JP2020072196A - 熱伝導シート - Google Patents

熱伝導シート Download PDF

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Publication number
JP2020072196A
JP2020072196A JP2018205798A JP2018205798A JP2020072196A JP 2020072196 A JP2020072196 A JP 2020072196A JP 2018205798 A JP2018205798 A JP 2018205798A JP 2018205798 A JP2018205798 A JP 2018205798A JP 2020072196 A JP2020072196 A JP 2020072196A
Authority
JP
Japan
Prior art keywords
heat
heat conductive
magnetic permeability
relative magnetic
conductive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018205798A
Other languages
English (en)
Japanese (ja)
Inventor
松崎　徹
Toru Matsuzaki
徹 松崎
川口　康弘
Yasuhiro Kawaguchi
康弘 川口
政宏 齋藤
Masahiro Saito
政宏 齋藤
堅祐 三ツ矢
Kensuke Mitsuya
堅祐 三ツ矢
正明 伊藤
Masaaki Ito
正明 伊藤
俊之 大森
Toshiyuki Omori
俊之 大森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Industries Co Ltd
Seiko Epson Corp
Original Assignee
Kitagawa Industries Co Ltd
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitagawa Industries Co Ltd, Seiko Epson Corp filed Critical Kitagawa Industries Co Ltd
Priority to JP2018205798A priority Critical patent/JP2020072196A/ja
Priority to PCT/JP2019/040896 priority patent/WO2020090499A1/fr
Publication of JP2020072196A publication Critical patent/JP2020072196A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Soft Magnetic Materials (AREA)
JP2018205798A 2018-10-31 2018-10-31 熱伝導シート Pending JP2020072196A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018205798A JP2020072196A (ja) 2018-10-31 2018-10-31 熱伝導シート
PCT/JP2019/040896 WO2020090499A1 (fr) 2018-10-31 2019-10-17 Feuille thermoconductrice

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018205798A JP2020072196A (ja) 2018-10-31 2018-10-31 熱伝導シート

Publications (1)

Publication Number Publication Date
JP2020072196A true JP2020072196A (ja) 2020-05-07

Family

ID=70463672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018205798A Pending JP2020072196A (ja) 2018-10-31 2018-10-31 熱伝導シート

Country Status (2)

Country Link
JP (1) JP2020072196A (fr)
WO (1) WO2020090499A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022059701A1 (fr) * 2020-09-17 2022-03-24 北川工業株式会社 Feuille thermoconductrice

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4159816A1 (fr) * 2020-05-29 2023-04-05 Kyocera Corporation Composition de résine et composant électronique

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4447155B2 (ja) * 2000-12-18 2010-04-07 Ｆｄｋ株式会社 電磁波抑制熱伝導シート
JP4543864B2 (ja) * 2004-10-05 2010-09-15 ソニー株式会社 放熱部品及びその製造方法
CN204335258U (zh) * 2014-12-19 2015-05-13 比亚迪股份有限公司 一种具有散热及防电磁干扰结构的电子装置
JP6469604B2 (ja) * 2016-03-09 2019-02-13 株式会社豊田中央研究所 絶縁基板及び絶縁基板を備える電力変換装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022059701A1 (fr) * 2020-09-17 2022-03-24 北川工業株式会社 Feuille thermoconductrice

Also Published As

Publication number Publication date
WO2020090499A1 (fr) 2020-05-07

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