JP2020088264A - 半導体装置の製造方法及び仮固定材用積層フィルム - Google Patents
半導体装置の製造方法及び仮固定材用積層フィルム Download PDFInfo
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Abstract
Description
本実施形態に係る半導体装置の製造方法は、支持部材と、光を吸収して熱を発生する仮固定材層(以下、単に「仮固定材層」という場合がある。)と、半導体部材とがこの順に積層された積層体を準備する準備工程と、積層体における仮固定材層に光を照射して、支持部材から半導体部材を分離する分離工程とを備える。
図1は、本発明の半導体装置の製造方法の一実施形態を説明するための模式断面図であり、図1(a)及び(b)は、各工程を示す模式断面図である。図1(a)に示すとおり、積層体の準備工程においては、支持部材10と、仮固定材層30cと、半導体部材40とがこの順に積層された積層体100を準備する。
図1(b)に示すとおり、半導体部材の分離工程においては、積層体100における仮固定材層30cに光を照射して、支持部材10から半導体部材40を分離する。
上述の光を吸収して熱を発生する光吸収層と、硬化性樹脂成分を含む樹脂層とを有し、硬化性樹脂成分が、アクリル樹脂を含み、硬化性樹脂成分の硬化物における250℃の貯蔵弾性率が、2〜15MPaである積層フィルムは、半導体部材を支持部材に仮固定するための仮固定材として好適に用いることができる。
<硬化性樹脂成分の調製>
アクリル樹脂として、エポキシ基含有アクリル樹脂(アクリルゴム)(商品名:HTR−860P、ナガセケムテックス株式会社製、重量平均分子量:80万、グリシジル官能基モノマー比率:3%、Tg:−7℃)70質量部、エポキシ樹脂として、クレゾールノボラック型多官能エポキシ樹脂(商品名:YDCN700−10、新日鉄住金化学株式会社)16質量部、エポキシ樹脂硬化剤として、フェノールアラルキル樹脂(商品名:XLC−LL、三井化学株式会社)14質量部、及び硬化促進剤として、1−ベンジル−2−メチルイミダゾール(商品名:キュアゾール1B2MZ、四国化成工業株式会社)1質量部を混合して混合物を得た。なお、アクリル樹脂はシクロヘキサノンで固形分25質量%に希釈したものを用いた。これらを、自動撹拌装置を用いて、2200回転/分で10分間撹拌することによって、溶剤としてトルエンを含む硬化性樹脂成分のワニスを調製した。
得られた硬化性樹脂成分のワニスを、精密塗工機を用いて、ポリエチレンテレフタレート(PET)フィルム(ピューレックスA31、帝人デュポンフィルム株式会社、厚み:38μm)の離型処理面に厚みが20μmとなるように塗工し、90℃で10分間加熱して、溶剤を乾燥除去し、厚みが20μmである硬化性樹脂成分フィルム(樹脂層)を作製した。また、厚みが200μmとなるように塗工し、90℃で15〜20分間加熱して、溶剤を乾燥除去し、厚みが200μmである硬化性樹脂成分フィルム(樹脂層)を作製した。
得られた厚みが200μmである硬化性樹脂成分フィルムを、所定のサイズ(縦(チャック間距離)20mm×横5.0mm)に切り出し、クリーンオーブン(エスペック株式会社製)中で180℃、2時間の条件で熱硬化させることによって、硬化性樹脂成分フィルムの硬化物(硬化性樹脂成分の硬化物)である測定サンプルを得た。硬化性樹脂成分フィルムの硬化物(樹脂硬化物層)における250℃の貯蔵弾性率を、以下の条件で測定した。結果を表2に示す。
測定温度領域:−70〜300℃
昇温速度:5℃/分
周波数:1Hz
測定モード:引張モード
支持部材であるスライドガラス(サイズ:40mm×40mm、厚み:0.8μm)上にスパッタで第1の導電体層がチタン、第2の導電体層が銅である光吸収層を作製し、光吸収層を備える支持部材を得た。なお、当該光吸収層は、逆スパッタリングによる前処理(Ar流速:1.2×10−2Pa・m3/s(70sccm)、RF電力:300W、時間:300秒間)後、表1に示す処理条件でRFスパッタリングを行い、チタン層/銅層の厚みを50nm/200nmとすることによって作製した。
厚みが20μmである硬化性樹脂成分フィルム(樹脂層)を40mm×40mmに切り出した。得られた光吸収層を備える支持部材の光吸収層上に、切り出した硬化性樹脂成分フィルム(樹脂層)を配置し、真空ラミネートを行うことによって、支持部材上に設けられた実施例1の仮固定材用積層フィルムを作製した。
