JP2019527475A5 - - Google Patents

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Publication number
JP2019527475A5
JP2019527475A5 JP2019500329A JP2019500329A JP2019527475A5 JP 2019527475 A5 JP2019527475 A5 JP 2019527475A5 JP 2019500329 A JP2019500329 A JP 2019500329A JP 2019500329 A JP2019500329 A JP 2019500329A JP 2019527475 A5 JP2019527475 A5 JP 2019527475A5
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JP
Japan
Prior art keywords
wafer
design file
critical areas
processor
data
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JP2019500329A
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English (en)
Japanese (ja)
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JP6906044B2 (ja
JP2019527475A (ja
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Priority claimed from US15/600,784 external-priority patent/US10304177B2/en
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Publication of JP2019527475A publication Critical patent/JP2019527475A/ja
Publication of JP2019527475A5 publication Critical patent/JP2019527475A5/ja
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Publication of JP6906044B2 publication Critical patent/JP6906044B2/ja
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JP2019500329A 2016-06-29 2017-06-16 感度改善およびニューサンス抑制のため、論理的およびホットスポット検査でｚレイヤコンテキストを使用するシステムおよび方法 Active JP6906044B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662356499P 2016-06-29 2016-06-29
US62/356,499 2016-06-29
US15/600,784 2017-05-21
US15/600,784 US10304177B2 (en) 2016-06-29 2017-05-21 Systems and methods of using z-layer context in logic and hot spot inspection for sensitivity improvement and nuisance suppression
PCT/US2017/037934 WO2018005132A1 (en) 2016-06-29 2017-06-16 Systems and methods of using z-layer context in logic and hot spot inspection for sensitivity improvement and nuisance suppression

Publications (3)

Publication Number Publication Date
JP2019527475A JP2019527475A (ja) 2019-09-26
JP2019527475A5 true JP2019527475A5 (enExample) 2020-07-30
JP6906044B2 JP6906044B2 (ja) 2021-07-21

Family

ID=60786349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019500329A Active JP6906044B2 (ja) 2016-06-29 2017-06-16 感度改善およびニューサンス抑制のため、論理的およびホットスポット検査でｚレイヤコンテキストを使用するシステムおよび方法

Country Status (7)

Country Link
US (1) US10304177B2 (enExample)
JP (1) JP6906044B2 (enExample)
KR (1) KR102201122B1 (enExample)
CN (1) CN109314067B (enExample)
IL (1) IL263315B (enExample)
TW (1) TWI730133B (enExample)
WO (1) WO2018005132A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11320742B2 (en) * 2018-10-31 2022-05-03 Taiwan Semiconductor Manufacturing Company Ltd. Method and system for generating photomask patterns
US11557031B2 (en) * 2019-11-21 2023-01-17 Kla Corporation Integrated multi-tool reticle inspection
US11887296B2 (en) * 2021-07-05 2024-01-30 KLA Corp. Setting up care areas for inspection of a specimen
KR102657751B1 (ko) * 2021-08-19 2024-04-16 주식회사 크레셈 학습모델을 이용한 기판 검사 방법

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US9002497B2 (en) * 2003-07-03 2015-04-07 Kla-Tencor Technologies Corp. Methods and systems for inspection of wafers and reticles using designer intent data
KR101565071B1 (ko) * 2005-11-18 2015-11-03 케이엘에이-텐코 코포레이션 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템
US8041103B2 (en) 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US7676077B2 (en) * 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
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US7496874B2 (en) * 2005-12-21 2009-02-24 Inetrnational Business Machines Corporation Semiconductor yield estimation
US7877722B2 (en) 2006-12-19 2011-01-25 Kla-Tencor Corp. Systems and methods for creating inspection recipes
US8194968B2 (en) 2007-01-05 2012-06-05 Kla-Tencor Corp. Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
US7962864B2 (en) * 2007-05-24 2011-06-14 Applied Materials, Inc. Stage yield prediction
US8799831B2 (en) * 2007-05-24 2014-08-05 Applied Materials, Inc. Inline defect analysis for sampling and SPC
US8126255B2 (en) * 2007-09-20 2012-02-28 Kla-Tencor Corp. Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions
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US9087367B2 (en) * 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
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JP6255152B2 (ja) 2012-07-24 2017-12-27 株式会社日立ハイテクノロジーズ 検査装置
US9189844B2 (en) * 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
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US9183624B2 (en) 2013-06-19 2015-11-10 Kla-Tencor Corp. Detecting defects on a wafer with run time use of design data
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US9401016B2 (en) 2014-05-12 2016-07-26 Kla-Tencor Corp. Using high resolution full die image data for inspection

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