold is removed in a fourth step, and the light-emitting element has a first inner lead. The first electrode and the first inner lead portion of the light emitting element are electrically connected to each other and the second electrode and the second inner lead portion of the light emitting element are electrically connected to each other. And a sixth step in which the second thermosetting resin is placed in the recess in which the light emitting element is mounted, and the second thermosetting resin is heated and cured. And a seventh step of molding a second resin molded body, and a method for manufacturing a surface-mounted light emitting device. As a result, it is possible to manufacture a surface-mount type light emitting device with good mass productivity. In particular, since the thermosetting resin is used for the first resin molded body and the second resin molded body, the first resin molded body and the second resin molded body are used more than the case where the thermoplastic resin and the thermosetting resin are used. It is possible to improve the adhesiveness with the resin molded body. Also, when the first resin molded body is manufactured by transfer molding, burrs are a problem because of good resin fluidity, but burrs do not occur because these leads are firmly sandwiched by the upper mold and the lower mold. .. Since the sandwiched lead is exposed, the light emitting element can be placed on this exposed portion, or the electrode and the lead of the light emitting element can be connected by a wire or the like.

The thermosetting resin, the first thermosetting resin, and the second thermosetting resin are at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, and urethane resin. It is preferable that the resin is a kind of resin. As a result, it is possible to manufacture a surface-mount type light emitting device with good mass productivity. In addition, since it has excellent fluidity and is easily heated and cured, it is possible to provide a surface-mounted light-emitting device having excellent moldability and heat resistance and light resistance.

Hereinafter, the surface mount light emitting device, the resin molded body, and the manufacturing method thereof according to the present invention will be described with reference to the embodiments and examples. However, the present invention is not limited to this embodiment and examples.

<First Embodiment>
<Surface mount type light emitting device>
The surface mount light emitting device according to the first embodiment will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing a surface-mounted light emitting device according to the first embodiment. FIG. 2 is a schematic plan view showing the surface-mounted light emitting device according to the first embodiment. FIG. 1 is a schematic cross-sectional view taken along the line I-I of FIG.

The surface mount light emitting device according to the first embodiment includes a light emitting element 10, a first resin molded body 40 on which the light emitting element 10 is mounted, and a second resin molded body 50 that covers the light emitting element 10. Have. The first resin molded body 40 is integrally formed with the first lead 20 for mounting the light emitting element 10 and the second lead 30 electrically connected to the light emitting element 10.

The light emitting element 10 has a pair of positive and negative first electrodes 11 and second electrodes 12 on the same surface side. In this specification, an electrode having a pair of positive and negative electrodes on the same surface side will be described, but an electrode having a pair of positive and negative electrodes from the upper surface and the lower surface of the light emitting element can be used. In this case, the electrode on the lower surface of the light emitting element is electrically connected to the first lead 20 by using an electrically conductive die bond member without using a wire.

The first lead 20 has a first inner lead portion 20a and a first outer lead portion 20b. The light emitting element 10 is mounted on the first inner lead portion 20a via a die bond member. The first inner lead portion 20a is electrically connected to the first electrode 11 of the light emitting element 10 via the wire 60. The first outer lead portion 20b is exposed from the first resin molded body 40. The first lead 20 not only has the first outer lead portion 20b on the outer side surface of the first resin molded body 40, but also is a portion exposed on the back surface side of the first resin molded body 40. May be referred to as a first outer lead portion 20b, and the first outer lead portion 20b may be any portion that is electrically connected to an external electrode. Since the first lead 20 is connected to the external electrode, a metal member is used.

The second lead 30 has a second inner lead portion 30a and a second outer lead portion 30b. The second inner lead portion 30a is electrically connected to the second electrode 12 of the light emitting element 10 via the wire 60. The second outer lead portion 30b is exposed from the first resin molded body 40. The second lead 30 not only has the second outer lead portion 30b outside the side surface of the second resin molded body 40, but also is a portion exposed on the back surface side of the second resin molded body 40. May be referred to as a second outer lead portion 30b, and the second outer lead portion 30b may be a portion that is electrically connected to an external electrode. Since the second lead 30 is connected to the external electrode, a metal member is used. An insulating member 90 is provided on a portion of the back surface close to the first lead 20 and the second lead 30 so that the first lead 20 and the second lead 30 are not short-circuited.

The first resin molding 40 has a recess 40c having a bottom surface 40a and a side surface 40b. The first inner lead portion 20a of the first lead 20 is exposed from the bottom surface 40a of the recess 40c of the first resin molded body 40. The light emitting element 10 is mounted on this exposed portion via a die bond member. The first resin molded body 40 is molded by transfer molding. The first resin molded body 40 uses a thermosetting resin. The opening of the recess 40c is preferably wider than the bottom 40a, and the side 40b is preferably provided with an inclination.

The second resin molded body 50 is arranged in the recess 40c so as to cover the light emitting element 10. The second resin molded body 50 uses a thermosetting resin. The second resin molded body 50 contains a fluorescent substance 80. Since the fluorescent substance 80 having a larger specific gravity than the second resin molded body 50 is used, it is settled on the bottom surface 40a side of the recess 40c.

