JP2019537240A5 - - Google Patents

Download PDF

Info

Publication number
JP2019537240A5
JP2019537240A5 JP2019513313A JP2019513313A JP2019537240A5 JP 2019537240 A5 JP2019537240 A5 JP 2019537240A5 JP 2019513313 A JP2019513313 A JP 2019513313A JP 2019513313 A JP2019513313 A JP 2019513313A JP 2019537240 A5 JP2019537240 A5 JP 2019537240A5
Authority
JP
Japan
Prior art keywords
plasma reactor
state value
processing state
adjustment
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019513313A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019537240A (ja
JP7045368B2 (ja
Filing date
Publication date
Priority claimed from US15/268,472 external-priority patent/US9972478B2/en
Application filed filed Critical
Publication of JP2019537240A publication Critical patent/JP2019537240A/ja
Publication of JP2019537240A5 publication Critical patent/JP2019537240A5/ja
Application granted granted Critical
Publication of JP7045368B2 publication Critical patent/JP7045368B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2019513313A 2016-09-16 2017-08-28 複雑な多変量ウエハ処理機器における機械学習を実行する方法及びプロセス Active JP7045368B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/268,472 2016-09-16
US15/268,472 US9972478B2 (en) 2016-09-16 2016-09-16 Method and process of implementing machine learning in complex multivariate wafer processing equipment
PCT/US2017/048965 WO2018052698A1 (en) 2016-09-16 2017-08-28 Method and process of implementing machine learning in complex multivariate wafer processing equipment

Publications (3)

Publication Number Publication Date
JP2019537240A JP2019537240A (ja) 2019-12-19
JP2019537240A5 true JP2019537240A5 (enExample) 2020-10-22
JP7045368B2 JP7045368B2 (ja) 2022-03-31

Family

ID=61620100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019513313A Active JP7045368B2 (ja) 2016-09-16 2017-08-28 複雑な多変量ウエハ処理機器における機械学習を実行する方法及びプロセス

Country Status (7)

Country Link
US (2) US9972478B2 (enExample)
EP (1) EP3512977B1 (enExample)
JP (1) JP7045368B2 (enExample)
KR (1) KR102467120B1 (enExample)
CN (1) CN109715848B (enExample)
TW (1) TWI772325B (enExample)
WO (1) WO2018052698A1 (enExample)

