JP2019529890A5 - - Google Patents

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Publication number
JP2019529890A5
JP2019529890A5 JP2019512682A JP2019512682A JP2019529890A5 JP 2019529890 A5 JP2019529890 A5 JP 2019529890A5 JP 2019512682 A JP2019512682 A JP 2019512682A JP 2019512682 A JP2019512682 A JP 2019512682A JP 2019529890 A5 JP2019529890 A5 JP 2019529890A5
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JP
Japan
Prior art keywords
die
power
region
estimating
estimated power
Prior art date
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Pending
Application number
JP2019512682A
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English (en)
Japanese (ja)
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JP2019529890A (ja
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Publication date
Priority claimed from US15/260,194 external-priority patent/US10309838B2/en
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Publication of JP2019529890A publication Critical patent/JP2019529890A/ja
Publication of JP2019529890A5 publication Critical patent/JP2019529890A5/ja
Pending legal-status Critical Current

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JP2019512682A 2016-09-08 2017-08-15 経時的温度センサ位置オフセット誤り訂正 Pending JP2019529890A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/260,194 2016-09-08
US15/260,194 US10309838B2 (en) 2016-09-08 2016-09-08 Temporal temperature sensor position offset error correction
PCT/US2017/046967 WO2018048587A1 (en) 2016-09-08 2017-08-15 Temporal temperature sensor position offset error correction

Publications (2)

Publication Number Publication Date
JP2019529890A JP2019529890A (ja) 2019-10-17
JP2019529890A5 true JP2019529890A5 (enExample) 2020-09-10

Family

ID=59829445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019512682A Pending JP2019529890A (ja) 2016-09-08 2017-08-15 経時的温度センサ位置オフセット誤り訂正

Country Status (7)

Country Link
US (1) US10309838B2 (enExample)
EP (1) EP3510371B1 (enExample)
JP (1) JP2019529890A (enExample)
KR (1) KR102513948B1 (enExample)
CN (1) CN109642829B (enExample)
BR (1) BR112019003764B1 (enExample)
WO (1) WO2018048587A1 (enExample)

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KR101840852B1 (ko) * 2011-10-10 2018-03-22 삼성전자주식회사 모바일 장치의 표면 온도 관리 방법 및 멀티칩 패키지의 메모리 열관리 방법
CN105912442B (zh) * 2016-04-12 2019-01-04 英业达科技有限公司 具有温度管理功能的电子装置
TWI679399B (zh) * 2018-10-23 2019-12-11 國立高雄科技大學 晶片內建曲率校正架構及其方法
KR102731715B1 (ko) * 2019-09-16 2024-11-18 주식회사 엘엑스세미콘 온도센서를 구비한 소스드라이버 및 표시장치
TWI755090B (zh) * 2019-10-28 2022-02-11 仁寶電腦工業股份有限公司 基於人工智慧的功率配置方法和功率配置裝置
US11762439B2 (en) 2019-12-17 2023-09-19 Mediatek Inc. Method and apparatus of dynamic thermal management based on surface temperatures of portable device
US11520369B2 (en) * 2020-02-04 2022-12-06 Qualcomm Incorporated Clock instantaneous temperature-rate-of-change measurement
CN111442855A (zh) * 2020-04-07 2020-07-24 珠海格力电器股份有限公司 一种温度检测装置、功率模块及其温度检测方法
CN111595488B (zh) * 2020-04-15 2022-05-24 岭东核电有限公司 核电站柴油机油温检测方法、装置、终端设备及存储介质
EP3910306B1 (en) * 2020-05-13 2023-08-09 Schneider Electric Industries SAS Electrical apparatus thermal monitoring
US11231760B1 (en) * 2020-07-21 2022-01-25 Nvidia Corporation Techniques for accurately determining the temperature at various locations of an operating integrated circuit
US11798501B2 (en) * 2020-08-25 2023-10-24 Google Llc Power monitoring for correcting ambient temperature measurement by electronic devices
KR102891516B1 (ko) 2020-11-02 2025-11-25 삼성전자 주식회사 전력 측정에 기초한 온도 검출 및 열 관리를 위한 방법 및 장치
US12061123B2 (en) * 2021-11-19 2024-08-13 Renesas Electronics Corporation Semiconductor device and trimming method of the same
CN114154334B (zh) * 2021-12-06 2024-08-23 中国电子科技集团公司第十三研究所 芯片级热特性分析方法、装置及终端设备
US20220114318A1 (en) * 2021-12-20 2022-04-14 Intel Corporation Methods and apparatus for in-field thermal calibration
US20250164318A1 (en) * 2023-11-21 2025-05-22 Qualcomm Incorporated Frequency error correction based on identifying the worst thermal aggressor of multiple thermal aggressors
CN118654719B (zh) * 2024-08-19 2024-11-12 陕西森旺信息技术有限公司 基于传感器的电伴热带状态实时监测方法

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US7149645B2 (en) 2004-12-30 2006-12-12 Intel Corporation Method and apparatus for accurate on-die temperature measurement
US7180380B2 (en) 2005-04-20 2007-02-20 Advanced Micro Devices, Inc. Zoned thermal monitoring
US7757103B2 (en) * 2006-12-20 2010-07-13 Intel Corporation Method and apparatus to estimate energy consumed by central processing unit core
US7642809B2 (en) * 2007-02-06 2010-01-05 Rapid Bridge Llc Die apparatus having configurable input/output and control method thereof
US7877222B2 (en) 2007-07-20 2011-01-25 International Business Machines Corporation Structure for a phase locked loop with adjustable voltage based on temperature
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JP5443946B2 (ja) 2009-11-02 2014-03-19 株式会社東芝 インバータ装置
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KR101885857B1 (ko) 2012-01-04 2018-08-06 삼성전자주식회사 온도 관리 회로, 이를 포함하는 시스템 온 칩 및 온도 관리 방법
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