JP2019517017A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2019517017A5 JP2019517017A5 JP2018552155A JP2018552155A JP2019517017A5 JP 2019517017 A5 JP2019517017 A5 JP 2019517017A5 JP 2018552155 A JP2018552155 A JP 2018552155A JP 2018552155 A JP2018552155 A JP 2018552155A JP 2019517017 A5 JP2019517017 A5 JP 2019517017A5
- Authority
- JP
- Japan
- Prior art keywords
- target
- design
- pitch
- hybrid
- hybrid periodic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000737 periodic effect Effects 0.000 claims 13
- 238000000034 method Methods 0.000 claims 11
- 239000011295 pitch Substances 0.000 claims 10
- 238000001459 lithography Methods 0.000 claims 4
- 238000004590 computer program Methods 0.000 claims 2
- 238000003384 imaging method Methods 0.000 claims 2
- 238000004088 simulation Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662318086P | 2016-04-04 | 2016-04-04 | |
| US62/318,086 | 2016-04-04 | ||
| PCT/US2016/060626 WO2017176314A1 (en) | 2016-04-04 | 2016-11-04 | Process compatibility improvement by fill factor modulation |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019517017A JP2019517017A (ja) | 2019-06-20 |
| JP2019517017A5 true JP2019517017A5 (cg-RX-API-DMAC7.html) | 2019-12-12 |
| JP6952711B2 JP6952711B2 (ja) | 2021-10-20 |
Family
ID=60001339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018552155A Active JP6952711B2 (ja) | 2016-04-04 | 2016-11-04 | ターゲットデザイン方法、製造方法及び計量ターゲット |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10579768B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP3440511B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6952711B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102788661B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN109073981B (cg-RX-API-DMAC7.html) |
| IL (1) | IL261879B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI710860B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2017176314A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11112704B2 (en) * | 2017-02-10 | 2021-09-07 | Kla-Tencor Corporation | Mitigation of inaccuracies related to grating asymmetries in scatterometry measurements |
| KR102447611B1 (ko) | 2017-06-06 | 2022-09-26 | 케이엘에이 코포레이션 | 레티클 최적화 알고리즘들 및 최적의 타겟 설계 |
| US10628544B2 (en) | 2017-09-25 | 2020-04-21 | International Business Machines Corporation | Optimizing integrated circuit designs based on interactions between multiple integration design rules |
| WO2019083560A1 (en) * | 2017-10-23 | 2019-05-02 | Kla-Tencor Corporation | REDUCTION OR ELIMINATION OF PATTERN PLACEMENT ERROR IN METROLOGY MEASUREMENTS |
| KR102381168B1 (ko) * | 2018-10-30 | 2022-03-30 | 케이엘에이 코포레이션 | 비대칭 수차의 추정 |
| CN113439240A (zh) * | 2019-02-19 | 2021-09-24 | Asml控股股份有限公司 | 量测系统、光刻设备和方法 |
| US11378394B1 (en) * | 2020-12-11 | 2022-07-05 | Kla Corporation | On-the-fly scatterometry overlay metrology target |
| JP7667884B2 (ja) * | 2021-12-17 | 2025-04-23 | ケーエルエー コーポレイション | ターゲットの配置精度を向上させるためのオーバーレイターゲットの設計 |
| US12411420B2 (en) * | 2023-09-29 | 2025-09-09 | Kla Corporation | Small in-die target design for overlay measurement |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6303252B1 (en) | 1999-12-27 | 2001-10-16 | United Microelectronics Corp. | Reticle having assist feature between semi-dense lines |
| TW512424B (en) * | 2000-05-01 | 2002-12-01 | Asml Masktools Bv | Hybrid phase-shift mask |
| TW479157B (en) | 2000-07-21 | 2002-03-11 | Asm Lithography Bv | Mask for use in a lithographic projection apparatus and method of making the same |