In this specification, the side on which the light emitting element 10 is mounted is called the main surface side, and the opposite side is called the back surface side.

Since the first resin molded body 40 and the second resin molded body 50 are made of thermosetting resin and have similar physical properties such as expansion coefficient, the adhesion is extremely good. Further, with the above structure, it is possible to provide a surface-mounted light emitting device having excellent heat resistance and light resistance.

Hereinafter, each component will be described in detail.

<Light emitting element>
The light emitting element 10 is formed by forming a semiconductor such as GaAlN, ZnS, ZnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, or AlInGaN on the substrate as a light emitting layer. Examples of the semiconductor structure include a MIS junction, a homo structure having a PIN junction or a PN junction, a hetero structure, or a double hetero structure. The emission wavelength can be variously selected from ultraviolet light to infrared light depending on the material of the semiconductor layer and the degree of mixed crystal thereof. The light emitting layer may have a single quantum well structure or a multiple quantum well structure, which is a thin film in which a quantum effect occurs.

When considering outdoor use, it is preferable to use a gallium nitride-based compound semiconductor as a semiconductor material capable of forming a high-luminance light-emitting element, and for red, gallium-aluminum-arsenic-based semiconductor or aluminum-indium It is preferable to use a gallium/phosphorus-based semiconductor, but various types can be used depending on the application.

When a gallium nitride-based compound semiconductor is used, materials such as sapphire, spinel, SiC, Si, ZnO and GaN single crystal are used for the semiconductor substrate. It is preferable to use a sapphire substrate in order to form gallium nitride having good crystallinity with high productivity. An example of a light emitting device 10 using a nitride compound semiconductor will be shown. A buffer layer of GaN, AlN or the like is formed on the sapphire substrate. A first contact layer made of N or P type GaN thereon, an active layer made of an InGaN thin film having a quantum effect, a clad layer made of P or N type AlGaN, and a second layer made of P or N type GaN. The contact layer can be formed in order. The gallium nitride-based compound semiconductor exhibits N-type conductivity in a state where it is not doped with impurities. When a desired N-type gallium nitride semiconductor is formed to improve the luminous efficiency, it is preferable to appropriately introduce Si, Ge, Se, Te, C or the like as an N-type dopant.

On the other hand, when forming a P-type gallium nitride semiconductor, P-type dopants such as Zn, Mg, Be, Ca, Sr, and Ba are doped. Since gallium nitride-based semiconductors are difficult to become P-type only by doping with P-type dopant, it is necessary to anneal by heating with a furnace, low electron beam irradiation or plasma irradiation after introducing the P-type dopant. The semiconductor wafer thus formed is partially etched to form positive and negative electrodes. After that, the light emitting element can be formed by cutting the semiconductor wafer into a desired size.

A plurality of such light emitting elements 10 can be appropriately used, and the combination thereof can improve the color mixture in white display. For example, it is possible to use two light emitting elements 10 capable of emitting green light and one light emitting element 10 capable of emitting blue light and red light. For use as a full-color light emitting device for a display device, it is preferable that the red emission wavelength is 610 nm to 700 nm, the green emission wavelength is 495 nm to 565 nm, and the blue emission wavelength is 430 nm to 490 nm. In the case of emitting white mixed color light in the surface mount light emitting device of the present invention, the emission wavelength of the light emitting element is 400 nm or more in consideration of the complementary color relation with the emission wavelength from the fluorescent substance, deterioration of the translucent resin, and the like. It is preferably 530 nm or less, and more preferably 420 nm or more and 490 nm or less. In order to further improve the excitation and emission efficiency of the light emitting element and the fluorescent substance, 450 nm or more and 475 nm or less are more preferable. Note that a light emitting element having a main emission wavelength in an ultraviolet region shorter than 400 nm or a short wavelength region of visible light can be used in combination with a member which is relatively resistant to deterioration by ultraviolet rays.

The light emitting element 10 can be mounted in a size of □1 mm, such as a size of □600 μm or □320 μm.

<First resin molding>
The first resin molded body 40 has a recess 40c having a bottom surface 40a and a side surface 40b. In the first resin molded body 40, the first lead 20 and the second lead 30 extending outward from the bottom surface a of the recess 40c are integrally molded. The first inner lead portion 20a of the first lead 20 forms a part of the bottom surface 40a of the recess 40c. The second inner lead portion 30a of the second lead 30 forms a part of the bottom surface 40a of the recess 40c and is separated from the first inner lead portion 20a by a predetermined distance. The light emitting element 10 is mounted on the first inner lead portion 20a corresponding to the bottom surface 40a of the recess 40c. The first inner lead portion 20a corresponding to the bottom surface 40a of the recess 40c, the second inner lead portion 30a corresponding to the bottom surface 40a of the recess 40c, the first outer lead portion 20b, and the second outer lead portion 30b are , Exposed from the first resin molding 40. The first lead 20 and the second lead 30 on the back surface side are exposed. This enables electrical connection from the back side.

