JP2019523884A5 - - Google Patents
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- JP2019523884A5 JP2019523884A5 JP2018565882A JP2018565882A JP2019523884A5 JP 2019523884 A5 JP2019523884 A5 JP 2019523884A5 JP 2018565882 A JP2018565882 A JP 2018565882A JP 2018565882 A JP2018565882 A JP 2018565882A JP 2019523884 A5 JP2019523884 A5 JP 2019523884A5
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- JP
- Japan
- Prior art keywords
- substrate
- enclosure
- assembly
- sensors
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims 40
- 238000009413 insulation Methods 0.000 claims 9
- 238000005259 measurement Methods 0.000 claims 8
- 239000010410 layer Substances 0.000 claims 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- 239000002178 crystalline material Substances 0.000 claims 3
- 239000007789 gas Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 229910052710 silicon Inorganic materials 0.000 claims 3
- 239000010703 silicon Substances 0.000 claims 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims 3
- 235000012239 silicon dioxide Nutrition 0.000 claims 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 2
- 239000011195 cermet Substances 0.000 claims 2
- 239000011247 coating layer Substances 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 230000005855 radiation Effects 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims 1
- 229910001339 C alloy Inorganic materials 0.000 claims 1
- 229910000531 Co alloy Inorganic materials 0.000 claims 1
- 229910002601 GaN Inorganic materials 0.000 claims 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 claims 1
- 230000002745 absorbent Effects 0.000 claims 1
- 239000002250 absorbent Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 238000011109 contamination Methods 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- 229910052732 germanium Inorganic materials 0.000 claims 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000001247 metal acetylides Chemical class 0.000 claims 1
- QMQXDJATSGGYDR-UHFFFAOYSA-N methylidyneiron Chemical compound [C].[Fe] QMQXDJATSGGYDR-UHFFFAOYSA-N 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- 229910052594 sapphire Inorganic materials 0.000 claims 1
- 239000010980 sapphire Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000011343 solid material Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021121972A JP7194786B2 (ja) | 2016-06-15 | 2021-07-26 | 計装基板装置及び方法 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662350688P | 2016-06-15 | 2016-06-15 | |
| US62/350,688 | 2016-06-15 | ||
| US15/277,792 US10460966B2 (en) | 2016-06-15 | 2016-09-27 | Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications |
| US15/277,792 | 2016-09-27 | ||
| PCT/US2017/037548 WO2017218701A1 (en) | 2016-06-15 | 2017-06-14 | Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021121972A Division JP7194786B2 (ja) | 2016-06-15 | 2021-07-26 | 計装基板装置及び方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019523884A JP2019523884A (ja) | 2019-08-29 |
| JP2019523884A5 true JP2019523884A5 (enExample) | 2020-07-30 |
| JP6920357B2 JP6920357B2 (ja) | 2021-08-18 |
Family
ID=60661415
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018565882A Active JP6920357B2 (ja) | 2016-06-15 | 2017-06-14 | 高温プロセスアプリケーションにおいて測定パラメータを取得するためのカプセル化された計装基板装置 |
