JP2019528486A - レチクル容器及び拡散板 - Google Patents
レチクル容器及び拡散板 Download PDFInfo
- Publication number
- JP2019528486A JP2019528486A JP2019532190A JP2019532190A JP2019528486A JP 2019528486 A JP2019528486 A JP 2019528486A JP 2019532190 A JP2019532190 A JP 2019532190A JP 2019532190 A JP2019532190 A JP 2019532190A JP 2019528486 A JP2019528486 A JP 2019528486A
- Authority
- JP
- Japan
- Prior art keywords
- reticle
- opening
- diffusion plate
- reticle container
- openings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009792 diffusion process Methods 0.000 title claims abstract description 43
- 230000002093 peripheral effect Effects 0.000 claims abstract description 36
- 238000003860 storage Methods 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 29
- 238000010926 purge Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000000746 purification Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 238000010943 off-gassing Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004693 Polybenzimidazole Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920002480 polybenzimidazole Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000012611 container material Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
Abstract
Description
11 保持要素
12 内部
13 挿入物
14 レチクル保管部分
16 入口ポート
17 係止機構
18 出口ポート
19 溝
22 レチクル
24 第1の拡散板
25 開口部
26 第2の拡散板
Claims (13)
- レチクル保管部分(14)内で、少なくとも2枚のレチクル(22)を保管するよう適合された囲われた内部(12)を画定し、浄化ガスを前記囲われた内部(12)に通して入れることができる入口ポート(16)と、前記浄化ガスを前記囲われた内部(12)から通して出すことができる出口ポート(18)とを備える、レチクル容器であって、前記入口ポート(16)と前記レチクル保管部分(14)との間であって、前記囲われた内部(12)に配置された、第1の拡散板(24)を更に備え、前記第1の拡散板(24)には、前記浄化ガスが流れることができる開口部(25a、25b)が設けられ、前記第1の拡散板(24)の中央セクションの開口部(25a)には、前記第1の拡散板(24)の周辺セクションの開口部(25b)よりも、大きい個々の開口面積が提供され、及び/又は、単位面積当たりで大きい合計開口面積を提供するレチクル容器。
- 前記レチクル保管部分(14)と前記出口ポート(18)との間に配置された、第2の拡散板(26)が設けられる請求項1に記載のレチクル容器。
- 前記第2の拡散板(26)に、前記浄化ガスが流れ通ることができる開口部(27a、27b)が設けられ、前記第2の拡散板(26)の中央セクションにおける開口部(27a)に、前記第2の拡散板(26)の周辺セクションの開口部(27b)よりも、大きい個々の開口面積が提供され、及び/又は、単位面積当たりで大きい合計開口面積を提供する請求項2に記載のレチクル容器。
- 前記レチクル保管部分(14)が、少なくとも2枚のレチクルを保管するよう設けられ、それによって各レチクルが、前記第1の拡散板(24)及び/又は前記第2の拡散板(26)に対して実質的に垂直に延びる請求項1から3のいずれか1項に記載のレチクル容器。
- 少なくとも一部が少なくとも一つの金属材料で作られ、前記金属材料が特にアルミニウム及び/又はステンレス鋼で構成される請求項1から4のいずれか1項に記載のレチクル容器。
- 保持要素、特にスロット又は張り出し部を備え、前記スロット又は前記張り出し部の上又は間にレチクルを位置付けることができる請求項1から5のいずれか1項に記載のレチクル容器。
- 前記保持要素に、ポリマー材料で作られた挿入物及び/又はライニングが設けられる請求項6に記載のレチクル容器。
- 2、3、4、5、6、7、8、9、又は10枚以上のレチクル(22)を保管するよう適合される請求項1から7のいずれか1項に記載のレチクル容器。
- 前記第1の拡散板(24)の開口部(25a、25b)及び/又は前記第2の拡散板(26)の開口部(27a、27b)に、少なくとも2つ、特に2、3、4、5又は6つの異なる個々の開口面積が提供され、前記開口面積が、前記第1及び/又は前記第2の拡散板の中央セクションにおける開口部の最大の個々の開口面積から、前記第1及び/又は前記第2の拡散板の前記周辺セクションの近傍における最小の開口面積まで減少する請求項1から8のいずれか1項に記載のレチクル容器。
- 最も外側の開口部の全てが、前記中央セクションの開口部よりも小さい個々の開口面積である請求項1から9のいずれか1項に記載のレチクル容器。
- 個々の前記開口部は、円形、及び/又は楕円形、及び/又は正方形、及び/又は三角形、及び/又は長方形、及び/又は卵形、及び/又は三日月形、及び/又はスリット形、及び/又は多角形の開口面積を備える請求項1から10のいずれか1項に記載のレチクル容器。
- レチクル容器の内部において、前記レチクル容器の入口ポートと、前記レチクル容器のレチクル保管部分との間、及び/又は、前記レチクル容器の前記レチクル保管部分と、前記レチクル容器の出口ポートとの間に使用されるよう適合された、拡散板であって、開口部が設けられ、前記拡散板の中央セクションの開口部に、前記拡散板の周辺セクションの開口部よりも、大きい個々の開口面積が提供され、及び/又は、単位面積当たりで大きい合計開口面積を提供する拡散板。
