JP2019522894A - 複数の窒化ガリウムダイオードを備えた光電子デバイスを製造する方法 - Google Patents
複数の窒化ガリウムダイオードを備えた光電子デバイスを製造する方法 Download PDFInfo
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- 230000005693 optoelectronics Effects 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 229910002601 GaN Inorganic materials 0.000 title claims description 57
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims description 56
- 229910052751 metal Inorganic materials 0.000 claims abstract description 104
- 239000002184 metal Substances 0.000 claims abstract description 104
- 239000004065 semiconductor Substances 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims description 72
- 239000000758 substrate Substances 0.000 claims description 37
- 230000008569 process Effects 0.000 claims description 32
- 238000006243 chemical reaction Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910005887 NiSn Inorganic materials 0.000 claims description 3
- 229910008487 TiSn Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052745 lead Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 117
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- -1 gallium nitrides Chemical class 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
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- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
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- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
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- Led Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
Description
LED を流れる電流を、例えば個々に制御可能とすべくLED に接続されるように構成された複数の金属パッドを表面に備えた集積回路の形態の制御回路をまず形成し、
次に、反対の導電型にドープされた少なくとも第1及び第2の窒化ガリウム層を備えた窒化ガリウムLED 活性積層体を、金属パッドを備えた制御回路の表面に、窒化ガリウムLED 活性積層体の第1及び第2の窒化ガリウム層の一方が制御回路の金属パッドと電気的に接するように置き、
その後、窒化ガリウムLED 活性積層体を構造化して、窒化ガリウムLED 活性積層体に光電子デバイスの別個のLED を画定する。
Claims (15)
- 光電子デバイスを製造する方法であって、
a) 複数の接続用金属パッド(113) を有する集積型制御回路(110) の表面に、反対の導電型にドープされた少なくとも第1の半導体層(153) 及び第2の半導体層(157) を有する活性ダイオード積層体(150) を、前記活性ダイオード積層体の前記第2の半導体層(157) が前記制御回路(110) の前記金属パッド(113) に電気的に接続されるように移す工程、及び
b) 前記制御回路(110) の異なる金属パッド(113) に接続された複数のダイオード(172) を画定するトレンチ(170) を前記活性ダイオード積層体(150) に形成する工程
を順次的に有することを特徴とする方法。 - 工程a)の前に、
前記金属パッド(113) の側に前記制御回路(110) の実質的に表面全体に亘って少なくとも1つの第1の金属層(116) を成膜する工程、及び
前記第1の半導体層(153) と反対の前記第2の半導体層(157) の実質的に表面全体に亘って少なくとも1つの第2の金属層(159) を成膜する工程
の少なくとも1つを更に有することを特徴とする請求項1に記載の方法。 - 前記第1の金属層(116) 及び前記第2の金属層(159) の少なくとも一方は銀の反射層を有することを特徴とする請求項2に記載の方法。
- 前記第1の金属層(116) 及び前記第2の金属層(159) の少なくとも一方は、TaN 、TiN 、WN、TiW 又はこれらの材料の一若しくは複数の組み合わせから形成された障壁層を有することを特徴とする請求項2又は3に記載の方法。
- 前記第1の金属層(116) 及び前記第2の金属層(159) の少なくとも一方は、Ti、Ni、Pt、Sn、Au、Ag、Al、Pd、W 、Pb、Cu、AuSn、TiSn、NiSn又はこれらの材料の全て若しくは一部の合金から形成された結合層を有することを特徴とする請求項2〜4のいずれか一項に記載の方法。
- 工程b)で形成された前記トレンチ(170) は、前記第1の金属層(116) 及び前記第2の金属層(159) を横切って前記活性ダイオード積層体(150) の高さ全体に亘って延びていることを特徴とする請求項2〜5のいずれか一項に記載の方法。
- 工程a)の実行中、前記活性ダイオード積層体(150) は、前記第2の半導体層(157) と反対の前記第1の半導体層(153) の側に設けられた支持基板(201) に支持されており、
工程a)と工程b)との間に前記支持基板(201) を除去する工程を更に有することを特徴とする請求項1〜6のいずれか一項に記載の方法。 - 工程b)の後、前記第2の半導体層(157) と反対の前記第1の半導体層(153) の表面の最上部で前記第1の半導体層(153) の表面と接する電極(178; 182)を各ダイオード(172) 上に成膜する工程を更に有することを特徴とする請求項1〜7のいずれか一項に記載の方法。
- 前記電極(178) は、各ダイオード(172) のレベルで前記第2の半導体層(157) と反対の前記第1の半導体層(153) の表面が前記ダイオード(172) の周縁部分で金属グリッドと接して、前記第1の半導体層(153) の表面が前記ダイオード(172) の中央部分では前記金属グリッドで覆われていないように配置された連続的な前記金属グリッドを形成することを特徴とする請求項8に記載の方法。
- 前記電極(182) は、前記光電子デバイスの表面全体を実質的に覆って、透明な導電性材料から形成された連続的な層を形成することを特徴とする請求項8に記載の方法。
- 半導体の前記ダイオード(172) は発光ダイオードであることを特徴とする請求項1〜10のいずれか一項に記載の方法。
- 工程b)の後、前記制御回路(110) と反対の前記光電子デバイスの表面に、前記光電子デバイスの表面全体を実質的に覆う多重量子井戸を有する光輝性変換積層体(203) を移す工程を更に有することを特徴とする請求項11に記載の方法。