得られた仮固定材用積層フィルムの硬化性樹脂成分フィルム(樹脂層)上に、半導体部材である半導体チップ(サイズ:10mm×10mm、厚み:150μm)を搭載し、180℃で1時間の条件で熱硬化させることによって、実施例1の積層体を得た。
アクリル樹脂とエポキシ樹脂とエポキシ樹脂硬化剤との質量比を70:16:14から60:21:19に変更した以外は、実施例1と同様にして、硬化性樹脂成分フィルムの硬化物(樹脂硬化物層)における250℃の貯蔵弾性率を測定し、実施例2の仮固定材用積層フィルム及び積層体を作製した。250℃の貯蔵弾性率の結果を表2に示す。
アクリル樹脂、エポキシ樹脂、及びエポキシ樹脂硬化剤の全量を基準として10質量%のシリカフィラー(商品名:R972、日本アエロジル株式会社)を加えた以外は、実施例1と同様にして、硬化性樹脂成分フィルムの硬化物(樹脂硬化物層)における250℃の貯蔵弾性率を測定し、実施例3の仮固定材用積層フィルム及び積層体を作製した。250℃の貯蔵弾性率の結果を表2に示す。
アクリル樹脂とエポキシ樹脂とエポキシ樹脂硬化剤との質量比を70:16:14から80:11:9に変更した以外は、実施例1と同様にして、硬化性樹脂成分フィルムの硬化物(樹脂硬化物層)における250℃の貯蔵弾性率を測定し、比較例1の仮固定材用積層フィルム及び積層体を作製した。250℃の貯蔵弾性率の結果を表2に示す。
アクリル樹脂、エポキシ樹脂、及びエポキシ樹脂硬化剤の全量を基準として20質量%のシリカフィラー(商品名:R972、日本アエロジル株式会社)を加えた以外は、実施例1と同様にして、硬化性樹脂成分フィルムの硬化物(樹脂硬化物層)における250℃の貯蔵弾性率を測定し、比較例2の仮固定材用積層フィルム及び積層体を作製した。250℃の貯蔵弾性率の結果を表2に示す。
積層体をそれぞれ2つ用意した。印加電圧3800V、パルス幅200μs、照射距離50mm、照射回数1回、及び照射時間200μsの照射条件A、並びに、印加電圧2700V、パルス幅1000μs、照射距離50mm、照射回数1回、及び照射時間1000μsの照射条件Bの2種類の照射条件でそれぞれ積層体をキセノンランプで照射し、支持部材からの剥離性を評価した。キセノンランプは、Xenon社製のS2300(波長範囲:270nm〜近赤外領域、単位面積あたりの照射エネルギー:7J/cm2(予測値、照射条件A)、13J/cm2(予測値、照射条件B))を用い、キセノンランプ照射は、積層体の支持部材(スライドガラス)側から行った。照射距離は、光源とスライドガラスを設置したステージとの距離である。剥離性試験の評価は、キセノンランプ照射後、自然に半導体チップがスライドガラスから剥離したものを「A」と評価し、いずれかの照射条件で半導体チップとスライドガラスとの間にピンセットを差し込んだときに、半導体チップが破損することなく、分離したものを「B」と評価し、いずれかの照射条件で分離しなかったものを「C」と評価した。結果を表2に示す。
Claims (7)
- 支持部材と、光を吸収して熱を発生する仮固定材層と、半導体部材とがこの順に積層された積層体を準備する準備工程と、
前記積層体における前記仮固定材層に光を照射して、前記支持部材から前記半導体部材を分離する分離工程と、
を備え、
前記仮固定材層が、光を吸収して熱を発生する光吸収層と、硬化性樹脂成分の硬化物を含む樹脂硬化物層とを有し、
前記硬化性樹脂成分が、アクリル樹脂を含み、
前記硬化性樹脂成分の硬化物における250℃の貯蔵弾性率が、2〜15MPaである、半導体装置の製造方法。 - 前記分離工程における前記光の光源が、キセノンランプである、請求項1に記載の半導体装置の製造方法。
- 前記分離工程における前記光が、少なくとも赤外光を含む光である、請求項1又は2に記載の半導体装置の製造方法。
- 前記分離工程が、前記支持部材を介して前記仮固定材層に前記光を照射する工程である、請求項1〜3のいずれか一項に記載の半導体装置の製造方法。
- 前記硬化性樹脂成分が、熱硬化性樹脂をさらに含む、請求項1〜4のいずれか一項に記載の半導体装置の製造方法。
- 半導体部材を支持部材に仮固定するための仮固定材用積層フィルムであって、
光を吸収して熱を発生する光吸収層と、硬化性樹脂成分を含む樹脂層とを有し、
前記硬化性樹脂成分が、アクリル樹脂を含み、
前記硬化性樹脂成分の硬化物における250℃の貯蔵弾性率が、2〜15MPaである、仮固定材用積層フィルム。 - 前記樹脂層の厚みが、50μm以下である、請求項6に記載の仮固定材用積層フィルム。
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