JP2020033619A - 排気配管装置及びクリーニング装置 - Google Patents

排気配管装置及びクリーニング装置 Download PDF

Info

Publication number
JP2020033619A
JP2020033619A JP2018162190A JP2018162190A JP2020033619A JP 2020033619 A JP2020033619 A JP 2020033619A JP 2018162190 A JP2018162190 A JP 2018162190A JP 2018162190 A JP2018162190 A JP 2018162190A JP 2020033619 A JP2020033619 A JP 2020033619A
Authority
JP
Japan
Prior art keywords
internal electrode
main body
pipe
exhaust
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2018162190A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020033619A5 (https=
Inventor
晃宏 大石
Akihiro Oishi
晃宏 大石
裕之 福水
Hiroyuki Fukumizu
裕之 福水
博 松葉
Hiroshi Matsuba
博 松葉
一彰 栗原
Kazuaki Kurihara
一彰 栗原
健資 山内
Takemoto Yamauchi
健資 山内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kioxia Corp
Original Assignee
Kioxia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kioxia Corp filed Critical Kioxia Corp
Priority to JP2018162190A priority Critical patent/JP2020033619A/ja
Priority to US16/292,260 priority patent/US20200075297A1/en
Publication of JP2020033619A publication Critical patent/JP2020033619A/ja
Publication of JP2020033619A5 publication Critical patent/JP2020033619A5/ja
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0071—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027—Cleaning the internal surfaces; Removal of blockages
    • B08B9/032—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
    • B08B9/0321—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing using pressurised, pulsating or purging fluid
    • B08B9/0328—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing using pressurised, pulsating or purging fluid by purging the pipe with a gas or a mixture of gas and liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2209/00—Details of machines or methods for cleaning hollow articles
    • B08B2209/02—Details of apparatuses or methods for cleaning pipes or tubes
    • B08B2209/027—Details of apparatuses or methods for cleaning pipes or tubes for cleaning the internal surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027—Cleaning the internal surfaces; Removal of blockages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/335—Cleaning

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
JP2018162190A 2018-08-30 2018-08-30 排気配管装置及びクリーニング装置 Abandoned JP2020033619A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018162190A JP2020033619A (ja) 2018-08-30 2018-08-30 排気配管装置及びクリーニング装置
US16/292,260 US20200075297A1 (en) 2018-08-30 2019-03-04 Exhaust pipe device and cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018162190A JP2020033619A (ja) 2018-08-30 2018-08-30 排気配管装置及びクリーニング装置

Publications (2)

Publication Number Publication Date
JP2020033619A true JP2020033619A (ja) 2020-03-05
JP2020033619A5 JP2020033619A5 (https=) 2021-05-20

Family

ID=69642285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018162190A Abandoned JP2020033619A (ja) 2018-08-30 2018-08-30 排気配管装置及びクリーニング装置

Country Status (2)

Country Link
US (1) US20200075297A1 (https=)
JP (1) JP2020033619A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021187425A1 (ja) * 2020-03-18 2021-09-23 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、排気装置、半導体装置の製造方法及びプログラム
KR20220023856A (ko) * 2020-08-20 2022-03-03 삼성전자주식회사 베이크 유닛
JP2022039119A (ja) * 2020-08-27 2022-03-10 キオクシア株式会社 排気配管装置
JP2025010332A (ja) * 2021-01-27 2025-01-20 Ａｉメカテック株式会社 バンプ形成装置、バンプ形成方法、ハンダボールリペア装置、及び、ハンダボールリペア方法
KR102933889B1 (ko) * 2023-10-11 2026-03-05 한국기계연구원 전극 삽입형 배관 내면 처리장치 및 이를 이용한 배관 내면 처리방법

