BR112019003764B1 - Método e aparelho de correção de erro de deslocamento de posição de sensor e memória legível por computador - Google Patents

Método e aparelho de correção de erro de deslocamento de posição de sensor e memória legível por computador Download PDF

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Publication number
BR112019003764B1
BR112019003764B1 BR112019003764-0A BR112019003764A BR112019003764B1 BR 112019003764 B1 BR112019003764 B1 BR 112019003764B1 BR 112019003764 A BR112019003764 A BR 112019003764A BR 112019003764 B1 BR112019003764 B1 BR 112019003764B1
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BR
Brazil
Prior art keywords
temperature
power
region
soc
temperature measurement
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BR112019003764-0A
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English (en)
Portuguese (pt)
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BR112019003764A2 (pt
Inventor
Ali Akbar Merrikh
Martin Saint-Laurent
Mohammad GHASEMAZAR
Rajit Chandra
Mohamed Allam
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Qualcomm Incorporated
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Application filed by Qualcomm Incorporated filed Critical Qualcomm Incorporated
Publication of BR112019003764A2 publication Critical patent/BR112019003764A2/pt
Publication of BR112019003764B1 publication Critical patent/BR112019003764B1/pt

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/20—Compensating for effects of temperature changes other than those to be measured, e.g. changes in ambient temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K15/00—Testing or calibrating of thermometers
    • G01K15/005—Calibration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
    • G01K7/427—Temperature calculation based on spatial modeling, e.g. spatial inter- or extrapolation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Sources (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
BR112019003764-0A 2016-09-08 2017-08-15 Método e aparelho de correção de erro de deslocamento de posição de sensor e memória legível por computador BR112019003764B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/260,194 US10309838B2 (en) 2016-09-08 2016-09-08 Temporal temperature sensor position offset error correction
US15/260,194 2016-09-08
PCT/US2017/046967 WO2018048587A1 (en) 2016-09-08 2017-08-15 Temporal temperature sensor position offset error correction

Publications (2)

Publication Number Publication Date
BR112019003764A2 BR112019003764A2 (pt) 2019-05-21
BR112019003764B1 true BR112019003764B1 (pt) 2022-11-29

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Application Number Title Priority Date Filing Date
BR112019003764-0A BR112019003764B1 (pt) 2016-09-08 2017-08-15 Método e aparelho de correção de erro de deslocamento de posição de sensor e memória legível por computador

Country Status (7)

