JP2019508592A5 - - Google Patents
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- JP2019508592A5 JP2019508592A5 JP2018559160A JP2018559160A JP2019508592A5 JP 2019508592 A5 JP2019508592 A5 JP 2019508592A5 JP 2018559160 A JP2018559160 A JP 2018559160A JP 2018559160 A JP2018559160 A JP 2018559160A JP 2019508592 A5 JP2019508592 A5 JP 2019508592A5
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- weight
- palladium
- probe
- semiconductor probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/010,690 | 2016-01-29 | ||
| US15/010,690 US10385424B2 (en) | 2016-01-29 | 2016-01-29 | Palladium-based alloys |
| PCT/US2017/015327 WO2017132504A1 (en) | 2016-01-29 | 2017-01-27 | Palladium-based alloys |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019508592A JP2019508592A (ja) | 2019-03-28 |
| JP2019508592A5 true JP2019508592A5 (https=) | 2020-02-20 |
| JP7084877B2 JP7084877B2 (ja) | 2022-06-15 |
Family
ID=59386435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018559160A Active JP7084877B2 (ja) | 2016-01-29 | 2017-01-27 | パラジウム基合金 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US10385424B2 (https=) |
| JP (1) | JP7084877B2 (https=) |
| KR (1) | KR102681572B1 (https=) |
| CN (2) | CN108699629B (https=) |
| DE (1) | DE112017000561T5 (https=) |
| TW (2) | TWI707051B (https=) |
| WO (1) | WO2017132504A1 (https=) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10385424B2 (en) * | 2016-01-29 | 2019-08-20 | Deringer-Ney, Inc. | Palladium-based alloys |
| JP6850365B2 (ja) * | 2017-12-27 | 2021-03-31 | 株式会社徳力本店 | 析出硬化型Ａｇ−Ｐｄ−Ｃｕ−Ｉｎ−Ｂ系合金 |
| JP7141098B2 (ja) * | 2018-10-02 | 2022-09-22 | 石福金属興業株式会社 | プローブピン用材料およびプローブピン |
| JP6734486B2 (ja) * | 2018-11-06 | 2020-08-05 | 株式会社徳力本店 | 電気・電子機器用のＰｄ合金、Ｐｄ合金材、プローブピン及び製造方法 |
| KR20210056542A (ko) | 2019-11-11 | 2021-05-20 | 주식회사 메가터치 | 전자 부품 제조용 금속 자재 제조 방법, 그 금속 자재 및 그 금속 자재를 이용하여 제조된 포고핀 |
| JP7260910B2 (ja) * | 2019-11-22 | 2023-04-19 | 石福金属興業株式会社 | プローブピン用材料およびプローブピン |
| CN110983147B (zh) * | 2019-12-20 | 2021-05-11 | 有研亿金新材料有限公司 | 一种高强度钯基弱电接触材料及其制备方法 |
| KR102235724B1 (ko) | 2020-04-10 | 2021-04-02 | 주식회사 메가터치 | 전자 부품 제조용 금속 자재 제조 방법, 그 금속 자재 및 그 금속 자재를 이용하여 제조된 포고핀 |
| CN112063879B (zh) * | 2020-08-28 | 2022-02-18 | 昆明贵研新材料科技有限公司 | 一种高导电高弹性钯基合金、热处理工艺及用途 |
| EP3960890A1 (de) | 2020-09-01 | 2022-03-02 | Heraeus Deutschland GmbH & Co. KG | Palladium-kupfer-silber-ruthenium-legierung |
| CN112239823A (zh) * | 2020-09-30 | 2021-01-19 | 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） | 一种氢气纯化用钯合金及其制备方法 |
| JP7429011B2 (ja) * | 2020-12-21 | 2024-02-07 | 石福金属興業株式会社 | プローブピン用材料およびプローブピン |
| CN117015625A (zh) * | 2021-03-26 | 2023-11-07 | 石福金属兴业株式会社 | 探测针用合金材料 |
| JP7072126B1 (ja) | 2022-02-10 | 2022-05-19 | 田中貴金属工業株式会社 | Ａｇ－Ｐｄ－Ｃｕ系合金からなるプローブピン用材料 |
| EP4234733A1 (de) * | 2022-02-28 | 2023-08-30 | Heraeus Deutschland GmbH & Co. KG | Palladium-kupfer-silber-legeriung |
| TWI797023B (zh) * | 2022-06-14 | 2023-03-21 | 大亞電線電纜股份有限公司 | 鈀銀銅合金線材及其製法 |
