KR102513948B1 - 시간적 온도 센서 포지션 오프셋 에러 보정 - Google Patents

시간적 온도 센서 포지션 오프셋 에러 보정 Download PDF

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KR102513948B1
KR102513948B1 KR1020197006543A KR20197006543A KR102513948B1 KR 102513948 B1 KR102513948 B1 KR 102513948B1 KR 1020197006543 A KR1020197006543 A KR 1020197006543A KR 20197006543 A KR20197006543 A KR 20197006543A KR 102513948 B1 KR102513948 B1 KR 102513948B1
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die
temperature
power
zone
sensor measurements
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KR20190043550A (ko
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알리 아크바르 메리크
마틴 세인트-로렌트
모하마드 가세마자르
라지트 찬드라
모하메드 알람
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퀄컴 인코포레이티드
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/20—Compensating for effects of temperature changes other than those to be measured, e.g. changes in ambient temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K15/00—Testing or calibrating of thermometers
    • G01K15/005—Calibration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
    • G01K7/427—Temperature calculation based on spatial modeling, e.g. spatial inter- or extrapolation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Sources (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
KR1020197006543A 2016-09-08 2017-08-15 시간적 온도 센서 포지션 오프셋 에러 보정 Active KR102513948B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/260,194 US10309838B2 (en) 2016-09-08 2016-09-08 Temporal temperature sensor position offset error correction
US15/260,194 2016-09-08
PCT/US2017/046967 WO2018048587A1 (en) 2016-09-08 2017-08-15 Temporal temperature sensor position offset error correction

Publications (2)

Publication Number Publication Date
KR20190043550A KR20190043550A (ko) 2019-04-26
KR102513948B1 true KR102513948B1 (ko) 2023-03-23

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KR1020197006543A Active KR102513948B1 (ko) 2016-09-08 2017-08-15 시간적 온도 센서 포지션 오프셋 에러 보정

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Country Link
US (1) US10309838B2 (enExample)
EP (1) EP3510371B1 (enExample)
JP (1) JP2019529890A (enExample)
KR (1) KR102513948B1 (enExample)
CN (1) CN109642829B (enExample)
BR (1) BR112019003764B1 (enExample)
WO (1) WO2018048587A1 (enExample)

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KR101840852B1 (ko) * 2011-10-10 2018-03-22 삼성전자주식회사 모바일 장치의 표면 온도 관리 방법 및 멀티칩 패키지의 메모리 열관리 방법
CN105912442B (zh) * 2016-04-12 2019-01-04 英业达科技有限公司 具有温度管理功能的电子装置
TWI679399B (zh) * 2018-10-23 2019-12-11 國立高雄科技大學 晶片內建曲率校正架構及其方法
KR102731715B1 (ko) * 2019-09-16 2024-11-18 주식회사 엘엑스세미콘 온도센서를 구비한 소스드라이버 및 표시장치
TWI755090B (zh) * 2019-10-28 2022-02-11 仁寶電腦工業股份有限公司 基於人工智慧的功率配置方法和功率配置裝置
US11762439B2 (en) * 2019-12-17 2023-09-19 Mediatek Inc. Method and apparatus of dynamic thermal management based on surface temperatures of portable device
US11520369B2 (en) * 2020-02-04 2022-12-06 Qualcomm Incorporated Clock instantaneous temperature-rate-of-change measurement
CN111442855A (zh) * 2020-04-07 2020-07-24 珠海格力电器股份有限公司 一种温度检测装置、功率模块及其温度检测方法
CN111595488B (zh) * 2020-04-15 2022-05-24 岭东核电有限公司 核电站柴油机油温检测方法、装置、终端设备及存储介质
ES2963370T3 (es) * 2020-05-13 2024-03-26 Schneider Electric Ind Sas Monitorización térmica de aparatos eléctricos
US11231760B1 (en) * 2020-07-21 2022-01-25 Nvidia Corporation Techniques for accurately determining the temperature at various locations of an operating integrated circuit
US11798501B2 (en) * 2020-08-25 2023-10-24 Google Llc Power monitoring for correcting ambient temperature measurement by electronic devices
KR102891516B1 (ko) 2020-11-02 2025-11-25 삼성전자 주식회사 전력 측정에 기초한 온도 검출 및 열 관리를 위한 방법 및 장치
US12061123B2 (en) * 2021-11-19 2024-08-13 Renesas Electronics Corporation Semiconductor device and trimming method of the same
CN114154334B (zh) * 2021-12-06 2024-08-23 中国电子科技集团公司第十三研究所 芯片级热特性分析方法、装置及终端设备
US20220114318A1 (en) * 2021-12-20 2022-04-14 Intel Corporation Methods and apparatus for in-field thermal calibration
US20250164318A1 (en) * 2023-11-21 2025-05-22 Qualcomm Incorporated Frequency error correction based on identifying the worst thermal aggressor of multiple thermal aggressors
CN118654719B (zh) * 2024-08-19 2024-11-12 陕西森旺信息技术有限公司 基于传感器的电伴热带状态实时监测方法

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KR101885857B1 (ko) 2012-01-04 2018-08-06 삼성전자주식회사 온도 관리 회로, 이를 포함하는 시스템 온 칩 및 온도 관리 방법
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Also Published As

Publication number Publication date
EP3510371A1 (en) 2019-07-17
US20180066998A1 (en) 2018-03-08
US10309838B2 (en) 2019-06-04
EP3510371B1 (en) 2021-07-14
CN109642829B (zh) 2020-12-08
JP2019529890A (ja) 2019-10-17
BR112019003764A2 (pt) 2019-05-21
BR112019003764B1 (pt) 2022-11-29
WO2018048587A1 (en) 2018-03-15
CN109642829A (zh) 2019-04-16
KR20190043550A (ko) 2019-04-26

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