| JP2021121972A Active JP7194786B2 (ja) | 2016-06-15 | 2021-07-26 | 計装基板装置及び方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021121972A Active JP7194786B2 (ja) | 2016-06-15 | 2021-07-26 | 計装基板装置及び方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US10460966B2 (enExample) |
| JP (2) | JP6920357B2 (enExample) |
| KR (1) | KR102446462B1 (enExample) |
| CN (2) | CN112820718B (enExample) |
| SG (1) | SG11201807420YA (enExample) |
| TW (1) | TWI751172B (enExample) |
| WO (1) | WO2017218701A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10460966B2 (en) | 2016-06-15 | 2019-10-29 | Kla-Tencor Corporation | Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications |
| US20180366354A1 (en) | 2017-06-19 | 2018-12-20 | Applied Materials, Inc. | In-situ semiconductor processing chamber temperature apparatus |
| US10900843B2 (en) * | 2018-06-05 | 2021-01-26 | Kla Corporation | In-situ temperature sensing substrate, system, and method |
| US10794681B2 (en) * | 2018-09-04 | 2020-10-06 | Applied Materials, Inc. | Long range capacitive gap measurement in a wafer form sensor system |
| US11315811B2 (en) | 2018-09-06 | 2022-04-26 | Kla Corporation | Process temperature measurement device fabrication techniques and methods of calibration and data interpolation of the same |
| KR102136466B1 (ko) * | 2018-09-11 | 2020-07-22 | 주식회사 이큐셀 | 고온 공정 진단이 가능한 웨이퍼 센서 |
| US11054317B2 (en) * | 2018-09-28 | 2021-07-06 | Applied Materials, Inc. | Method and apparatus for direct measurement of chucking force on an electrostatic chuck |
| US12074044B2 (en) * | 2018-11-14 | 2024-08-27 | Cyberoptics Corporation | Wafer-like sensor |
| US11636948B2 (en) * | 2019-05-21 | 2023-04-25 | Q Med Innovations, Inc. | Instrument kit tracking system |
| KR102438344B1 (ko) * | 2019-10-14 | 2022-09-01 | 세메스 주식회사 | 웨이퍼형 센서 유닛 및 웨이퍼형 센서 유닛의 제조 방법 |
| KR102382971B1 (ko) * | 2019-11-05 | 2022-04-05 | 이트론 주식회사 | 반도체 공정 진단을 위한 온도 센서 장치 및 이의 제조 방법 |
| US11668601B2 (en) | 2020-02-24 | 2023-06-06 | Kla Corporation | Instrumented substrate apparatus |
| US11924972B2 (en) * | 2020-06-02 | 2024-03-05 | Applied Materials, Inc. | Diagnostic disc with a high vacuum and temperature tolerant power source |
| US11589474B2 (en) | 2020-06-02 | 2023-02-21 | Applied Materials, Inc. | Diagnostic disc with a high vacuum and temperature tolerant power source |
| US20220223441A1 (en) * | 2021-01-08 | 2022-07-14 | Kla Corporation | Process condition sensing apparatus |
| US11688614B2 (en) * | 2021-04-28 | 2023-06-27 | Kla Corporation | Mitigating thermal expansion mismatch in temperature probe construction apparatus and method |
| US20240035896A1 (en) * | 2022-07-28 | 2024-02-01 | Applied Materials, Inc. | Radical sensor substrate |
| CN115399913B (zh) * | 2022-09-16 | 2024-05-03 | 复旦大学附属中山医院 | 一种高灵敏度柔性人工智能皮肤及其制备方法 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0943226A4 (en) | 1996-12-06 | 2000-03-15 | Corning Inc | HOUSING FOR TEMPERATURE-SENSITIVE PLANAR OPTICAL COMPONENTS |
| KR20000057385A (ko) * | 1996-12-06 | 2000-09-15 | 알프레드 엘. 미첼슨 | 감온성 평면 광소자용 팩키지 |
| US7757574B2 (en) * | 2002-01-24 | 2010-07-20 | Kla-Tencor Corporation | Process condition sensing wafer and data analysis system |
| US6889568B2 (en) * | 2002-01-24 | 2005-05-10 | Sensarray Corporation | Process condition sensing wafer and data analysis system |
| US6915589B2 (en) | 2003-10-16 | 2005-07-12 | Sensarray Corporation | Sensor positioning systems and methods |
