JP2019526163A5 - - Google Patents

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Publication number
JP2019526163A5
JP2019526163A5 JP2018558325A JP2018558325A JP2019526163A5 JP 2019526163 A5 JP2019526163 A5 JP 2019526163A5 JP 2018558325 A JP2018558325 A JP 2018558325A JP 2018558325 A JP2018558325 A JP 2018558325A JP 2019526163 A5 JP2019526163 A5 JP 2019526163A5
Authority
JP
Japan
Prior art keywords
titanium dioxide
polyimide
test socket
socket housing
acicular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018558325A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019526163A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2017/032093 external-priority patent/WO2017197077A1/en
Publication of JP2019526163A publication Critical patent/JP2019526163A/ja
Publication of JP2019526163A5 publication Critical patent/JP2019526163A5/ja
Pending legal-status Critical Current

Links

JP2018558325A 2016-05-12 2017-05-11 ポリイミド組成物およびポリイミド試験ソケットハウジング Pending JP2019526163A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201662335225P 2016-05-12 2016-05-12
US201662335229P 2016-05-12 2016-05-12
US201662335222P 2016-05-12 2016-05-12
US62/335,222 2016-05-12
US62/335,229 2016-05-12
US62/335,225 2016-05-12
PCT/US2017/032093 WO2017197077A1 (en) 2016-05-12 2017-05-11 Polyimide compositions and a polyimide test socket housing

Publications (2)

Publication Number Publication Date
JP2019526163A JP2019526163A (ja) 2019-09-12
JP2019526163A5 true JP2019526163A5 (enExample) 2020-06-25

Family

ID=58772643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018558325A Pending JP2019526163A (ja) 2016-05-12 2017-05-11 ポリイミド組成物およびポリイミド試験ソケットハウジング

Country Status (6)

Country Link
US (1) US20190136054A1 (enExample)
EP (1) EP3455292B1 (enExample)
JP (1) JP2019526163A (enExample)
KR (1) KR20190008538A (enExample)
CN (2) CN112920601A (enExample)
WO (1) WO2017197077A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201911133D0 (en) * 2019-08-05 2019-09-18 Qinetiq Ltd Materials and methods
KR102548091B1 (ko) * 2021-04-16 2023-06-27 주식회사 대림 폴리이미드를 포함하는 반도체 소자 테스트 소켓용 성형체 및 이의 제조방법

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4331970A (en) * 1978-09-18 1982-05-25 General Electric Company Use of dispersed solids as fillers in polymeric materials to provide material for semiconductor junction passivation
US4360626A (en) 1981-04-24 1982-11-23 E. I. Du Pont De Nemours And Company Oxidatively stable polyimide compositions
US5206340A (en) * 1988-12-27 1993-04-27 Mitsui Toatsu Chemicals, Inc. Integrated circuit socket comprising a polyimide polymer
US5886129A (en) * 1997-07-01 1999-03-23 E. I. Du Pont De Nemours And Company Oxidatively stable rigid aromatic polyimide compositions and process for their preparation
JP2000143984A (ja) * 1998-11-05 2000-05-26 Showa Denko Kk フッ素化ポリイミド樹脂組成物及びその製造方法
DE60233559D1 (de) * 2001-04-03 2009-10-15 Kureha Corp Ic-fassung
JP2004035825A (ja) * 2002-07-05 2004-02-05 Kanegafuchi Chem Ind Co Ltd 半導電性ポリイミドフィルムおよびその製造方法
DE20316645U1 (de) * 2003-10-29 2005-03-10 Fan, Wei-Fang, Jwu Beei Modulare elastische Kontaktstiftgruppevorrichtung
US7876087B2 (en) * 2006-09-12 2011-01-25 Innoconnex, Inc. Probe card repair using coupons with spring contacts and separate atachment points
ATE503802T1 (de) * 2006-10-11 2011-04-15 Sumitomo Electric Industries Polyimidrohr, herstellungsverfahren dafür, verfahren zur herstellung eines polyimidlacks und fixierband
US8433029B2 (en) * 2007-12-14 2013-04-30 Global Nuclear Fuel—Americas, LLC Determination of safety limit minimum critical power ratio
WO2009142938A1 (en) * 2008-05-20 2009-11-26 E. I. Du Pont De Nemours And Company Thermally and dimensionally stable polyimide films and methods relating thereto
CN102712753B (zh) * 2009-11-20 2015-08-26 E·I·内穆尔杜邦公司 热稳定的且尺寸稳定的聚酰亚胺薄膜及与其相关的方法
CN101805517B (zh) * 2010-03-02 2012-05-09 天津恒通时代电工材料科技有限公司 一种无机颗粒填充的聚酰亚胺薄膜的制造方法
CN101831175A (zh) * 2010-04-01 2010-09-15 辽宁科技大学 一种无色透明的聚酰亚胺纳米复合材料膜及其制备方法
US8795799B2 (en) * 2010-09-29 2014-08-05 E I Du Pont De Nemours And Company Polyimide resins for high temperature applications
WO2016053328A1 (en) * 2014-10-01 2016-04-07 E. I. Du Pont De Nemours And Company Spindle cover comprising non-thermoplstic polyimide as part of a beverage can printing unit

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