- 請求項1から11のいずれか1項に記載のレチクル容器に使用されるよう適合される拡散板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022092017A JP2022119995A (ja) | 2016-08-30 | 2022-06-07 | レチクル容器及び拡散板 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16186441.8 | 2016-08-30 | ||
EP16186441.8A EP3291289B1 (en) | 2016-08-30 | 2016-08-30 | Reticle compartment and diffusor plate |
PCT/EP2017/071631 WO2018041816A1 (en) | 2016-08-30 | 2017-08-29 | Reticle compartment and diffusor plate |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022092017A Division JP2022119995A (ja) | 2016-08-30 | 2022-06-07 | レチクル容器及び拡散板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019528486A true JP2019528486A (ja) | 2019-10-10 |
JP7344116B2 JP7344116B2 (ja) | 2023-09-13 |
Family
ID=56855289
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019532190A Active JP7344116B2 (ja) | 2016-08-30 | 2017-08-29 | レチクル容器及び拡散板 |
JP2022092017A Pending JP2022119995A (ja) | 2016-08-30 | 2022-06-07 | レチクル容器及び拡散板 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022092017A Pending JP2022119995A (ja) | 2016-08-30 | 2022-06-07 | レチクル容器及び拡散板 |
Country Status (7)
Country | Link |
---|---|
US (2) | US10727098B2 (ja) |
EP (2) | EP4102549A1 (ja) |
JP (2) | JP7344116B2 (ja) |
KR (1) | KR102445362B1 (ja) |
CN (2) | CN117457552A (ja) |
TW (2) | TWI774689B (ja) |
WO (1) | WO2018041816A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210066938A (ko) * | 2018-10-26 | 2021-06-07 | 어플라이드 머티어리얼스, 인코포레이티드 | 측면 저장 포드들, 전자 디바이스 프로세싱 시스템들, 및 이를 동작시키기 위한 방법들 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08339990A (ja) * | 1995-04-13 | 1996-12-24 | Toshiba Corp | プラズマ処理装置 |
JPH10321714A (ja) * | 1997-05-20 | 1998-12-04 | Sony Corp | 密閉コンテナ並びに密閉コンテナ用雰囲気置換装置及び雰囲気置換方法 |
JP2001054927A (ja) * | 1999-08-17 | 2001-02-27 | Nippon Synthetic Chem Ind Co Ltd:The | 熱可塑性樹脂シートの製造法および製造装置 |
JP2002170876A (ja) * | 2000-12-04 | 2002-06-14 | Ebara Corp | 基板搬送容器 |
JP2003229477A (ja) * | 2002-02-04 | 2003-08-15 | Matsushita Electric Ind Co Ltd | 標準製造インターフェイス装置 |
US20050056441A1 (en) * | 2002-10-01 | 2005-03-17 | Rider Gavin Charles | Reduction of electric-field-induced damage in field-sensitive articles |
JP2005353862A (ja) * | 2004-06-11 | 2005-12-22 | Sony Corp | 基板収納搬送容器 |
WO2008062537A1 (fr) * | 2006-11-24 | 2008-05-29 | Miraial Co., Ltd. | Système de support de stockage de feuilles et boîtier à réticule utilisant celui-ci |
US20080298933A1 (en) * | 2007-05-29 | 2008-12-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Substrate carrier, port apparatus and facility interface and apparatus including same |
WO2009050915A1 (ja) * | 2007-10-19 | 2009-04-23 | Sharp Kabushiki Kaisha | 表示装置、テレビ受信装置 |
JP2017112165A (ja) * | 2015-12-15 | 2017-06-22 | 信越ポリマー株式会社 | 基板収納容器 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7400383B2 (en) * | 2005-04-04 | 2008-07-15 | Entegris, Inc. | Environmental control in a reticle SMIF pod |
TWI411563B (zh) | 2009-09-25 | 2013-10-11 | Gudeng Prec Industral Co Ltd | 光罩盒 |
KR101458626B1 (ko) * | 2012-11-01 | 2014-11-11 | 우범제 | 웨이퍼 퍼징 카세트 |
KR101366135B1 (ko) * | 2013-10-10 | 2014-02-25 | 주식회사 엘에스테크 | 포스트 퍼지 장치 |
KR101637498B1 (ko) * | 2015-03-24 | 2016-07-07 | 피코앤테라(주) | 웨이퍼 수납용기 |
-
2016
- 2016-08-30 EP EP22188180.8A patent/EP4102549A1/en active Pending
