JP2019529542A5 - - Google Patents
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- Publication number
- JP2019529542A5 JP2019529542A5 JP2019535225A JP2019535225A JP2019529542A5 JP 2019529542 A5 JP2019529542 A5 JP 2019529542A5 JP 2019535225 A JP2019535225 A JP 2019535225A JP 2019535225 A JP2019535225 A JP 2019535225A JP 2019529542 A5 JP2019529542 A5 JP 2019529542A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- bonded
- sih
- substituents
- vinyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662398174P | 2016-09-22 | 2016-09-22 | |
| US62/398,174 | 2016-09-22 | ||
| PCT/US2017/051710 WO2018057411A1 (en) | 2016-09-22 | 2017-09-15 | SiH-FREE VINYLDISILANES |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019529542A JP2019529542A (ja) | 2019-10-17 |
| JP2019529542A5 true JP2019529542A5 (enExample) | 2020-09-24 |
| JP6994037B2 JP6994037B2 (ja) | 2022-01-14 |
Family
ID=60138914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019535225A Expired - Fee Related JP6994037B2 (ja) | 2016-09-22 | 2017-09-15 | ＳｉＨ非含有ビニルジシラン |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11485642B2 (enExample) |
| EP (1) | EP3515864B1 (enExample) |
| JP (1) | JP6994037B2 (enExample) |
| KR (1) | KR102228807B1 (enExample) |
| CN (1) | CN109689569B (enExample) |
| TW (1) | TWI749067B (enExample) |
| WO (1) | WO2018057411A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114940687A (zh) * | 2022-05-30 | 2022-08-26 | 杭州瀛拓科技有限公司 | 一种多取代乙烯基硅（氧）烷的连续流合成方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60151278A (ja) * | 1984-01-13 | 1985-08-09 | 信越化学工業株式会社 | 窒化けい素の製造方法 |
| JPS61207391A (ja) * | 1985-03-09 | 1986-09-13 | Shin Etsu Chem Co Ltd | トリシリルエタン誘導体化合物の製法 |
| JPS61207390A (ja) * | 1985-03-09 | 1986-09-13 | Shin Etsu Chem Co Ltd | ２−ビニルテトラアルキルジシラニル基含有化合物の再分配反応を起す方法 |
| JPS61207389A (ja) | 1985-03-09 | 1986-09-13 | Shin Etsu Chem Co Ltd | 新規ジシラシクロペンタン化合物の製法 |
| JPH02145590A (ja) * | 1988-11-26 | 1990-06-05 | Shin Etsu Chem Co Ltd | 新規ジシラシクロヘキサン化合物及びその製造方法 |
| US5310583A (en) | 1992-11-02 | 1994-05-10 | Dow Corning Corporation | Vapor phase deposition of hydrogen silsesquioxane resin in the presence of nitrous oxide |
| JP2907061B2 (ja) | 1995-04-05 | 1999-06-21 | 信越化学工業株式会社 | 有機けい素化合物の製造方法 |
| US5606088A (en) * | 1996-03-28 | 1997-02-25 | Dow Corning Corporation | Process for preparation of organodisilanes |
| DE602006019499D1 (de) | 2006-04-03 | 2011-02-17 | Air Liquide | Eine pentakis(dimethylamino)disilanvorstufe enthaltende verbindung, und verfahren zu deren herstellung |
| JP2007191797A (ja) | 2007-03-16 | 2007-08-02 | Semiconductor Energy Lab Co Ltd | 被膜形成装置及び被膜形成方法 |
| US7875532B2 (en) | 2007-06-15 | 2011-01-25 | Semiconductor Energy Laboratory Co., Ltd. | Substrate for manufacturing semiconductor device and manufacturing method thereof |
| CN101602918A (zh) | 2009-07-23 | 2009-12-16 | 河海大学 | 水工结构物脱空填充硅酮胶及其制备方法 |
| JP6007662B2 (ja) | 2011-09-05 | 2016-10-12 | 東ソー株式会社 | 成膜材料、それを用いた封止膜、及びその用途 |
| KR102199525B1 (ko) * | 2014-05-30 | 2021-01-08 | 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스 9 엘엘씨 | 다이아이소프로필아미노-다이실란의 합성 공정 |
-
2017
- 2017-09-15 KR KR1020197009152A patent/KR102228807B1/ko not_active Expired - Fee Related
- 2017-09-15 CN CN201780056462.7A patent/CN109689569B/zh not_active Expired - Fee Related
- 2017-09-15 JP JP2019535225A patent/JP6994037B2/ja not_active Expired - Fee Related
- 2017-09-15 US US16/331,161 patent/US11485642B2/en active Active
- 2017-09-15 WO PCT/US2017/051710 patent/WO2018057411A1/en not_active Ceased
- 2017-09-15 EP EP17787057.3A patent/EP3515864B1/en active Active
- 2017-09-19 TW TW106132149A patent/TWI749067B/zh not_active IP Right Cessation
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