JP2020030066A - 圧力センサ - Google Patents

圧力センサ Download PDF

Info

Publication number
JP2020030066A
JP2020030066A JP2018154479A JP2018154479A JP2020030066A JP 2020030066 A JP2020030066 A JP 2020030066A JP 2018154479 A JP2018154479 A JP 2018154479A JP 2018154479 A JP2018154479 A JP 2018154479A JP 2020030066 A JP2020030066 A JP 2020030066A
Authority
JP
Japan
Prior art keywords
diaphragm
pressure sensor
sensor
sensor according
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018154479A
Other languages
English (en)
Japanese (ja)
Inventor
卓也 石原
Takuya Ishihara
卓也 石原
将 添田
Susumu Soeda
将 添田
正志 関根
Masashi Sekine
正志 関根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azbil Corp
Original Assignee
Azbil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Azbil Corp filed Critical Azbil Corp
Priority to JP2018154479A priority Critical patent/JP2020030066A/ja
Priority to KR1020190096048A priority patent/KR102233599B1/ko
Priority to CN201910728798.4A priority patent/CN110849530B/zh
Publication of JP2020030066A publication Critical patent/JP2020030066A/ja
Priority to JP2022194073A priority patent/JP7417698B2/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
    • G01L7/02—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges
    • G01L7/08—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type
    • G01L7/082—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type construction or mounting of diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
JP2018154479A 2018-08-21 2018-08-21 圧力センサ Pending JP2020030066A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018154479A JP2020030066A (ja) 2018-08-21 2018-08-21 圧力センサ
KR1020190096048A KR102233599B1 (ko) 2018-08-21 2019-08-07 압력 센서
CN201910728798.4A CN110849530B (zh) 2018-08-21 2019-08-08 压力传感器
JP2022194073A JP7417698B2 (ja) 2018-08-21 2022-12-05 圧力センサ用ダイアフラムの撓みを抑制する方法および圧力センサ用ダイアフラム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018154479A JP2020030066A (ja) 2018-08-21 2018-08-21 圧力センサ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022194073A Division JP7417698B2 (ja) 2018-08-21 2022-12-05 圧力センサ用ダイアフラムの撓みを抑制する方法および圧力センサ用ダイアフラム

Publications (1)

Publication Number Publication Date
JP2020030066A true JP2020030066A (ja) 2020-02-27

Family

ID=69594664

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018154479A Pending JP2020030066A (ja) 2018-08-21 2018-08-21 圧力センサ
JP2022194073A Active JP7417698B2 (ja) 2018-08-21 2022-12-05 圧力センサ用ダイアフラムの撓みを抑制する方法および圧力センサ用ダイアフラム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022194073A Active JP7417698B2 (ja) 2018-08-21 2022-12-05 圧力センサ用ダイアフラムの撓みを抑制する方法および圧力センサ用ダイアフラム

Country Status (3)

Country Link
JP (2) JP2020030066A (zh)
KR (1) KR102233599B1 (zh)
CN (1) CN110849530B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113280969A (zh) * 2020-02-19 2021-08-20 阿自倍尔株式会社 压力传感器

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114641883B (zh) 2020-02-21 2024-05-28 株式会社Lg新能源 锂二次电池用非水性电解液和包含它的锂二次电池

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002323395A (ja) * 2001-04-27 2002-11-08 Yazaki Corp 静電容量型センサ
JP2007132697A (ja) * 2005-11-08 2007-05-31 Denso Corp 圧力センサ
JP2008107214A (ja) * 2006-10-26 2008-05-08 Yamatake Corp 静電容量型圧力センサ
JP2009524024A (ja) * 2006-01-18 2009-06-25 インフィコン ゲゼルシャフト ミット ベシュレンクテル ハフツング ダイヤフラムを備える真空測定セル
JP2016118494A (ja) * 2014-12-22 2016-06-30 株式会社デンソー 圧力センサ及びその製造方法
JP2016180651A (ja) * 2015-03-24 2016-10-13 アズビル株式会社 堆積物状態推定装置、堆積物状態推定方法および堆積物状態推定システム
US20180024021A1 (en) * 2015-02-12 2018-01-25 Honeywell International Inc. Micro mechanical devices with an improved recess or cavity structure