- 2016-08-30 EP EP16186441.8A patent/EP3291289B1/en active Active
-
2017
- 2017-08-29 US US16/328,848 patent/US10727098B2/en active Active
- 2017-08-29 TW TW106129265A patent/TWI774689B/zh active
- 2017-08-29 JP JP2019532190A patent/JP7344116B2/ja active Active
- 2017-08-29 CN CN202311246177.5A patent/CN117457552A/zh active Pending
- 2017-08-29 TW TW111126538A patent/TW202242962A/zh unknown
- 2017-08-29 WO PCT/EP2017/071631 patent/WO2018041816A1/en active Application Filing
- 2017-08-29 KR KR1020197008897A patent/KR102445362B1/ko active IP Right Grant
- 2017-08-29 CN CN201780067150.6A patent/CN109891568A/zh active Pending
-
2020
- 2020-07-28 US US16/940,976 patent/US11171024B2/en active Active
-
2022
- 2022-06-07 JP JP2022092017A patent/JP2022119995A/ja active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08339990A (ja) * | 1995-04-13 | 1996-12-24 | Toshiba Corp | プラズマ処理装置 |
JPH10321714A (ja) * | 1997-05-20 | 1998-12-04 | Sony Corp | 密閉コンテナ並びに密閉コンテナ用雰囲気置換装置及び雰囲気置換方法 |
JP2001054927A (ja) * | 1999-08-17 | 2001-02-27 | Nippon Synthetic Chem Ind Co Ltd:The | 熱可塑性樹脂シートの製造法および製造装置 |
JP2002170876A (ja) * | 2000-12-04 | 2002-06-14 | Ebara Corp | 基板搬送容器 |
JP2003229477A (ja) * | 2002-02-04 | 2003-08-15 | Matsushita Electric Ind Co Ltd | 標準製造インターフェイス装置 |
US20050056441A1 (en) * | 2002-10-01 | 2005-03-17 | Rider Gavin Charles | Reduction of electric-field-induced damage in field-sensitive articles |
JP2005353862A (ja) * | 2004-06-11 | 2005-12-22 | Sony Corp | 基板収納搬送容器 |
WO2008062537A1 (fr) * | 2006-11-24 | 2008-05-29 | Miraial Co., Ltd. | Système de support de stockage de feuilles et boîtier à réticule utilisant celui-ci |
US20080298933A1 (en) * | 2007-05-29 | 2008-12-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Substrate carrier, port apparatus and facility interface and apparatus including same |
WO2009050915A1 (ja) * | 2007-10-19 | 2009-04-23 | Sharp Kabushiki Kaisha | 表示装置、テレビ受信装置 |
JP2017112165A (ja) * | 2015-12-15 | 2017-06-22 | 信越ポリマー株式会社 | 基板収納容器 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210066938A (ko) * | 2018-10-26 | 2021-06-07 | 어플라이드 머티어리얼스, 인코포레이티드 | 측면 저장 포드들, 전자 디바이스 프로세싱 시스템들, 및 이를 동작시키기 위한 방법들 |
KR102531097B1 (ko) | 2018-10-26 | 2023-05-09 | 어플라이드 머티어리얼스, 인코포레이티드 | 측면 저장 포드들, 전자 디바이스 프로세싱 시스템들, 및 이를 동작시키기 위한 방법들 |
US11791185B2 (en) | 2018-10-26 | 2023-10-17 | Applied Materials, Inc. | Side storage pods, electronic device processing systems, and methods for operating the same |
Also Published As
Publication number | Publication date |
---|---|
TWI774689B (zh) | 2022-08-21 |
US20200357673A1 (en) | 2020-11-12 |
US20190189483A1 (en) | 2019-06-20 |
KR20190071684A (ko) | 2019-06-24 |
WO2018041816A1 (en) | 2018-03-08 |
EP4102549A1 (en) | 2022-12-14 |
JP7344116B2 (ja) | 2023-09-13 |
US10727098B2 (en) | 2020-07-28 |
CN109891568A (zh) | 2019-06-14 |
KR102445362B1 (ko) | 2022-09-20 |
EP3291289B1 (en) | 2022-08-03 |
TW201826337A (zh) | 2018-07-16 |
CN117457552A (zh) | 2024-01-26 |
EP3291289A1 (en) | 2018-03-07 |
US11171024B2 (en) | 2021-11-09 |
TW202242962A (zh) | 2022-11-01 |
JP2022119995A (ja) | 2022-08-17 |
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