The recess 40c is provided with an inclination so as to have a wide opening in the opening direction. This can improve the extraction of light in the forward direction. However, it is also possible to form a cylindrical recess without providing an inclination. Further, it is preferable that the slope is smooth, but unevenness can be provided. By providing the irregularities, it is possible to improve the adhesion at the interface between the first resin molded body 40 and the second resin molded body 50. The inclination angle of the recess 40c is preferably 95° or more and 150° or less, particularly preferably 100° or more and 120° or less, measured from the bottom surface.

The shape of the first resin molded body 40 on the main surface side is rectangular, but it may be elliptical, circular, pentagonal, hexagonal, or the like. The shape of the main surface side of the recess 40c is an ellipse, but it may be substantially circular, rectangular, pentagonal, hexagonal, or the like. A cathode mark is attached in a predetermined case.

The material of the first resin molded body 40 is a thermosetting resin. Among thermosetting resins, at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, and urethane resin is preferable, and epoxy resin, modified epoxy resin is particularly preferable. , Silicone resins and modified silicone resins are preferred. For example, an epoxy resin composed of triglycidyl isocyanurate (Chemical formula 1), hydrogenated bisphenol A diglycidyl ether (Chemical formula 2), hexahydrophthalic anhydride (Chemical formula 3), 3-methylhexahydrophthalic anhydride (Chemical formula 4) , 4-methylhexahydrophthalic anhydride (Chemical Formula 5) and other acid anhydrides were dissolved and mixed in an epoxy resin in an equivalent amount to 100 parts by weight of a colorless and transparent mixture, and DBU (1,8) was added as a curing accelerator. -0.5 parts by weight of diazabicyclo(5,4,0) undecene-7) (Chemical formula 6), 1 part by weight of ethylene glycol (Chemical formula 7) as a co-catalyst, 10 parts by weight of titanium oxide pigment, and 50 parts of glass fiber. It is possible to use a solid epoxy resin composition which is added in parts by weight and partially cured by heating to be B-staged.

The first resin molded body 40 is preferably hard because it has a function as a package. Further, the first resin molded body 40 may or may not have a light-transmitting property, but can be appropriately designed according to the application and the like. For example, the light-shielding substance can be mixed with the first resin molded body 40 to reduce the light transmitted through the first resin molded body 40. On the other hand, a filler or a diffusing agent may be mixed so that the light from the surface-mounted light emitting device is mainly emitted to the front and the side evenly. Further, in order to reduce the absorption of light, it is possible to add a white pigment rather than a dark pigment. As described above, the first resin molded body 40 is mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent substance, a reflective substance, and a light-shielding substance in order to have a predetermined function. You can also do it.

<First Lead and Second Lead>
The first lead 20 has a first inner lead portion 20a and a first outer lead portion 20b. The bottom surface 40a of the recess 40c of the first resin molded body 40 in the first inner lead portion 20a is exposed, and the light emitting element 10 is mounted thereon. The exposed first inner lead portion 20a may have an area on which the light emitting element 10 is mounted, but a large area is preferable from the viewpoint of thermal conductivity, electrical conductivity, reflection efficiency, and the like. .. The first inner lead portion 20a is electrically connected to the first electrode 11 of the light emitting element 10 via the wire 60. The first outer lead portion 20b is a portion exposed from the first resin molded body 40 excluding the portion on which the light emitting element 10 is placed. The first outer lead portion 20b is electrically connected to the external electrode and has a function of transferring heat.

The second lead 30 has a second inner lead portion 30a and a second outer lead portion 30b. The bottom surface 40a of the recess 40c of the first resin molded body 40 in the second inner lead portion 30a is exposed. The exposed second inner lead portion 30b may have an area to be electrically connected to the second electrode 12 of the light emitting element 10, but a large area is preferable from the viewpoint of reflection efficiency. The first outer lead portion 20b and the second outer lead portion 30b on the back surface side are exposed and form substantially the same plane. As a result, the mounting stability of the surface-mounted light emitting device can be improved. In order to prevent a short circuit between the rear surfaces of the first inner lead portion 20a and the second inner lead portion 30a due to solder during soldering, the electrically insulating insulating member 90 may be thinly coated. The insulating member 90 is resin or the like.

The first lead 20 and the second lead 30 can be configured by using a good electric conductor such as iron, phosphor bronze, and copper alloy. Further, in order to improve the reflectance of light from the light emitting element 10, the surfaces of the first lead 20 and the second lead 30 may be plated with a metal such as silver, aluminum, copper or gold. Further, in order to improve the reflectance of the surfaces of the first lead 20 and the second lead 30, it is preferable that the surfaces are smooth. In addition, the areas of the first lead 20 and the second lead 300 can be increased in order to improve heat dissipation. Thereby, the temperature rise of the light emitting element 10 can be effectively suppressed, and a relatively large amount of electricity can be supplied to the light emitting element 10. Moreover, the heat dissipation can be improved by making the first lead 20 and the second lead 30 thick. In this case, the forming process such as bending the first lead 20 and the second lead 30 is difficult, and thus the first lead 20 and the second lead 30 are cut into a predetermined size. Further, by making the first lead 20 and the second lead 30 thick, the deflection of the first lead 20 and the second lead 30 is reduced, and the mounting of the light emitting element 10 can be facilitated. .. On the contrary, by forming the first lead 20 and the second lead 30 into a thin flat plate shape, the forming process of bending can be facilitated and can be formed into a predetermined shape.