Families Citing this family (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2484262B (en) 2010-09-29 2013-08-21 Tristel Plc Hand sanitizer
KR20190038070A (ko) * 2017-09-29 2019-04-08 삼성전자주식회사 반도체 장치의 제조 시스템 및 반도체 장치의 제조 방법
DE102017130551A1 (de) * 2017-12-19 2019-06-19 Aixtron Se Vorrichtung und Verfahren zur Gewinnnung von Informationen über in einem CVD-Verfahren abgeschiedener Schichten
US20210073610A1 (en) * 2017-12-27 2021-03-11 Semiconductor Energy Laboratory Co., Ltd. Thin film manufacturing apparatus and thin film manufacturing apparatus using neural network
US11029359B2 (en) * 2018-03-09 2021-06-08 Pdf Solutions, Inc. Failure detection and classsification using sensor data and/or measurement data
US10795346B2 (en) 2018-03-13 2020-10-06 Applied Materials, Inc. Machine learning systems for monitoring of semiconductor processing
JP7090243B2 (ja) 2018-05-08 2022-06-24 千代田化工建設株式会社 プラント運転条件設定支援システム、学習装置、及び運転条件設定支援装置
US10896833B2 (en) * 2018-05-09 2021-01-19 Applied Materials, Inc. Methods and apparatus for detecting an endpoint of a seasoning process
US10916411B2 (en) 2018-08-13 2021-02-09 Tokyo Electron Limited Sensor-to-sensor matching methods for chamber matching
JP7113507B2 (ja) * 2018-09-29 2022-08-05 株式会社フジキン 活性ガス供給システムとそれを用いた半導体製造装置
US10930531B2 (en) 2018-10-09 2021-02-23 Applied Materials, Inc. Adaptive control of wafer-to-wafer variability in device performance in advanced semiconductor processes
US10705514B2 (en) * 2018-10-09 2020-07-07 Applied Materials, Inc. Adaptive chamber matching in advanced semiconductor process control
US10657214B2 (en) 2018-10-09 2020-05-19 Applied Materials, Inc. Predictive spatial digital design of experiment for advanced semiconductor process optimization and control
KR102833948B1 (ko) 2018-11-22 2025-07-15 삼성전자주식회사 기판 처리 장치, 기판 처리 방법 및 이를 이용한 반도체 소자의 제조 방법
US11133204B2 (en) * 2019-01-29 2021-09-28 Applied Materials, Inc. Chamber matching with neural networks in semiconductor equipment tools
EP3796369B1 (en) * 2019-02-12 2024-03-27 SPP Technologies Co., Ltd. Method for detecting abnormal lifting and lowering of substrate
CN113454767B (zh) 2019-02-14 2025-03-07 朗姆研究公司 用于支持衬底制造系统的数据分析和机器学习的数据捕获与转换
US20200266037A1 (en) * 2019-02-14 2020-08-20 Advanced Energy Industries, Inc. Maintenance for remote plasma sources
CN119623613A (zh) * 2019-03-15 2025-03-14 3M创新有限公司 使用因果模型抛光半导体晶圆
DE102019107295A1 (de) * 2019-03-21 2020-09-24 Aixtron Se Verfahren zur Erfassung eines Zustandes eines CVD-Reaktors unter Produktionsbedingungen
TWI838493B (zh) * 2019-03-25 2024-04-11 日商亞多納富有限公司 氣體分析裝置
JP6737944B1 (ja) * 2019-07-16 2020-08-12 株式会社神戸製鋼所 機械学習方法、機械学習装置、機械学習プログラム、通信方法、及び成膜装置
US11966203B2 (en) 2019-08-21 2024-04-23 Kla Corporation System and method to adjust a kinetics model of surface reactions during plasma processing
US12424470B2 (en) 2019-09-25 2025-09-23 Lam Research Corporation Systems and methods for autonomous process control and optimization of semiconductor equipment using light interferometry and reflectometry
JP7442305B2 (ja) * 2019-11-26 2024-03-04 東京エレクトロン株式会社 制御システム、制御方法、制御プログラム、および処理システム
JP7636418B2 (ja) * 2020-01-27 2025-02-26 ラム リサーチ コーポレーション 半導体製造プロセスのための性能予測子
US11708635B2 (en) 2020-06-12 2023-07-25 Applied Materials, Inc. Processing chamber condition and process state monitoring using optical reflector attached to processing chamber liner
US12009191B2 (en) 2020-06-12 2024-06-11 Applied Materials, Inc. Thin film, in-situ measurement through transparent crystal and transparent substrate within processing chamber wall
US11776900B2 (en) 2020-06-22 2023-10-03 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device with contact structure
CN111882030B (zh) * 2020-06-29 2023-12-05 武汉钢铁有限公司 一种基于深度强化学习的加锭策略方法
US11749543B2 (en) * 2020-07-06 2023-09-05 Applied Materials, Inc. Chamber matching and calibration
GB202010471D0 (en) * 2020-07-08 2020-08-19 Univ Exeter Control of processing equipment
US11791141B2 (en) * 2020-07-29 2023-10-17 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for residual gas analysis
US11586794B2 (en) * 2020-07-30 2023-02-21 Applied Materials, Inc. Semiconductor processing tools with improved performance by use of hybrid learning models
US20220084794A1 (en) * 2020-09-16 2022-03-17 Applied Materials, Inc. Plasma chamber with a multiphase rotating modulated cross-flow
US12112107B2 (en) 2020-09-18 2024-10-08 Tokyo Electron Limited Virtual metrology for wafer result prediction
US11735447B2 (en) 2020-10-20 2023-08-22 Applied Materials, Inc. Enhanced process and hardware architecture to detect and correct realtime product substrates
US12020399B2 (en) 2020-11-16 2024-06-25 Xerox Corporation System and method for multi-object micro-assembly control with the aid of a digital computer
US12237158B2 (en) 2020-11-24 2025-02-25 Applied Materials, Inc. Etch feedback for control of upstream process
US11893327B2 (en) 2020-12-14 2024-02-06 Xerox Corporation System and method for machine-learning enabled micro-assembly control with the aid of a digital computer
US11921488B2 (en) * 2020-12-15 2024-03-05 Xerox Corporation System and method for machine-learning-enabled micro-object density distribution control with the aid of a digital computer