- 前記光輝性変換積層体(203) を移した後、前記半導体のダイオード(172) の一部と対向する前記光輝性変換積層体(203) の部分のみを除去する工程を更に有することを特徴とする請求項12に記載の方法。
- 前記ダイオードはフォトダイオードであることを特徴とする請求項1〜10のいずれか一項に記載の方法。
- 前記第1の半導体層(153) 及び前記第2の半導体層(157) は窒化ガリウム層であり、前記ダイオード(172) は窒化ガリウムダイオードであることを特徴とする請求項1〜14のいずれか一項に記載の方法。
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PCT/FR2016/051140 WO2017194845A1 (fr) | 2016-05-13 | 2016-05-13 | Procédé de fabrication d'un dispositif optoélectronique comportant une pluralité de diodes au nitrure de gallium |
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EP (2) | EP3455882B1 (ja) |
JP (1) | JP6843885B2 (ja) |
KR (1) | KR102574122B1 (ja) |
CN (1) | CN109564930B (ja) |
ES (1) | ES2896179T3 (ja) |
TW (1) | TWI716595B (ja) |
WO (1) | WO2017194845A1 (ja) |
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US11527674B2 (en) | 2020-05-20 | 2022-12-13 | Nichia Corporation | Method of manufacturing light-emitting device |
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FR3063163B1 (fr) | 2017-02-21 | 2021-10-08 | Commissariat Energie Atomique | Capteur d'empreinte a led au nitrure de gallium. |
FR3086100B1 (fr) | 2018-09-13 | 2022-08-12 | Commissariat Energie Atomique | Procede de fabrication d'un dispositif optoelectronique comprenant une pluralite de diodes |
FR3086399B1 (fr) | 2018-09-24 | 2021-09-17 | Commissariat Energie Atomique | Systeme de vision en realite virtuelle ou augmentee avec capteur d'image de l'œil, et procede associe |
FR3091030B1 (fr) | 2018-12-19 | 2021-01-08 | Commissariat Energie Atomique | Procédé de fabrication d'un dispositif optoélectronique comportant une pluralité de diodes |
FR3094568B1 (fr) * | 2019-03-29 | 2022-04-22 | Commissariat Energie Atomique | Procédé de fabrication d'un écran d'affichage émissif à LED tridimensionnelles |
CN111863802A (zh) * | 2019-04-24 | 2020-10-30 | 深圳第三代半导体研究院 | 一种垂直集成单元二极管芯片 |
CN111863853A (zh) * | 2019-04-24 | 2020-10-30 | 深圳第三代半导体研究院 | 一种垂直集成单元二极管芯片 |
FR3099966B1 (fr) | 2019-08-16 | 2021-09-24 | Commissariat Energie Atomique | Procédé de fabrication de dispositifs optoélectroniques |
CN114080677A (zh) | 2019-10-15 | 2022-02-22 | 三星电子株式会社 | 显示模块及其制造方法 |
FR3111013B1 (fr) | 2020-05-29 | 2022-06-03 | Commissariat Energie Atomique | Procédé de fabrication d'un dispositif optoélectronique comportant une pluralité de diodes |
FR3118306B1 (fr) * | 2020-12-22 | 2023-05-05 | Commissariat Energie Atomique | Procédé de réalisation d’un dispositif optoélectronique comportant des LED à base de nitrure |
FR3119931B1 (fr) | 2021-02-17 | 2024-04-05 | Commissariat Energie Atomique | Dispositif optoélectronique et procédé de fabrication d'un tel dispositif |
US20230299228A1 (en) * | 2022-02-04 | 2023-09-21 | Meta Platforms Technologies, Llc | Common anode architecture facilitated by p-doping |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003152220A (ja) * | 2001-11-15 | 2003-05-23 | Sharp Corp | 半導体発光素子の製造方法および半導体発光素子 |
JP2008147672A (ja) * | 2006-12-08 | 2008-06-26 | Samsung Electro-Mechanics Co Ltd | 垂直構造led素子及びその製造方法 |
JP2008545267A (ja) * | 2005-06-29 | 2008-12-11 | ソウル オプト デバイス カンパニー リミテッド | 発光ダイオードおよびその製造方法 |
JP2010205969A (ja) * | 2009-03-04 | 2010-09-16 | Stanley Electric Co Ltd | 光半導体装置及びその製造方法 |
JP2011507273A (ja) * | 2007-12-10 | 2011-03-03 | スリーエム イノベイティブ プロパティズ カンパニー | 半導体発光デバイス及びその作製方法 |
US20130126890A1 (en) * | 2011-11-23 | 2013-05-23 | International Business Machines Corporation | Integrating active matrix inorganic light emitting diodes for display devices |
JP2015501085A (ja) * | 2011-12-22 | 2015-01-08 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 表示装置および表示装置の製造方法 |