The first lead 20 and the second lead 30 are a pair of positive and negative electrodes. At least one first lead 20 and at least one second lead 30 may be provided, but a plurality of them may be provided. When mounting a plurality of light emitting elements 10 on the first lead 20, it is also necessary to provide a plurality of second leads 30.

<Second resin molding>
The second resin molded body 50 is provided to protect the light emitting element 10 from an external force from the external environment, dust, moisture and the like. Further, the light emitted from the light emitting element 10 can be efficiently emitted to the outside. The second resin molded body 50 is arranged in the recess 40c of the first resin molded body 40.

The material of the second resin molded body 50 is a thermosetting resin. Among thermosetting resins, at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, and urethane resin is preferable, and epoxy resin, modified epoxy resin is particularly preferable. , Silicone resins and modified silicone resins are preferred. The second resin molded body 50 is preferably hard so as to protect the light emitting element 10. The second resin molded body 50 is preferably made of a resin having excellent heat resistance, weather resistance, and light resistance. The second resin molded body 50 may be mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent substance, and a reflective substance in order to have a predetermined function. A diffusing agent may be contained in the second resin molded body 50. As a specific diffusing agent, barium titanate, titanium oxide, aluminum oxide, silicon oxide or the like can be preferably used. Further, an organic or inorganic coloring dye or coloring pigment may be contained for the purpose of cutting wavelengths other than the desired wavelength. Furthermore, the second resin molded body 50 can also contain a fluorescent substance 80 that absorbs light from the light emitting element 10 and converts the wavelength.

(Fluorescent substance)
The fluorescent substance 80 may be any substance that absorbs light from the light emitting element 10 and converts it into light of a different wavelength. For example, nitride-based phosphors/oxynitride-based phosphors/sialon-based phosphors, which are mainly activated by lanthanoid-based elements such as Eu and Ce, lanthanoid-based phosphors such as Eu, and transition metal-based elements such as Mn. Alkaline earth halogen apatite phosphor, alkaline earth metal borate halogen phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate, alkaline earth sulfide, alkaline earth thiogallate , Alkaline earth silicon nitride, germanate, or an organic compound mainly activated by a lanthanoid element such as a rare earth aluminate, a rare earth silicate or Eu which is mainly activated by a lanthanoid element such as Ce. It is preferably at least one or more selected from organic complexes and the like. As a specific example, the following phosphors can be used, but are not limited thereto.

The nitride-based phosphor that is mainly activated by lanthanoid-based elements such as Eu and Ce is M ₂ Si ₅ N ₈ :Eu, CaAlSiN ₃ :Eu (M is selected from Sr, Ca, Ba, Mg and Zn). There is at least one or more types). In addition to M ₂ Si ₅ N ₈ :Eu, MSi ₇ N ₁₀ :Eu, M _1.8 Si ₅ O _0.2 N ₈ :Eu, M _0.9 Si ₇ O _0.1 N ₁₀ :Eu(M Is at least one selected from Sr, Ca, Ba, Mg and Zn).

The oxynitride-based phosphor that is mainly activated by a lanthanoid-based element such as Eu or Ce is MSi ₂ O ₂ N ₂ :Eu (M is at least one selected from Sr, Ca, Ba, Mg, and Zn). It is).

The sialon-based phosphor that is mainly activated by lanthanoid-based elements such as Eu and Ce is M _p/2 Si _12-p-q Al _p+q O _q N _16-p :Ce, M-Al-Si-O-N. (M is at least one selected from Sr, Ca, Ba, Mg and Zn. q is 0 to 2.5 and p is 1.5 to 3.) and the like.

M ₅ (PO ₄ ) ₃ X:R (M is Sr, Ca, Ba) is contained in an alkaline earth halogen apatite phosphor that is mainly activated by a lanthanoid-based element such as Eu or a transition metal-based element such as Mn. , Mg, Zn, at least one or more, X is at least one or more selected from F, Cl, Br, and I. R is any one or more of Eu, Mn, and Eu and Mn. It is).

The alkaline earth metal borate halogen phosphor is M ₂ B ₅ O ₉ X:R (M is at least one selected from Sr, Ca, Ba, Mg and Zn. X is F or Cl. , Br, and I. R is Eu, Mn, or any one or more of Eu and Mn).

The alkaline earth metal aluminate phosphor includes SrAl ₂ O ₄ :R, Sr ₄ Al ₁₄ O ₂₅ :R, CaAl ₂ O ₄ :R, BaMg ₂ Al ₁₆ O ₂₇ :R, BaMg ₂ Al ₁₆ O ₁₂ :R, BaMgAl ₁₀ O ₁₇ :R (R is any one or more of Eu, Mn, and Eu and Mn).