US12250503B2 (en) * 2020-12-24 2025-03-11 Applied Materials Israel Ltd. Prediction of electrical properties of a semiconductor specimen
US11709477B2 (en) 2021-01-06 2023-07-25 Applied Materials, Inc. Autonomous substrate processing system
US11532525B2 (en) 2021-03-03 2022-12-20 Applied Materials, Inc. Controlling concentration profiles for deposited films using machine learning
US20220284342A1 (en) * 2021-03-04 2022-09-08 Applied Materials, Inc. Systems and methods for process chamber health monitoring and diagnostics using virtual model
KR102252144B1 (ko) * 2021-03-31 2021-05-17 (주)알티엠 플라즈마의 동작을 확인하는 전자 장치 및 그 동작 방법
JP7648302B2 (ja) * 2021-04-26 2025-03-18 東京エレクトロン株式会社 情報処理システム、温度制御方法及び熱処理装置
US11586160B2 (en) * 2021-06-28 2023-02-21 Applied Materials, Inc. Reducing substrate surface scratching using machine learning
KR20230008543A (ko) 2021-07-07 2023-01-16 삼성전자주식회사 반도체 공정 모델링 시스템 및 방법
US11669079B2 (en) * 2021-07-12 2023-06-06 Tokyo Electron Limited Tool health monitoring and classifications with virtual metrology and incoming wafer monitoring enhancements
JP7698502B2 (ja) * 2021-07-29 2025-06-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及び基板処理装置
US20230057145A1 (en) * 2021-08-23 2023-02-23 Applied Materials, Inc. Plasma chamber with a multiphase rotating cross-flow with uniformity tuning
US12061458B2 (en) * 2021-08-27 2024-08-13 Applied Materials, Inc. Systems and methods for adaptive troubleshooting of semiconductor manufacturing equipment
US12031910B2 (en) 2021-09-15 2024-07-09 Applied Materials, Inc. Transmission corrected plasma emission using in-situ optical reflectometry
JP7652491B2 (ja) * 2021-10-11 2025-03-27 東京エレクトロン株式会社 基板処理システム、情報処理装置、情報処理方法及び情報処理プログラム
CN114091848B (zh) * 2021-11-04 2025-04-11 北京北方华创微电子装备有限公司 半导体工艺配方自动获取方法、系统及半导体工艺设备
US20230162950A1 (en) * 2021-11-22 2023-05-25 Applied Materials, Inc. Plasma chamber with a multiphase rotating gas cross-flow and peripheral conductance control rings
US12106984B2 (en) 2021-11-23 2024-10-01 Applied Materials, Inc. Accelerating preventative maintenance recovery and recipe optimizing using machine-learning based algorithm
US12400845B2 (en) 2021-11-29 2025-08-26 Applied Materials, Inc. Ion energy control on electrodes in a plasma reactor
KR20230089877A (ko) * 2021-12-14 2023-06-21 삼성전자주식회사 플라즈마 제어 장치 및 플라즈마 처리 시스템
US12147212B2 (en) * 2021-12-21 2024-11-19 Applied Materials, Inc. Diagnostic methods for substrate manufacturing chambers using physics-based models
US20230195061A1 (en) * 2021-12-21 2023-06-22 Applied Materials, Inc. Manufacturing equipment parts quality management system
US20230195060A1 (en) * 2021-12-21 2023-06-22 Applied Materials, Inc. Substrate support characterization to build a digital twin
US20230222264A1 (en) * 2022-01-07 2023-07-13 Applied Materials, Inc. Processing chamber calibration
US12191126B2 (en) 2022-02-15 2025-01-07 Applied Materials, Inc. Process control knob estimation
US12467136B2 (en) 2022-03-16 2025-11-11 Applied Materials, Inc. Process characterization and correction using optical wall process sensor (OWPS)
US12469686B2 (en) * 2022-03-16 2025-11-11 Applied Materials, Inc. Process characterization and correction using optical wall process sensor (OWPS)
US12032355B2 (en) * 2022-03-31 2024-07-09 Tokyo Electron Limited Virtual metrology model based seasoning optimization
KR102852817B1 (ko) * 2022-04-25 2025-08-29 탁준배 서방형 이산화염소 가스 발생 키트 및 방법
US12105504B2 (en) 2022-04-27 2024-10-01 Applied Materials, Inc. Run-to-run control at a manufacturing system using machine learning
USD1031743S1 (en) 2022-05-06 2024-06-18 Applied Materials, Inc. Portion of a display panel with a graphical user interface
US12386342B2 (en) * 2022-05-11 2025-08-12 Applied Materials, Inc. Holistic analysis of multidimensional sensor data for substrate processing equipment
US20250315027A1 (en) * 2022-05-13 2025-10-09 Lam Research Corporation Virtual semiconductor fab environment
KR20250028381A (ko) 2022-07-01 2025-02-28 도쿄엘렉트론가부시키가이샤 기판 처리 장치의 제어 방법 및 기판 처리 시스템
TW202406412A (zh) * 2022-07-15 2024-02-01 日商東京威力科創股份有限公司 電漿處理系統、支援裝置、支援方法及支援程式
KR20250065369A (ko) * 2022-09-08 2025-05-12 램 리써치 코포레이션 반도체 장비의 상태의 멀티-센서 결정
KR20240047842A (ko) * 2022-10-05 2024-04-12 서울대학교산학협력단 기계학습이 적용된 자동화된 박막 증착 시스템 및 박막 증착 방법
US12062584B1 (en) * 2022-10-28 2024-08-13 Kepler Computing Inc. Iterative method of multilayer stack development for device applications
WO2024118385A1 (en) * 2022-11-28 2024-06-06 Applied Materials, Inc. Chamber matching by equipment constant updates
US20240176334A1 (en) * 2022-11-28 2024-05-30 Applied Materials, Inc. Adjusting chamber performance by equipment constant updates
TW202445718A (zh) * 2022-12-30 2024-11-16 美商蘭姆研究公司 自動化配方健康狀態最佳化
US20240339309A1 (en) * 2023-04-10 2024-10-10 Tokyo Electron Limited Advanced OES Characterization
US20250038053A1 (en) * 2023-07-28 2025-01-30 Applied Materials, Inc. Growth chamber smart seasoning
WO2025085206A1 (en) * 2023-10-18 2025-04-24 Lam Research Corporation Correction of deposition process drift
CN120082964B (zh) * 2025-05-06 2025-07-22 哈尔滨工业大学 一种金刚石单晶异质外延生长智能偏压调控方法及其系统

