JP2019527475A5 - - Google Patents

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Publication number
JP2019527475A5
JP2019527475A5 JP2019500329A JP2019500329A JP2019527475A5 JP 2019527475 A5 JP2019527475 A5 JP 2019527475A5 JP 2019500329 A JP2019500329 A JP 2019500329A JP 2019500329 A JP2019500329 A JP 2019500329A JP 2019527475 A5 JP2019527475 A5 JP 2019527475A5
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JP
Japan
Prior art keywords
wafer
design file
critical areas
processor
data
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Application number
JP2019500329A
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English (en)
Japanese (ja)
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JP2019527475A (ja
JP6906044B2 (ja
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Priority claimed from US15/600,784 external-priority patent/US10304177B2/en
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Publication of JP2019527475A publication Critical patent/JP2019527475A/ja
Publication of JP2019527475A5 publication Critical patent/JP2019527475A5/ja
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Publication of JP6906044B2 publication Critical patent/JP6906044B2/ja
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JP2019500329A 2016-06-29 2017-06-16 感度改善およびニューサンス抑制のため、論理的およびホットスポット検査でｚレイヤコンテキストを使用するシステムおよび方法 Active JP6906044B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662356499P 2016-06-29 2016-06-29
US62/356,499 2016-06-29
US15/600,784 US10304177B2 (en) 2016-06-29 2017-05-21 Systems and methods of using z-layer context in logic and hot spot inspection for sensitivity improvement and nuisance suppression
US15/600,784 2017-05-21
PCT/US2017/037934 WO2018005132A1 (en) 2016-06-29 2017-06-16 Systems and methods of using z-layer context in logic and hot spot inspection for sensitivity improvement and nuisance suppression

Publications (3)

Publication Number Publication Date
JP2019527475A JP2019527475A (ja) 2019-09-26
JP2019527475A5 true JP2019527475A5 (cg-RX-API-DMAC7.html) 2020-07-30
JP6906044B2 JP6906044B2 (ja) 2021-07-21

Family

ID=60786349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019500329A Active JP6906044B2 (ja) 2016-06-29 2017-06-16 感度改善およびニューサンス抑制のため、論理的およびホットスポット検査でｚレイヤコンテキストを使用するシステムおよび方法

Country Status (7)

Country Link
US (1) US10304177B2 (cg-RX-API-DMAC7.html)
JP (1) JP6906044B2 (cg-RX-API-DMAC7.html)
KR (1) KR102201122B1 (cg-RX-API-DMAC7.html)
CN (1) CN109314067B (cg-RX-API-DMAC7.html)
IL (1) IL263315B (cg-RX-API-DMAC7.html)
TW (1) TWI730133B (cg-RX-API-DMAC7.html)
WO (1) WO2018005132A1 (cg-RX-API-DMAC7.html)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11320742B2 (en) * 2018-10-31 2022-05-03 Taiwan Semiconductor Manufacturing Company Ltd. Method and system for generating photomask patterns
US11557031B2 (en) * 2019-11-21 2023-01-17 Kla Corporation Integrated multi-tool reticle inspection
US11887296B2 (en) * 2021-07-05 2024-01-30 KLA Corp. Setting up care areas for inspection of a specimen
KR102657751B1 (ko) * 2021-08-19 2024-04-16 주식회사 크레셈 학습모델을 이용한 기판 검사 방법

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US8126255B2 (en) * 2007-09-20 2012-02-28 Kla-Tencor Corp. Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions
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