Examples of alkaline earth sulfide phosphors include La ₂ O ₂ S:Eu, Y ₂ O ₂ S:Eu, and Gd ₂ O ₂ S:Eu.

Rare earth aluminate phosphors mainly activated by lanthanoid-based elements such as Ce include Y ₃ Al ₅ O ₁₂ :Ce, (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ :Ce, Y ₃ There is a YAG-based phosphor represented by a composition formula of (Al _0.8 Ga _0.2 ) ₅ O ₁₂ :Ce, (Y,Gd) ₃ (Al,Ga) ₅ O ₁₂ . In addition, there are Tb ₃ Al ₅ O ₁₂ :Ce, Lu ₃ Al ₅ O ₁₂ :Ce, and the like in which part or all of Y is replaced with Tb, Lu, or the like.

Other phosphors include ZnS:Eu, Zn ₂ GeO ₄ :Mn, MGa ₂ S ₄ :Eu (M is at least one selected from Sr, Ca, Ba, Mg, and Zn. X is X. And at least one selected from F, Cl, Br, and I).

The above-mentioned phosphor may contain one or more selected from Tb, Cu, Ag, Au, Cr, Nd, Dy, Co, Ni and Ti instead of Eu, or in addition to Eu, as desired. You can also

Further, phosphors other than the above-mentioned phosphors, which have similar performances and effects, can also be used.

These phosphors can use phosphors having an emission spectrum in yellow, red, green, and blue due to the excitation light of the light emitting element 10, and emit light in intermediate colors such as yellow, blue green, and orange. Phosphors with spectra can also be used. By using various combinations of these phosphors, it is possible to manufacture a surface-mounted light emitting device having various emission colors.

For example, using a GaN-based compound semiconductor that emits blue light, a fluorescent substance of Y ₃ Al ₅ O ₁₂ :Ce or (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ :Ce is irradiated to perform wavelength conversion. To do. It is possible to provide a surface-mounted light emitting device that emits white light by a mixed color of light from the light emitting element 10 and light from the phosphor 60.

For example, CaSi ₂ O ₂ N ₂ :Eu or SrSi ₂ O ₂ N ₂ :Eu that emits green to yellow light and (Sr,Ca) ₅ (PO ₄ ) ₃ Cl:Eu that emits blue light as a phosphor. By using the phosphor 60 made of (Ca,Sr) ₂ Si ₅ N ₈ :Eu that emits red light, it is possible to provide a surface-mounted light emitting device that emits white light with good color rendering properties. .. This uses red, blue, and green, which are the three primary colors, so that the desired white light can be achieved simply by changing the mixing ratio of the first phosphor and the second phosphor. You can

(Other)
A Zener diode can be further provided as a protective element in the surface-mounted light emitting device. The Zener diode can be mounted on the first lead 20 on the bottom surface 40a of the recess 40c apart from the light emitting element 10. Further, the Zener diode may be mounted on the first lead 20 on the bottom surface 40a of the recess 40c, and the light emitting element 10 may be mounted thereon. Besides □280 μm size, □300 μm size can be used.

The wire 60 electrically connects the second electrode 12 of the light emitting element 10 and the second lead 30, and the first electrode 11 of the light emitting element 10 and the first lead 20. The wire 60 is required to have good ohmic properties, mechanical connectivity, electrical conductivity and thermal conductivity with the electrodes of the light emitting element 10. The thermal conductivity is preferably 0.01 cal/(S) (cm ² )(°C/cm) or more, more preferably 0.5 cal/(S)(cm ² )(°C/cm) or more. A wire is stretched from directly above the light emitting element 10 to the wire bonding area of the plated wiring pattern to establish continuity.

With the above configuration, the surface mount light emitting device according to the present invention can be provided.

<Mounting state of surface mount type light emitting device>
A mounted state in which the surface mounted light emitting device is electrically connected to an external electrode is shown. FIG. 3 is a schematic cross-sectional view showing a mounted state of the surface mount light emitting device according to the first embodiment.

The heat dissipation member 110 can be provided on the back surface side of the surface-mounted light emitting device via the heat dissipation adhesive 100. It is preferable that the heat radiation adhesive 100 has higher thermal conductivity than the material of the first resin molded body 40. As a material of the heat dissipation adhesive 100, an electrically insulating epoxy resin, a silicone resin, or the like can be used. The material of the heat dissipation member 110 is preferably aluminum, copper, tungsten, gold or the like having good thermal conductivity. In addition, by disposing the heat dissipation member 110 via the heat dissipation adhesive 109 so as to contact only the first lead 20, it is possible to use a eutectic metal containing solder having higher thermal conductivity as the heat dissipation adhesive. .. Since the back surface side of the surface-mounted light emitting device is flat, it is possible to maintain stability during mounting on the heat dissipation member 110. In particular, since the first lead 20 and the heat dissipation member 110 are provided so as to have the shortest distance from the light emitting element 10, the heat dissipation is high.