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1186476C (zh) * 1997-09-17 2005-01-26 东京电子株式会社 检测并防止射频等离子体系统中电弧放电的装置和方法
JP4754757B2 (ja) * 2000-03-30 2011-08-24 東京エレクトロン株式会社 基板のプラズマ処理を調節するための方法、プラズマ処理システム、及び、電極組体
US6700090B2 (en) * 2002-04-26 2004-03-02 Hitachi High-Technologies Corporation Plasma processing method and plasma processing apparatus
KR100963519B1 (ko) * 2003-07-11 2010-06-15 주성엔지니어링(주) 높은 플라즈마 균일도를 가지는 유도성 결합 플라즈마발생장치 및 이를 이용한 플라즈마 균일도 제어 방법
US20050220984A1 (en) * 2004-04-02 2005-10-06 Applied Materials Inc., A Delaware Corporation Method and system for control of processing conditions in plasma processing systems
KR100655445B1 (ko) * 2005-10-04 2006-12-08 삼성전자주식회사 플라즈마 처리 장치 및 방법, 그리고 반도체 제조 설비
US8992725B2 (en) 2006-08-28 2015-03-31 Mattson Technology, Inc. Plasma reactor with inductie excitation of plasma and efficient removal of heat from the excitation coil
US8264154B2 (en) * 2008-05-14 2012-09-11 Applied Materials, Inc. Method and apparatus for pulsed plasma processing using a time resolved tuning scheme for RF power delivery
US8103492B2 (en) 2008-09-05 2012-01-24 Tokyo Electron Limited Plasma fluid modeling with transient to stochastic transformation
US9435029B2 (en) * 2010-08-29 2016-09-06 Advanced Energy Industries, Inc. Wafer chucking system for advanced plasma ion energy processing systems
CN102473631B (zh) * 2009-06-30 2014-11-26 朗姆研究公司 用于等离子体处理工具原位工艺监控和控制的方法和装置
US8983631B2 (en) * 2009-06-30 2015-03-17 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US9887071B2 (en) * 2011-12-16 2018-02-06 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-zone EPD detectors
US8932429B2 (en) 2012-02-23 2015-01-13 Lam Research Corporation Electronic knob for tuning radial etch non-uniformity at VHF frequencies
US9230779B2 (en) * 2012-03-19 2016-01-05 Lam Research Corporation Methods and apparatus for correcting for non-uniformity in a plasma processing system
JP6318027B2 (ja) * 2014-06-27 2018-04-25 株式会社日立ハイテクノロジーズ プラズマ処理装置
US20160148850A1 (en) * 2014-11-25 2016-05-26 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes

Similar Documents

Publication Publication Date Title
JP2019537240A5 (enExample)
CN109715848B (zh) 复杂多变量晶片处理设备中实现机器学习的方法和过程
JP6789909B2 (ja) プロセスチャンバに結合された流量コントローラをモニタする方法
KR102649759B1 (ko) 매칭 네트워크들을 사용하여 임피던스 매칭 모델의 특성들을 제공하기 위한 시스템들 및 방법들
TWI506670B (zh) 使用以模型為基礎的控制處理基材的方法及設備
US10832979B2 (en) Feedback control system for iterative etch process
TWI528452B (zh) Plasma processing device and plasma processing method
JP7326344B2 (ja) 空間分解ウエハ温度制御のための仮想センサ
KR20050073414A (ko) 플라즈마 처리 방법 및 플라즈마 처리 장치
KR102762675B1 (ko) 저 전력 전압 모드 동작을 위한 사이클 평균된 주파수 튜닝
US20240329626A1 (en) Digital simulation for semiconductor manufacturing processes
TW201344784A (zh) 腔室的壓力控制方法
TWI856123B (zh) 性能計算方法及處理裝置
US10424466B2 (en) Method for inspecting shower plate of plasma processing apparatus
Koo et al. Design of a self-tuning adaptive model predictive controller using recursive model parameter estimation for real-time plasma variable control
US20180061721A1 (en) Self-healing semiconductor wafer processing
US9666417B2 (en) Plasma processing apparatus and method for monitoring plasma processing apparatus
JP2004207703A5 (enExample)
KR20170076631A (ko) 플라즈마 처리 장치
Lynn et al. Real-time virtual metrology and control of etch rate in an industrial plasma chamber
JP2013219401A (ja) プラズマ処理方法のＲｕｎ−ｔｏ−Ｒｕｎ制御方法
KR20250172790A (ko) 매칭 네트워크들을 사용하여 임피던스 매칭 모델의 특성들을 제공하기 위한 시스템들 및 방법들
CN121195213A (zh) 过程控制中改进的逐批控制器