JP2019529890A - 経時的温度センサ位置オフセット誤り訂正 - Google Patents

経時的温度センサ位置オフセット誤り訂正 Download PDF

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Publication number
JP2019529890A
JP2019529890A JP2019512682A JP2019512682A JP2019529890A JP 2019529890 A JP2019529890 A JP 2019529890A JP 2019512682 A JP2019512682 A JP 2019512682A JP 2019512682 A JP2019512682 A JP 2019512682A JP 2019529890 A JP2019529890 A JP 2019529890A
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Japan
Prior art keywords
temperature
power
activity
soc
processor
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JP2019512682A
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English (en)
Japanese (ja)
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JP2019529890A5 (enExample
Inventor
アリ・アクバル・メリフ
マーティン・サン−ローラン
モハンマド・ガセマザール
ラジット・チャンドラ
モハメド・アラム
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クアルコム，インコーポレイテッド
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Publication of JP2019529890A publication Critical patent/JP2019529890A/ja
Publication of JP2019529890A5 publication Critical patent/JP2019529890A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/20—Compensating for effects of temperature changes other than those to be measured, e.g. changes in ambient temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K15/00—Testing or calibrating of thermometers
    • G01K15/005—Calibration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
    • G01K7/427—Temperature calculation based on spatial modeling, e.g. spatial inter- or extrapolation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Sources (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2019512682A 2016-09-08 2017-08-15 経時的温度センサ位置オフセット誤り訂正 Pending JP2019529890A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/260,194 2016-09-08
US15/260,194 US10309838B2 (en) 2016-09-08 2016-09-08 Temporal temperature sensor position offset error correction
PCT/US2017/046967 WO2018048587A1 (en) 2016-09-08 2017-08-15 Temporal temperature sensor position offset error correction

Publications (2)

Publication Number Publication Date
JP2019529890A true JP2019529890A (ja) 2019-10-17
JP2019529890A5 JP2019529890A5 (enExample) 2020-09-10

Family

ID=59829445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019512682A Pending JP2019529890A (ja) 2016-09-08 2017-08-15 経時的温度センサ位置オフセット誤り訂正

Country Status (7)

Country Link
US (1) US10309838B2 (enExample)
EP (1) EP3510371B1 (enExample)
JP (1) JP2019529890A (enExample)
KR (1) KR102513948B1 (enExample)
CN (1) CN109642829B (enExample)
BR (1) BR112019003764B1 (enExample)
WO (1) WO2018048587A1 (enExample)

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CN105912442B (zh) * 2016-04-12 2019-01-04 英业达科技有限公司 具有温度管理功能的电子装置
TWI679399B (zh) * 2018-10-23 2019-12-11 國立高雄科技大學 晶片內建曲率校正架構及其方法
KR102731715B1 (ko) * 2019-09-16 2024-11-18 주식회사 엘엑스세미콘 온도센서를 구비한 소스드라이버 및 표시장치
TWI755090B (zh) * 2019-10-28 2022-02-11 仁寶電腦工業股份有限公司 基於人工智慧的功率配置方法和功率配置裝置
US11762439B2 (en) 2019-12-17 2023-09-19 Mediatek Inc. Method and apparatus of dynamic thermal management based on surface temperatures of portable device
US11520369B2 (en) * 2020-02-04 2022-12-06 Qualcomm Incorporated Clock instantaneous temperature-rate-of-change measurement
CN111442855A (zh) * 2020-04-07 2020-07-24 珠海格力电器股份有限公司 一种温度检测装置、功率模块及其温度检测方法
CN111595488B (zh) * 2020-04-15 2022-05-24 岭东核电有限公司 核电站柴油机油温检测方法、装置、终端设备及存储介质
EP3910306B1 (en) * 2020-05-13 2023-08-09 Schneider Electric Industries SAS Electrical apparatus thermal monitoring
US11231760B1 (en) * 2020-07-21 2022-01-25 Nvidia Corporation Techniques for accurately determining the temperature at various locations of an operating integrated circuit
US11798501B2 (en) * 2020-08-25 2023-10-24 Google Llc Power monitoring for correcting ambient temperature measurement by electronic devices
KR102891516B1 (ko) 2020-11-02 2025-11-25 삼성전자 주식회사 전력 측정에 기초한 온도 검출 및 열 관리를 위한 방법 및 장치
US12061123B2 (en) * 2021-11-19 2024-08-13 Renesas Electronics Corporation Semiconductor device and trimming method of the same
CN114154334B (zh) * 2021-12-06 2024-08-23 中国电子科技集团公司第十三研究所 芯片级热特性分析方法、装置及终端设备
US20220114318A1 (en) * 2021-12-20 2022-04-14 Intel Corporation Methods and apparatus for in-field thermal calibration
US20250164318A1 (en) * 2023-11-21 2025-05-22 Qualcomm Incorporated Frequency error correction based on identifying the worst thermal aggressor of multiple thermal aggressors
CN118654719B (zh) * 2024-08-19 2024-11-12 陕西森旺信息技术有限公司 基于传感器的电伴热带状态实时监测方法

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JP2011097812A (ja) * 2009-11-02 2011-05-12 Toshiba Corp インバータ装置

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US7757103B2 (en) * 2006-12-20 2010-07-13 Intel Corporation Method and apparatus to estimate energy consumed by central processing unit core
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JP2011097812A (ja) * 2009-11-02 2011-05-12 Toshiba Corp インバータ装置

Also Published As

Publication number Publication date
BR112019003764A2 (pt) 2019-05-21
CN109642829B (zh) 2020-12-08
US20180066998A1 (en) 2018-03-08
EP3510371B1 (en) 2021-07-14
KR102513948B1 (ko) 2023-03-23
EP3510371A1 (en) 2019-07-17
KR20190043550A (ko) 2019-04-26
CN109642829A (zh) 2019-04-16
BR112019003764B1 (pt) 2022-11-29
US10309838B2 (en) 2019-06-04
WO2018048587A1 (en) 2018-03-15

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