The first outer lead portion 20b of the first lead 20 and the second outer lead portion 30b of the second lead 30 are electrically connected to the external electrode. Since the first lead 20 and the second lead 30 are thick flat plates, they are electrically connected so as to be sandwiched between the external electrode and the heat dissipation member 90. Lead-free solder is used for electrical connection between the first outer lead portion 20b, the second outer lead portion 30b and the external electrode. In addition, the first outer lead portion 20b and the like may be electrically connected so as to be placed on the external electrode.

<Second Embodiment>
A surface mount light emitting device according to the second embodiment will be described. Descriptions of portions having the same configuration as the surface-mounted light emitting device according to the first embodiment will be omitted. FIG. 4 is a schematic plan view showing the surface-mounted light emitting device according to the second embodiment.

In this surface mount type light emitting device, the first lead 21 and the second lead 31 are provided with irregularities to expand the contact area with the first resin molded body 40. As a result, it is possible to prevent the first lead 21 and the second lead 31 from coming off from the first resin molded body 40.

<Third Embodiment>
A surface mount light emitting device according to the third embodiment will be described. Descriptions of portions having the same configuration as the surface-mounted light emitting device according to the first embodiment will be omitted. FIG. 5 is a schematic cross-sectional view showing a surface-mounted light emitting device according to the third embodiment.

In this surface mounting type light emitting device, thin plates are used for the first lead 22 and the second lead 32. This makes it possible to provide a smaller and thinner surface mount light emitting device. The thin flat plate shape may be a rectangular shape as shown in the first embodiment, or may be a shape provided with unevenness as shown in the second embodiment.

<Fourth Embodiment>
A surface mount light emitting device according to the fourth embodiment will be described. Descriptions of portions having the same configuration as the surface-mounted light emitting device according to the third embodiment will be omitted. FIG. 6 is a schematic cross-sectional view showing the surface-mounted light emitting device according to the fourth embodiment.

In this surface-mounted light emitting device, the first lead 23 and the second lead 33 are bent to the main surface side. Since the first lead 23 and the second lead 33 are thin, they can be easily bent. As a result, at the time of mounting, the solder can crawl onto the bent first outer lead portion 23b and second bent outer lead portion 33b, and can be firmly fixed. In the transfer molding step of pouring the first resin, the first inner lead portion 23a and the second inner lead portion 33b are sandwiched between the upper mold and the lower mold, so Even if the second inner lead portion 33b is thin, burrs do not occur.

<Fifth Embodiment>
A surface mount light emitting device according to the fifth embodiment will be described. Descriptions of portions having the same configuration as the surface-mounted light emitting device according to the third embodiment will be omitted. FIG. 7 is a schematic cross-sectional view showing the surface-mounted light emitting device according to the fifth embodiment. FIG. 8 is a schematic cross-sectional view showing a mounted state of the surface-mounted light emitting device according to the fifth embodiment.

In this surface-mounted light emitting device, the first outer lead portion 24b and the second outer lead portion 34b are bent toward the main surface side and further outward. As a result, the surface mounting type light emitting device is sandwiched between the heat dissipation member 90 and the external electrode, which facilitates mounting and improves the mounting stability. In addition, the connection position between the first lead 24 and the second lead 34 and the external electrode can be set higher than the fixing position between the first lead 24 and the second lead 34 and the heat dissipation member 90. As a result, the entire surface-mounted light emitting device except the light emitting surface can be hidden from the mounting substrate, and thus the mounting substrate itself can be efficiently used as a reflector.

<Sixth Embodiment>
A surface mount light emitting device according to the sixth embodiment will be described. Descriptions of portions having the same configuration as the surface-mounted light emitting device according to the third embodiment will be omitted. FIG. 9 is a schematic sectional view showing a surface-mounted light emitting device according to the sixth embodiment.

In this surface-mounted light emitting device, the heat dissipation member 91 is incorporated in the first resin molded body 41. The heat dissipation member 91 is arranged on the back surface of the first inner lead portion 25a. This makes it possible to provide a surface-mounted light emitting device that integrally has the heat dissipation member 91. Further, it is not necessary to provide the heat dissipation member 91 as a separate member, and it is not necessary to consider the adhesion between the surface mount light emitting device and the heat dissipation member 91. Further, the heat dissipation member 91 can be made substantially flush with the back surface side of the first resin molded body 41, and the stability of the surface mount light emitting device can be improved. The first outer lead portion 25b and the second outer lead portion 35b are bent into a predetermined shape.

In this surface mount type light emitting device, the first inner lead portion 25a and the second inner lead portion 35a are sandwiched by an upper mold and a lower mold, and a predetermined recess is formed between the first inner lead part 25a and the first inner lead part 25a. It is provided on the main surface side and the back surface side of the second inner lead portion 35a. As a result, it is possible to more effectively prevent the first inner lead portion 25a and the second inner lead portion 35a from being pulled out. Further, it is possible to provide a surface-mounted light emitting device having a predetermined thickness.