| CN117448716B (zh) * | 2022-07-18 | 2026-04-24 | 中国石油化工股份有限公司 | 钯合金及其制备方法 |
| CN117448618A (zh) * | 2022-07-18 | 2024-01-26 | 中国石油化工股份有限公司 | 钯基合金材料及其制备方法和应用 |
| EP4325227B1 (de) | 2022-08-16 | 2025-10-01 | Heraeus Precious Metals GmbH & Co. KG | Bandförmiger verbundwerkstoff für prüfnadeln |
| CN115679144A (zh) * | 2022-10-26 | 2023-02-03 | 北京工业大学 | 一种氢气分离提纯用钯基多元合金 |
| CN117385209A (zh) * | 2023-06-25 | 2024-01-12 | 江苏苏青电子材料股份有限公司 | 一种钯基六元合金的制备工艺及其应用 |
| CN117026055B (zh) * | 2023-10-09 | 2024-01-12 | 浙江金连接科技股份有限公司 | 一种半导体芯片测试探针用钯合金及其制备方法 |
| CN121737554A (zh) * | 2026-02-26 | 2026-03-27 | 浙江金连接科技股份有限公司 | 高硬度低电阻钯合金线及其制造方法和芯片测试用探针 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1913423A (en) * | 1929-01-28 | 1933-06-13 | Int Nickel Co | Precious metal alloy |
| ZA733409B (en) * | 1972-05-31 | 1974-05-29 | Commw Scient Ind Res Org | A process of manufacturing ion-exchange resins |
| JPS5247516Y2 (https=) | 1972-11-27 | 1977-10-28 | ||
| JPS5247516A (en) | 1975-10-14 | 1977-04-15 | Nippon Telegr & Teleph Corp <Ntt> | Process for producing material for contact compound spring material |
| US4539177A (en) | 1982-07-21 | 1985-09-03 | Jeneric Industries, Inc. | Dental alloys for porcelain-fused-to-metal restorations |
| US5484569A (en) | 1994-08-12 | 1996-01-16 | The J. M. Ney Company | Silver palladium alloy |
| US5833774A (en) | 1997-04-10 | 1998-11-10 | The J. M. Ney Company | High strength silver palladium alloy |
| DE60016292T2 (de) * | 1999-02-02 | 2005-12-01 | Japan As Represented By Director General Of National Research Institute For Meta, Tsukuba | Superlegierung mit hoher Schmelztemperatur und Verfahren zu ihrer Herstellung |
| US6210636B1 (en) | 1999-04-30 | 2001-04-03 | The J. M. Ney Company | Cu-Ni-Zn-Pd alloys |
| WO2005113846A2 (en) | 2004-05-10 | 2005-12-01 | Deringer-Ney, Inc. | Palladium alloy |
| JP5657881B2 (ja) | 2009-12-09 | 2015-01-21 | 株式会社徳力本店 | プローブピン用材料 |
| JP4878401B1 (ja) | 2011-05-17 | 2012-02-15 | 石福金属興業株式会社 | プローブピン用材料、プローブピン及びその製造方法 |
| WO2013099682A1 (ja) | 2011-12-27 | 2013-07-04 | 株式会社徳力本店 | 電気・電子機器用のＰｄ合金 |
| WO2014049874A1 (ja) | 2012-09-28 | 2014-04-03 | 株式会社徳力本店 | 電気・電子機器用途のＡｇ‐Ｐｄ‐Ｃｕ‐Ｃｏ合金 |
| US10385424B2 (en) | 2016-01-29 | 2019-08-20 | Deringer-Ney, Inc. | Palladium-based alloys |
-
2016
- 2016-01-29 US US15/010,690 patent/US10385424B2/en active Active
-
2017
- 2017-01-05 TW TW106100264A patent/TWI707051B/zh active
- 2017-01-05 TW TW109127881A patent/TWI743947B/zh active
- 2017-01-27 WO PCT/US2017/015327 patent/WO2017132504A1/en not_active Ceased
- 2017-01-27 CN CN201780008849.5A patent/CN108699629B/zh active Active
- 2017-01-27 JP JP2018559160A patent/JP7084877B2/ja active Active
- 2017-01-27 DE DE112017000561.2T patent/DE112017000561T5/de active Pending
- 2017-01-27 CN CN202110438876.4A patent/CN113249608A/zh active Pending
- 2017-01-27 KR KR1020187021763A patent/KR102681572B1/ko active Active
-
2019
- 2019-07-11 US US16/509,136 patent/US11041228B2/en active Active
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