| US6433878B1 (en) * | 2001-01-29 | 2002-08-13 | Timbre Technology, Inc. | Method and apparatus for the determination of mask rules using scatterometry |
| US6519760B2 (en) * | 2001-02-28 | 2003-02-11 | Asml Masktools, B.V. | Method and apparatus for minimizing optical proximity effects |
| SG108975A1 (en) | 2003-07-11 | 2005-02-28 | Asml Netherlands Bv | Marker structure for alignment or overlay to correct pattern induced displacement, mask pattern for defining such a marker structure and lithographic projection apparatus using such a mask pattern |
| SG111289A1 (en) * | 2003-11-05 | 2005-05-30 | Asml Masktools Bv | A method for performing transmission tuning of a mask pattern to improve process latitude |
| JP2007522432A (ja) * | 2003-12-19 | 2007-08-09 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 差動限界寸法およびオーバーレイ測定装置および測定方法 |
| JP4634849B2 (ja) * | 2005-04-12 | 2011-02-16 | 株式会社東芝 | 集積回路のパターンレイアウト、フォトマスク、半導体装置の製造方法、及びデータ作成方法 |
| US7749662B2 (en) * | 2005-10-07 | 2010-07-06 | Globalfoundries Inc. | Process margin using discrete assist features |
| US7925486B2 (en) | 2006-03-14 | 2011-04-12 | Kla-Tencor Technologies Corp. | Computer-implemented methods, carrier media, and systems for creating a metrology target structure design for a reticle layout |
| US7911612B2 (en) * | 2007-06-13 | 2011-03-22 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
| KR100880232B1 (ko) | 2007-08-20 | 2009-01-28 | 주식회사 동부하이텍 | 미세 마스크 및 그를 이용한 패턴 형성 방법 |
| JP2009109581A (ja) * | 2007-10-26 | 2009-05-21 | Toshiba Corp | 半導体装置の製造方法 |
| JP5529391B2 (ja) * | 2008-03-21 | 2014-06-25 | ルネサスエレクトロニクス株式会社 | ハーフトーン型位相シフトマスク、そのハーフトーン型位相シフトマスクを有する半導体装置の製造装置、およびそのハーフトーン型位相シフトマスクを用いた半導体装置の製造方法 |
| JP5627394B2 (ja) * | 2010-10-29 | 2014-11-19 | キヤノン株式会社 | マスクのデータ及び露光条件を決定するためのプログラム、決定方法、マスク製造方法、露光方法及びデバイス製造方法 |
| US8913237B2 (en) * | 2012-06-26 | 2014-12-16 | Kla-Tencor Corporation | Device-like scatterometry overlay targets |
| WO2015009619A1 (en) | 2013-07-15 | 2015-01-22 | Kla-Tencor Corporation | Producing resist layers using fine segmentation |
| US9053284B2 (en) | 2013-09-04 | 2015-06-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for overlay control |
| US10001711B2 (en) * | 2013-12-17 | 2018-06-19 | Asml Netherlands B.V. | Inspection method, lithographic apparatus, mask and substrate |
| KR102169557B1 (ko) | 2014-01-15 | 2020-10-26 | 케이엘에이 코포레이션 | 다중 패터닝된 타겟에서의 피치 워크의 오버레이 측정 |
| JP6421237B2 (ja) * | 2014-08-29 | 2018-11-07 | エーエスエムエル ネザーランズ ビー．ブイ． | メトロロジー方法、ターゲット、及び基板 |
| NL2017300A (en) * | 2015-08-27 | 2017-03-01 | Asml Netherlands Bv | Method and apparatus for measuring a parameter of a lithographic process, substrate and patterning devices for use in the method |
| WO2017102304A1 (en) * | 2015-12-17 | 2017-06-22 | Asml Netherlands B.V. | Adjustment of a metrology apparatus or a measurement thereby based on a characteristic of a target measured |
-
2016
- 2016-11-04 KR KR1020187031153A patent/KR102788661B1/ko active Active
- 2016-11-04 US US15/502,950 patent/US10579768B2/en active Active
- 2016-11-04 JP JP2018552155A patent/JP6952711B2/ja active Active
- 2016-11-04 CN CN201680084437.5A patent/CN109073981B/zh active Active
- 2016-11-04 WO PCT/US2016/060626 patent/WO2017176314A1/en not_active Ceased
- 2016-11-04 EP EP16898139.7A patent/EP3440511B1/en active Active
-
2017
- 2017-03-31 TW TW106110992A patent/TWI710860B/zh active
-
2018
- 2018-09-20 IL IL261879A patent/IL261879B/en active IP Right Grant