<Method for manufacturing surface-mounted light emitting device>
A method of manufacturing the surface mount light emitting device according to the present invention will be described. The present manufacturing method is for the above-mentioned surface mount light emitting device. 10A to 10E are schematic cross-sectional views showing the manufacturing process of the surface mount light emitting device according to the first embodiment.

The first inner lead portion 20a, the second inner lead portion 30a, the first outer lead portion 20b, and the second outer lead portion 30b, which correspond to the bottom surface 40a of the recess 40c of the first resin molded body 40, It is sandwiched between the upper die 120 and the lower die 121 (first step).

The upper die 120 forms a recess corresponding to the recess of the first resin molded body. A portion of the upper die 120 corresponding to the bottom surface 40a of the recess 40c of the first resin molded body 40 is formed so as to contact the first inner lead portion 20a and the second inner lead portion 30a.

The first thermosetting resin is poured into the recessed portion sandwiched between the upper die 120 and the lower die 121 by the transfer molding step (second step).

In the transfer molding step, a pellet-shaped first thermosetting resin having a predetermined size is put in a predetermined container. Pressure is applied to the designated container. The first thermosetting resin in a molten state is poured into the recessed portion sandwiched between the upper die 120 and the lower die 121 connected from the predetermined container. The upper mold 120 and the lower mold 121 are warmed to a predetermined temperature, and the poured first thermosetting resin is cured. This series of steps is called a transfer molding step.

Since the first inner lead portion 20a and the second inner lead portion 30a are sandwiched, the first inner lead portion 20a and the second inner lead portion 30a do not flap when the first thermosetting resin is poured. The occurrence of burrs can be suppressed.

The poured first thermosetting resin is heated and hardened to form the first resin molding 40 (third step).

In this way, the first resin molded body 40 using the thermosetting resin is molded. This makes it possible to provide a package having excellent heat resistance, light resistance, adhesion and the like. Further, it is possible to provide the first resin molded body 40 using the thermosetting resin having the recess 40c having the bottom surface 40a and the side surface 40b.

The upper die 120 and the lower die 121 are removed (fourth step).

In order to mount the light emitting element 10, the upper die 120 and the lower die 121 are removed. When the curing is insufficient, post-curing is performed to improve the mechanical strength of the resin molded body 40 to the extent that no problems occur during work.

The light emitting element 10 is mounted on the first inner lead portion 20a. The first electrode 11 of the light emitting element 10 and the first inner lead portion 20a are electrically connected. The second electrode 12 of the light emitting element 10 and the second inner lead portion 20b are electrically connected (fifth step).

The first electrode 11 and the first inner lead portion 20a are electrically connected via the wire 60. However, when the light emitting device 10 has electrodes on the upper surface and the lower surface, electrical connection is made only by die bonding without using wires. Next, the second electrode 12 and the second inner lead portion 30a are electrically connected via the wire 60.

The second thermosetting resin is placed in the recess 40c in which the light emitting element 10 is placed (sixth step).

As a method for disposing the second thermosetting resin, a dropping means, an injection means, an extruding means, or the like can be used, but it is preferable to use the dropping means. This is because the air remaining in the recess 40c can be effectively expelled by using the dropping means. The second thermosetting resin is preferably mixed with the fluorescent substance 80. This makes it easy to adjust the color tone of the surface-mounted light emitting device.

The second thermosetting resin is heated and cured to mold the second resin molded body (seventh step).

As a result, the surface mount light emitting device can be easily manufactured. Further, the first resin molded body 40 and the second resin molded body 50 can be molded with a thermosetting resin, and a surface mount type light emitting device having high adhesiveness can be provided. In addition, the surface mount type light emitting device having excellent heat resistance, light resistance, adhesiveness, etc. can be provided without peeling of the interface between the first resin molded body 40 and the second resin molded body 50. ..

The surface mount light emitting device according to the first embodiment is illustrated in FIGS. 1 and 2. The description of the same structure as that of the surface mount light emitting device according to the first embodiment will be omitted.

The surface mount light emitting device according to the first embodiment includes the light emitting element 10, the first resin molded body 40 on which the light emitting element 10 is mounted, and the second resin molded body 50 that covers the light emitting element 10. The first resin molded body 40 integrally forms a first lead 20 for mounting the light emitting element 10 and a second lead 30 electrically connected to the light emitting element 10. The first resin molding 40 has a recess 40c having a bottom surface 40a and a side surface 40b, the opening of the recess 40c is wider than the bottom surface 40a, and the side surface 40b is provided with an inclination. ..