Country Link
US (1) US10309838B2 (enExample)
EP (1) EP3510371B1 (enExample)
JP (1) JP2019529890A (enExample)
KR (1) KR102513948B1 (enExample)
CN (1) CN109642829B (enExample)
BR (1) BR112019003764B1 (enExample)
WO (1) WO2018048587A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101840852B1 (ko) * 2011-10-10 2018-03-22 삼성전자주식회사 모바일 장치의 표면 온도 관리 방법 및 멀티칩 패키지의 메모리 열관리 방법
CN105912442B (zh) * 2016-04-12 2019-01-04 英业达科技有限公司 具有温度管理功能的电子装置
TWI679399B (zh) * 2018-10-23 2019-12-11 國立高雄科技大學 晶片內建曲率校正架構及其方法
KR102731715B1 (ko) * 2019-09-16 2024-11-18 주식회사 엘엑스세미콘 온도센서를 구비한 소스드라이버 및 표시장치
TWI755090B (zh) * 2019-10-28 2022-02-11 仁寶電腦工業股份有限公司 基於人工智慧的功率配置方法和功率配置裝置
US11762439B2 (en) * 2019-12-17 2023-09-19 Mediatek Inc. Method and apparatus of dynamic thermal management based on surface temperatures of portable device
US11520369B2 (en) * 2020-02-04 2022-12-06 Qualcomm Incorporated Clock instantaneous temperature-rate-of-change measurement
CN111442855A (zh) * 2020-04-07 2020-07-24 珠海格力电器股份有限公司 一种温度检测装置、功率模块及其温度检测方法
CN111595488B (zh) * 2020-04-15 2022-05-24 岭东核电有限公司 核电站柴油机油温检测方法、装置、终端设备及存储介质
ES2963370T3 (es) * 2020-05-13 2024-03-26 Schneider Electric Ind Sas Monitorización térmica de aparatos eléctricos
US11231760B1 (en) * 2020-07-21 2022-01-25 Nvidia Corporation Techniques for accurately determining the temperature at various locations of an operating integrated circuit
US11798501B2 (en) * 2020-08-25 2023-10-24 Google Llc Power monitoring for correcting ambient temperature measurement by electronic devices
KR102891516B1 (ko) 2020-11-02 2025-11-25 삼성전자 주식회사 전력 측정에 기초한 온도 검출 및 열 관리를 위한 방법 및 장치
US12061123B2 (en) * 2021-11-19 2024-08-13 Renesas Electronics Corporation Semiconductor device and trimming method of the same
CN114154334B (zh) * 2021-12-06 2024-08-23 中国电子科技集团公司第十三研究所 芯片级热特性分析方法、装置及终端设备
US20220114318A1 (en) * 2021-12-20 2022-04-14 Intel Corporation Methods and apparatus for in-field thermal calibration
US20250164318A1 (en) * 2023-11-21 2025-05-22 Qualcomm Incorporated Frequency error correction based on identifying the worst thermal aggressor of multiple thermal aggressors
CN118654719B (zh) * 2024-08-19 2024-11-12 陕西森旺信息技术有限公司 基于传感器的电伴热带状态实时监测方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004036464B4 (de) * 2004-07-28 2013-05-08 Infineon Technologies Ag Trägerphasendetektor
US7149645B2 (en) 2004-12-30 2006-12-12 Intel Corporation Method and apparatus for accurate on-die temperature measurement
US7180380B2 (en) 2005-04-20 2007-02-20 Advanced Micro Devices, Inc. Zoned thermal monitoring
US7757103B2 (en) * 2006-12-20 2010-07-13 Intel Corporation Method and apparatus to estimate energy consumed by central processing unit core
US7642809B2 (en) * 2007-02-06 2010-01-05 Rapid Bridge Llc Die apparatus having configurable input/output and control method thereof
US7877222B2 (en) 2007-07-20 2011-01-25 International Business Machines Corporation Structure for a phase locked loop with adjustable voltage based on temperature
WO2010013093A1 (en) * 2008-07-30 2010-02-04 Freescale Semiconductor, Inc. Die temperature estimator
JP5443946B2 (ja) * 2009-11-02 2014-03-19 株式会社東芝 インバータ装置
US8607023B1 (en) 2009-12-16 2013-12-10 Applied Micro Circuits Corporation System-on-chip with dynamic memory module switching
US20110295539A1 (en) * 2010-05-28 2011-12-01 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for measuring intra-die temperature
US8499227B2 (en) * 2010-09-23 2013-07-30 Micron Technology, Inc. Memory quality monitor based compensation method and apparatus
CN103054932B (zh) * 2011-10-24 2018-04-27 中国医学科学院药物研究所 楹树提取物在制备治疗胃溃疡药物中的应用
KR101885857B1 (ko) 2012-01-04 2018-08-06 삼성전자주식회사 온도 관리 회로, 이를 포함하는 시스템 온 칩 및 온도 관리 방법
EP2728327B1 (en) 2012-11-02 2020-02-19 Sensirion AG Portable electronic device
US20150103866A1 (en) * 2013-10-11 2015-04-16 Qualcomm Incorporated DIGITAL TEMPERATURE ESTIMATORS (DTEs) DISPOSED IN INTEGRATED CIRCUITS (ICs) FOR ESTIMATING TEMPERATURE WITHIN THE ICs, AND RELATED SYSTEMS AND METHODS
US9483092B2 (en) 2013-10-14 2016-11-01 Advanced Micro Devices, Inc. Performance state boost for multi-core integrated circuit
US9886326B2 (en) 2014-02-13 2018-02-06 Advanced Micro Devices, Inc. Thermally-aware process scheduling
US9652019B2 (en) * 2014-06-02 2017-05-16 Advanced Micro Devices, Inc. System and method for adjusting processor performance based on platform and ambient thermal conditions
US10187282B2 (en) * 2015-10-01 2019-01-22 Qualcomm Incorporated System and method for modem management based on key performance indicators
US10528098B2 (en) * 2016-06-29 2020-01-07 Western Digital Technologies, Inc. Thermal aware workload scheduling
US10809777B2 (en) * 2017-05-04 2020-10-20 Silicon Laboratories Inc. Energy estimation for thermal management

Also Published As

Publication number Publication date
EP3510371A1 (en) 2019-07-17
US20180066998A1 (en) 2018-03-08
US10309838B2 (en) 2019-06-04
EP3510371B1 (en) 2021-07-14
CN109642829B (zh) 2020-12-08
JP2019529890A (ja) 2019-10-17
BR112019003764A2 (pt) 2019-05-21
WO2018048587A1 (en) 2018-03-15
CN109642829A (zh) 2019-04-16
KR20190043550A (ko) 2019-04-26
KR102513948B1 (ko) 2023-03-23

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B06W Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
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