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102477302B1 (ko) * 2015-10-05 2022-12-13 주성엔지니어링(주) 배기가스 분해기를 가지는 기판처리장치 및 그 배기가스 처리방법
US11533801B2 (en) * 2017-11-30 2022-12-20 Corning Incorporated Atmospheric pressure linear rf plasma source for surface modification and treatment
CN113169101B (zh) * 2019-01-08 2022-09-30 应用材料公司 用于基板处理腔室的泵送设备与方法
CN112921304A (zh) * 2021-04-01 2021-06-08 无锡琨圣智能装备股份有限公司 一种多炉管的原子层沉积设备
KR20230025590A (ko) * 2021-08-13 2023-02-22 삼성디스플레이 주식회사 배출 방법, 배출 시스템 및 이를 포함하는 기판 처리 장치
JP7725346B2 (ja) * 2021-11-25 2025-08-19 キオクシア株式会社 排気配管装置
US12562358B2 (en) * 2022-04-28 2026-02-24 Horiba Stec Co., Ltd. System and method for detecting endpoint in plasma processing

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021187425A1 (ja) * 2020-03-18 2021-09-23 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、排気装置、半導体装置の製造方法及びプログラム
JPWO2021187425A1 (https=) * 2020-03-18 2021-09-23
JP7408772B2 (ja) 2020-03-18 2024-01-05 株式会社Kokusai Electric 基板処理装置、排気装置、半導体装置の製造方法、基板処理方法及びプログラム
KR20220023856A (ko) * 2020-08-20 2022-03-03 삼성전자주식회사 베이크 유닛
KR102788559B1 (ko) * 2020-08-20 2025-04-01 삼성전자주식회사 베이크 유닛
JP2022039119A (ja) * 2020-08-27 2022-03-10 キオクシア株式会社 排気配管装置
US11872524B2 (en) 2020-08-27 2024-01-16 Kioxia Corporation Exhaust pipe device
JP7494059B2 (ja) 2020-08-27 2024-06-03 キオクシア株式会社 排気配管装置
JP2025010332A (ja) * 2021-01-27 2025-01-20 Ａｉメカテック株式会社 バンプ形成装置、バンプ形成方法、ハンダボールリペア装置、及び、ハンダボールリペア方法
KR102933889B1 (ko) * 2023-10-11 2026-03-05 한국기계연구원 전극 삽입형 배관 내면 처리장치 및 이를 이용한 배관 내면 처리방법

Also Published As

Publication number Publication date
US20200075297A1 (en) 2020-03-05

Similar Documents

Publication Publication Date Title
JP2020033619A (ja) 排気配管装置及びクリーニング装置
JP5623008B2 (ja) プラズマ装置
KR100857871B1 (ko) 실리콘 질화물 증착시에 원격 플라즈마 소스 세정 기술을이용하여 백색 분말을 감소시키기 위한 방법 및 장치
TWI841656B (zh) 基板處理室的泵送設備與方法
JP7494059B2 (ja) 排気配管装置
TWI852382B (zh) 批次型基底處理裝置
KR102400862B1 (ko) 배기 파이프 디바이스
CN115747765A (zh) 具有保护网格的等离子体增强原子层沉积的系统和方法
US8277567B2 (en) Method of cleaning turbo pump and chamber/turbo pump clean process
JP2010504436A (ja) 希釈ガスを再循環させるための粒子トラップ／フィルタを含むシステム及び方法
JPWO2005094140A1 (ja) プラズマ発生装置
JP2021123775A (ja) 排気配管装置
JP2949874B2 (ja) Ｅｃｒプラズマｃｖｄ装置ドライクリーニングの方法
JP7725346B2 (ja) 排気配管装置
US20130140009A1 (en) Robust outlet plumbing for high power flow remote plasma source
JP2013541187A (ja) 分子状フッ素を用いる化学気相成長チャンバのクリーニング
JP2000021598A (ja) プラズマ処理装置
JPH07335563A (ja) プラズマｃｖｄ装置
CN114107949B (zh) 配备有自由基部的基板处理装置
JP3279466B2 (ja) 半導体ウエハの処理装置及び半導体素子
TW202609928A (zh) 具有熱氣吹掃的半導體處理工具及半導體處理的方法
TW202421824A (zh) 具有加熱的噴淋頭的噴淋頭組件

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210406

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210406

A762 Written abandonment of application

Free format text: JAPANESE INTERMEDIATE CODE: A762

Effective date: 20210607