As the light emitting element 10, a GaN-based element that emits blue light is used. The light emitting element 10 has a first electrode 11 and a second electrode 12 on the same surface side, and is bonded face-up to the first lead 20 using a die bond resin (epoxy resin containing silver). There is. The first electrode 11 is electrically connected to the first lead 20 using a gold wire 60. The second electrode 11 is also electrically connected to the second lead 30 using the gold wire 60. The first lead 20 and the second lead 30 use copper as a base material, and the portions exposed from the first resin molded body 40 are silver-plated. The first lead 20 and the second lead 30 are made of a slightly thick plate (about 0.5 mm), and the back surfaces of the first lead 20 and the second lead 30 are exposed. The first resin molding 40 comprises 100 parts by weight of a mixture of an epoxy resin made of triglycidyl isocyanurate and an acid anhydride made of hexahydrophthalic anhydride in an equivalent ratio, 0.5 parts by weight of DBU and 1 part by weight of ethylene glycol. A mixture containing 10 parts by weight of titanium oxide pigment and 50 parts by weight of glass fiber is used. The second resin molded body 50 uses a silicone resin. The second resin molding _{50 (Y 0.8 Gd 0.2) 3} Al 5 O 12: is mixed with the YAG phosphor 80 having a composition of Ce uniformly. The second resin molded body 50 is arranged in the recess 40c having the bottom surface 40a and the side surface 40b, and the surface of the second resin molded body 50 coincides with the upper surface of the recess 40c. As a result, the amount of YAG phosphor 80 for each product is made uniform. An insulating member 90 made of an epoxy resin sheet having a predetermined thickness is attached to the back surfaces of the first lead 20 and the second lead 30.

The surface mount light emitting device according to the first embodiment is manufactured by the following steps. FIG. 10 is a schematic cross-sectional view showing the manufacturing process of the surface-mounted light emitting device according to the first embodiment.

A predetermined lead frame is punched to provide a plurality of first leads 20 and second leads 30. The lead frame is fixed to the lower die 121 heated to about 150°C. Similarly, the lead frame is sandwiched by the upper mold 120 heated to about 150°C. The sandwiching is a portion corresponding to the inner lead portions 20a, 30a and the outer lead portions 20b, 30b of the first lead 20 and the second lead 30. A tablet obtained by tableting the above epoxy resin composition corresponding to the first resin molded body 40 is placed in the mold cylinder part. This tablet is poured into the mold by a piston (transfer molding). The cast epoxy resin is heated in a mold at about 150° C. for about 3 minutes to be temporarily cured. Next, the upper mold 120 and the lower mold 121 are divided and the semi-cured product of the epoxy resin composition is taken out from the mold. After taking out, heating is further performed at about 150° C. for about 3 hours to perform main curing. As a result, a lead frame obtained by molding the first resin molding 40 is obtained from a completely cured product of the above epoxy resin composition that is integrally molded with the lead frame. The first resin molding 40 has a recess 40c having a bottom surface 40a and a side surface 40b, and the lead frame is exposed on the bottom surface 40a. A plating process is applied to portions of the lead frame corresponding to the outer lead portions 20b and 30b.

Next, the light emitting element 10 is die-bonded to the bottom surface 40a of the recess 40c. The first electrode 11 of the light emitting element 10 and the first inner lead portion 20a of the first lead 20 and the second electrode 12 and the second inner lead portion 30a of the second lead 30 are respectively connected to the wire 60. Use to connect electrically.

Next, a silicone resin corresponding to the second resin molded body 50, in which the YAG phosphor 80 is uniformly mixed, is dropped to the upper surface of the recess 40c. The YAG-based phosphor 80 precipitates due to the viscosity of the silicone resin and the like. When the YAG-based phosphor 80 is settled, the YAG-based phosphor can be arranged around the light emitting element 10, and a surface-mounted light emitting device having a predetermined color tone can be provided. After dropping the silicone resin, the silicone resin is cured to form the second resin molded body 50.

Finally, the lead frame is cut out at a predetermined position to form the first outer lead portion 20b and the second outer lead portion 30b. Thus, the surface mount light emitting device according to the first embodiment can be manufactured.

INDUSTRIAL APPLICABILITY The surface-mounted light emitting device of the present invention can be used for lighting fixtures, displays, backlights of mobile phones, camera flashlights, moving image auxiliary light sources, and the like.

10 light emitting element 11 1st electrode 12 2nd electrode 20 1st lead 20a 1st inner lead part 20b 1st outer lead part 30 2nd lead 30a 2nd inner lead part 30b 2nd outer lead Part 40 First resin molded body 40a Bottom surface 40b Side surface 40c Recessed portion 50 Second resin molded body 60 Wire 70 Filler 80 Fluorescent substance 90 Insulation member 100 Heat dissipation adhesive 110 Heat dissipation member 120 Upper mold 121 Lower mold 210 Light emitting element 220 Lead frame for mounting 230 Lead frame for connection 240 Molded body 250 Translucent sealing resin

Claims (1)

A light emitting element, a first resin molded body obtained by integrally molding a light emitting element with a first lead for mounting the light emitting element and a second lead electrically connected to the light emitting element using a resin; And a second resin molded body that covers the light emitting element, wherein the first resin molded body has a concave portion having a bottom surface and a side surface, and The first lead is exposed from the bottom surface of the recess of the first resin molded body, and the light emitting element is mounted on the exposed portion. The resin of the first resin molded body and the second resin A molded body is a surface-mounted light-emitting device that is a thermosetting resin.

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