JP2020007575A5 - - Google Patents

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Publication number
JP2020007575A5
JP2020007575A5 JP2018126321A JP2018126321A JP2020007575A5 JP 2020007575 A5 JP2020007575 A5 JP 2020007575A5 JP 2018126321 A JP2018126321 A JP 2018126321A JP 2018126321 A JP2018126321 A JP 2018126321A JP 2020007575 A5 JP2020007575 A5 JP 2020007575A5
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JP
Japan
Prior art keywords
axis
base material
film forming
cathode
forming apparatus
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Application number
JP2018126321A
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English (en)
Japanese (ja)
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JP2020007575A (ja
JP7171270B2 (ja
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Priority to JP2018126321A priority Critical patent/JP7171270B2/ja
Priority claimed from JP2018126321A external-priority patent/JP7171270B2/ja
Priority to US16/453,730 priority patent/US11414746B2/en
Priority to CN201910599227.5A priority patent/CN110735122B/zh
Publication of JP2020007575A publication Critical patent/JP2020007575A/ja
Publication of JP2020007575A5 publication Critical patent/JP2020007575A5/ja
Application granted granted Critical
Publication of JP7171270B2 publication Critical patent/JP7171270B2/ja
Active legal-status Critical Current
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JP2018126321A 2018-07-02 2018-07-02 成膜装置およびそれを用いた成膜方法 Active JP7171270B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018126321A JP7171270B2 (ja) 2018-07-02 2018-07-02 成膜装置およびそれを用いた成膜方法
US16/453,730 US11414746B2 (en) 2018-07-02 2019-06-26 Film forming apparatus and film forming method using the same
CN201910599227.5A CN110735122B (zh) 2018-07-02 2019-07-02 成膜设备和使用该成膜设备的成膜方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018126321A JP7171270B2 (ja) 2018-07-02 2018-07-02 成膜装置およびそれを用いた成膜方法

Publications (3)

Publication Number Publication Date
JP2020007575A JP2020007575A (ja) 2020-01-16
JP2020007575A5 true JP2020007575A5 (https=) 2021-08-05
JP7171270B2 JP7171270B2 (ja) 2022-11-15

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ID=69007942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018126321A Active JP7171270B2 (ja) 2018-07-02 2018-07-02 成膜装置およびそれを用いた成膜方法

Country Status (3)

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US (1) US11414746B2 (https=)
JP (1) JP7171270B2 (https=)
CN (1) CN110735122B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020112986A1 (de) 2020-05-13 2021-11-18 VON ARDENNE Asset GmbH & Co. KG Magnetronanordnung
WO2022069050A1 (en) * 2020-10-01 2022-04-07 Applied Materials, Inc. Method of depositing a material on a substrate
CN116057199B (zh) * 2020-10-08 2024-09-03 株式会社爱发科 旋转式阴极单元用的驱动块
CN112251727B (zh) * 2020-10-22 2022-08-26 凯盛信息显示材料(黄山)有限公司 磁控溅射镀膜设备及ito玻璃的制备方法
JP2023156155A (ja) * 2022-04-12 2023-10-24 株式会社アルバック 真空処理装置及び真空処理方法
EP4270444A1 (en) * 2022-04-27 2023-11-01 Bühler Alzenau GmbH Magnetron sputtering system with tubular sputter cathode and method for controlling a layer thickness

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5108574A (en) * 1991-01-29 1992-04-28 The Boc Group, Inc. Cylindrical magnetron shield structure
JPH0835064A (ja) * 1994-07-20 1996-02-06 Matsushita Electric Ind Co Ltd スパッタリング装置
JP2002220664A (ja) 2000-11-24 2002-08-09 Murata Mfg Co Ltd スパッタ粒子の放出角度分布計測方法、膜厚分布シミュレーション方法及びスパッタ装置
DE10145201C1 (de) 2001-09-13 2002-11-21 Fraunhofer Ges Forschung Einrichtung zum Beschichten von Substraten mit gekrümmter Oberfläche durch Pulsmagnetron-Zerstäuben
CN2656432Y (zh) 2003-09-11 2004-11-17 深圳豪威真空光电子股份有限公司 旋转式磁控溅射靶
JP2005133110A (ja) 2003-10-28 2005-05-26 Konica Minolta Opto Inc スパッタリング装置
EP1594153B1 (de) * 2004-05-05 2010-02-24 Applied Materials GmbH & Co. KG Beschichtungsvorrichtung mit grossflächiger Anordnung von drehbaren Magnetronkathoden
US9175383B2 (en) * 2008-01-16 2015-11-03 Applied Materials, Inc. Double-coating device with one process chamber
US8057649B2 (en) 2008-05-06 2011-11-15 Applied Materials, Inc. Microwave rotatable sputtering deposition
EP2427586B1 (en) 2009-05-07 2020-11-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for the production of oxide and nitride coatings and its use
JP2015524022A (ja) 2012-05-29 2015-08-20 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板をコーティングするための方法とコーター
JPWO2013179544A1 (ja) * 2012-05-31 2016-01-18 東京エレクトロン株式会社 マグネトロンスパッタ装置
JP5921351B2 (ja) 2012-06-14 2016-05-24 キヤノン株式会社 成膜装置
KR102364799B1 (ko) 2015-02-24 2022-02-18 가부시키가이샤 알박 마그네트론 스퍼터링 장치용 회전식 캐소드 유닛
CN104878356B (zh) 2015-06-08 2017-11-24 光驰科技(上海)有限公司 一种磁控溅射靶材磁铁放置角度的确定方法
WO2016202468A1 (de) 2015-06-16 2016-12-22 Schneider Gmbh & Co. Kg Vorrichtung, verfahren und verwendung zur beschichtung von linsen
KR20180137536A (ko) 2016-04-21 2018-12-27 어플라이드 머티어리얼스, 인코포레이티드 기판을 코팅하기 위한 방법들 및 코터

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