US20150115387A1 (en) * | 2013-10-29 | 2015-04-30 | Commissariat A L'energie Atomique Et Aux Ene Alt | Method of manufacturing a device comprising an integrated circuit and photovoltaic cells |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6913985B2 (en) * | 2003-06-20 | 2005-07-05 | Oki Data Corporation | Method of manufacturing a semiconductor device |
JP2006286981A (ja) * | 2005-03-31 | 2006-10-19 | Kyocera Corp | 発光装置および画像形成装置 |
DE102007043877A1 (de) * | 2007-06-29 | 2009-01-08 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von optoelektronischen Bauelementen und optoelektronisches Bauelement |
US8183582B2 (en) * | 2007-10-16 | 2012-05-22 | LumaChip, Inc. | Bare die semiconductor device configured for lamination |
CN102859726B (zh) * | 2010-04-06 | 2015-09-16 | 首尔伟傲世有限公司 | 发光二极管及其制造方法 |
EP2562814B1 (en) * | 2011-08-22 | 2020-08-19 | LG Innotek Co., Ltd. | Light emitting device and light emitting device package |
DE102012204987B4 (de) * | 2011-11-29 | 2014-04-17 | Ihp Gmbh - Innovations For High Performance Microelectronics / Leibniz-Institut Für Innovative Mikroelektronik | Licht-emittierende Halbleiterstruktur und opto-elektronisches Bauelement daraus |
FR2992465B1 (fr) * | 2012-06-22 | 2015-03-20 | Soitec Silicon On Insulator | Procede de fabrication collective de leds et structure pour la fabrication collective de leds |
FR2992466A1 (fr) * | 2012-06-22 | 2013-12-27 | Soitec Silicon On Insulator | Procede de realisation de contact pour led et structure resultante |
KR20140031601A (ko) * | 2012-09-05 | 2014-03-13 | 에피스타 코포레이션 | 발광다이오드 어레이 |
DE102012112530A1 (de) * | 2012-12-18 | 2014-06-18 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen von optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip |
CN107768362B (zh) * | 2013-03-28 | 2020-09-08 | 东芝北斗电子株式会社 | 发光装置及其制造方法 |
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Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003152220A (ja) * | 2001-11-15 | 2003-05-23 | Sharp Corp | 半導体発光素子の製造方法および半導体発光素子 |
JP2008545267A (ja) * | 2005-06-29 | 2008-12-11 | ソウル オプト デバイス カンパニー リミテッド | 発光ダイオードおよびその製造方法 |
JP2008147672A (ja) * | 2006-12-08 | 2008-06-26 | Samsung Electro-Mechanics Co Ltd | 垂直構造led素子及びその製造方法 |
JP2011507273A (ja) * | 2007-12-10 | 2011-03-03 | スリーエム イノベイティブ プロパティズ カンパニー | 半導体発光デバイス及びその作製方法 |
JP2010205969A (ja) * | 2009-03-04 | 2010-09-16 | Stanley Electric Co Ltd | 光半導体装置及びその製造方法 |
US20130126890A1 (en) * | 2011-11-23 | 2013-05-23 | International Business Machines Corporation | Integrating active matrix inorganic light emitting diodes for display devices |
JP2015501085A (ja) * | 2011-12-22 | 2015-01-08 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 表示装置および表示装置の製造方法 |
US20150115387A1 (en) * | 2013-10-29 | 2015-04-30 | Commissariat A L'energie Atomique Et Aux Ene Alt | Method of manufacturing a device comprising an integrated circuit and photovoltaic cells |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11527674B2 (en) | 2020-05-20 | 2022-12-13 | Nichia Corporation | Method of manufacturing light-emitting device |
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JP6843885B2 (ja) | 2021-03-17 |
WO2017194845A1 (fr) | 2017-11-16 |
TWI716595B (zh) | 2021-01-21 |
KR102574122B1 (ko) | 2023-09-01 |
CN109564930A (zh) | 2019-04-02 |
KR20190008527A (ko) | 2019-01-24 |
EP3455882A1 (fr) | 2019-03-20 |
CN109564930B (zh) | 2023-08-15 |
EP3455882B1 (fr) | 2021-08-11 |
US20190131343A1 (en) | 2019-05-02 |
TW201813121A (zh) | 2018-04-01 |
US10734439B2 (en) | 2020-08-04 |
ES2896179T3 (es) | 2022-02-24 |
EP3913680A1 (fr) | 2021-11-24 |
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