| JP5137573B2 (ja) * | 2004-07-10 | 2013-02-06 | ケーエルエー−テンカー コーポレイション | パラメータ測定の歪みを小さくする方法および装置 |
| US7181972B2 (en) * | 2004-12-27 | 2007-02-27 | General Electric Company | Static and dynamic pressure sensor |
| JP4809179B2 (ja) * | 2005-10-20 | 2011-11-09 | 日本碍子株式会社 | 温度計測用断熱容器 |
| TWI405281B (zh) * | 2005-12-13 | 2013-08-11 | Sensarray Corp | 製程條件感應晶圓及資料分析系統 |
| US8604361B2 (en) * | 2005-12-13 | 2013-12-10 | Kla-Tencor Corporation | Component package for maintaining safe operating temperature of components |
| US7555948B2 (en) * | 2006-05-01 | 2009-07-07 | Lynn Karl Wiese | Process condition measuring device with shielding |
| US7540188B2 (en) | 2006-05-01 | 2009-06-02 | Lynn Karl Wiese | Process condition measuring device with shielding |
| US7875812B2 (en) | 2008-07-31 | 2011-01-25 | Ge Aviation Systems, Llc | Method and apparatus for electrical component physical protection |
| JP2010229498A (ja) * | 2009-03-27 | 2010-10-14 | Shindengen Electric Mfg Co Ltd | 温度測定装置、薄膜形成装置、温度測定方法及び半導体装置 |
| TWI391067B (zh) * | 2009-08-27 | 2013-03-21 | Taiflex Scient Co Ltd | Thermally conductive substrate for electronic component with low thermal resistance, low thermal expansion coefficient and high electrical reliability and manufacturing method thereof |
| US8889021B2 (en) * | 2010-01-21 | 2014-11-18 | Kla-Tencor Corporation | Process condition sensing device and method for plasma chamber |
| JP5533597B2 (ja) * | 2010-11-25 | 2014-06-25 | トヨタ自動車株式会社 | 温度測定装置 |
| JP2012163525A (ja) * | 2011-02-09 | 2012-08-30 | Sumitomo Heavy Ind Ltd | 温度測定器、成膜装置、及び成膜基板製造方法 |
| JP5712975B2 (ja) * | 2012-07-06 | 2015-05-07 | 東京エレクトロン株式会社 | 計測用基板、基板処理装置及び基板処理装置の運転方法 |
| JP2014232668A (ja) * | 2013-05-29 | 2014-12-11 | パナソニック株式会社 | 接点装置、電磁継電器および接点装置の製造方法 |
| US9719867B2 (en) * | 2013-05-30 | 2017-08-01 | Kla-Tencor Corporation | Method and system for measuring heat flux |
| US9760132B2 (en) * | 2013-09-19 | 2017-09-12 | Nvidia Corporation | Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad |
| US9642566B2 (en) * | 2013-10-04 | 2017-05-09 | General Electric Company | Flexible embedded sensor arrays and methods of making the same |
| PT3194184T (pt) * | 2014-09-17 | 2022-12-09 | Ste Ind S R L | Dispositivo de transmissão e método para transmissão em modo sem fios de parâmetros sujeitos a medição |
| US11150140B2 (en) | 2016-02-02 | 2021-10-19 | Kla Corporation | Instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications |
| US10460966B2 (en) | 2016-06-15 | 2019-10-29 | Kla-Tencor Corporation | Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications |
-
2016
- 2016-09-27 US US15/277,792 patent/US10460966B2/en active Active
-
2017
- 2017-06-14 JP JP2018565882A patent/JP6920357B2/ja active Active
- 2017-06-14 KR KR1020197001070A patent/KR102446462B1/ko active Active
- 2017-06-14 SG SG11201807420YA patent/SG11201807420YA/en unknown
- 2017-06-14 CN CN202011626182.5A patent/CN112820718B/zh active Active
- 2017-06-14 WO PCT/US2017/037548 patent/WO2017218701A1/en not_active Ceased
- 2017-06-14 CN CN201780034833.1A patent/CN109314066B/zh active Active
- 2017-06-15 TW TW106119910A patent/TWI751172B/zh active
-
2019
- 2019-10-28 US US16/665,960 patent/US11823925B2/en active Active
-
2021
- 2021-07-26 JP JP2021121972A patent/JP7194786B2/ja active Active
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