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5520054A (en) * 1994-03-29 1996-05-28 Rosemount Inc. Increased wall thickness for robust bond for micromachined sensor
US5507090A (en) * 1994-07-20 1996-04-16 Thiokol Corporation Method for making stress sensors
US6443015B1 (en) 1999-09-10 2002-09-03 Mks Instruments, Inc. Baffle for a capacitive pressure sensor
US6965189B2 (en) * 2002-09-20 2005-11-15 Monodrive Inc. Bending actuators and sensors constructed from shaped active materials and methods for making the same
US20100233029A1 (en) * 2006-09-12 2010-09-16 The Regents Of The University Of California Compensated membrane capacitive bio-chemical sensor
JP2009265041A (ja) 2008-04-28 2009-11-12 Yamatake Corp 静電容量型圧力センサ
JP5336242B2 (ja) 2009-03-30 2013-11-06 アズビル株式会社 静電容量型圧力センサ
KR101257608B1 (ko) * 2009-03-30 2013-04-29 아즈빌주식회사 정전 용량형 압력 센서
JP6002016B2 (ja) 2012-11-30 2016-10-05 アズビル株式会社 静電容量型圧力センサ
JP2014126504A (ja) 2012-12-27 2014-07-07 Azbil Corp 静電容量型圧力センサ
US10107315B2 (en) 2013-04-30 2018-10-23 Mks Instruments, Inc. MEMS pressure sensors with integrated baffles
JP6147110B2 (ja) * 2013-06-20 2017-06-14 日立オートモティブシステムズ株式会社 圧力検出装置
JP6231812B2 (ja) 2013-08-09 2017-11-15 アズビル株式会社 静電容量型圧力センサ
CN106017747A (zh) * 2015-03-25 2016-10-12 松下知识产权经营株式会社 感压传感器
JP2017134014A (ja) * 2016-01-29 2017-08-03 株式会社鷺宮製作所 圧力センサ

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002323395A (ja) * 2001-04-27 2002-11-08 Yazaki Corp 静電容量型センサ
JP2007132697A (ja) * 2005-11-08 2007-05-31 Denso Corp 圧力センサ
JP2009524024A (ja) * 2006-01-18 2009-06-25 インフィコン ゲゼルシャフト ミット ベシュレンクテル ハフツング ダイヤフラムを備える真空測定セル
JP2008107214A (ja) * 2006-10-26 2008-05-08 Yamatake Corp 静電容量型圧力センサ
JP2016118494A (ja) * 2014-12-22 2016-06-30 株式会社デンソー 圧力センサ及びその製造方法
US20180024021A1 (en) * 2015-02-12 2018-01-25 Honeywell International Inc. Micro mechanical devices with an improved recess or cavity structure
JP2016180651A (ja) * 2015-03-24 2016-10-13 アズビル株式会社 堆積物状態推定装置、堆積物状態推定方法および堆積物状態推定システム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113280969A (zh) * 2020-02-19 2021-08-20 阿自倍尔株式会社 压力传感器
US11573142B2 (en) * 2020-02-19 2023-02-07 Azbil Corporation Capacitive diaphragm vacuum gauge including a pressure sensor with multiple recesses being formed in the diaphragm
CN113280969B (zh) * 2020-02-19 2023-11-14 阿自倍尔株式会社 压力传感器

Also Published As

Publication number Publication date
KR102233599B1 (ko) 2021-03-30
KR20200021885A (ko) 2020-03-02
JP2023014372A (ja) 2023-01-26
CN110849530B (zh) 2022-01-25
JP7417698B2 (ja) 2024-01-18
CN110849530A (zh) 2020-02-28

Similar Documents

Publication Publication Date Title
JP7417698B2 (ja) 圧力センサ用ダイアフラムの撓みを抑制する方法および圧力センサ用ダイアフラム
US7502482B2 (en) Membrane and method for the production of the same
KR102432312B1 (ko) Mems 마이크로폰
US20170311089A1 (en) Mems microphone and method of manufacturing the same
US10158949B2 (en) MEMS microphone and method of manufacturing the same
JP5029147B2 (ja) 音響センサ
EP2658288B1 (en) Acoustic transducers with perforated membranes
JP7444628B2 (ja) 圧力センサ
JP4993345B2 (ja) 静電容量型圧力センサ
KR20200110627A (ko) Mems 디바이스 및 그 제조 방법
US11115756B2 (en) MEMS microphone and method of manufacturing the same
TW201805230A (zh) 用於壓力感測器裝置的微機械構件
US11259105B2 (en) MEMS microphone and method of manufacturing the same
JP2019075738A (ja) トランスデューサ
US11337005B2 (en) MEMS capacitive microphone
CN113316052B (zh) 一种具有防尘结构的mems麦克风芯片及其制作方法
KR20200105347A (ko) 백 플레이트 및 이를 갖는 멤스 마이크로폰
JP5267697B2 (ja) 音響センサ
CN114071345A (zh) 微机电系统麦克风及其制造方法
CN113347540A (zh) 一种膜片、mems麦克风芯片及其制作方法
JP6515477B2 (ja) 力学量センサおよび力学量測定装置
US11169035B2 (en) Pressure sensor
JP2017181435A (ja) 応力センサ
EP4296221A1 (en) Semiconductor device
JP6773437B2 (ja) 応力センサ

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210728

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220520

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220607

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220802

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20220906