JP2019503065A5 - - Google Patents

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Publication number
JP2019503065A5
JP2019503065A5 JP2018502711A JP2018502711A JP2019503065A5 JP 2019503065 A5 JP2019503065 A5 JP 2019503065A5 JP 2018502711 A JP2018502711 A JP 2018502711A JP 2018502711 A JP2018502711 A JP 2018502711A JP 2019503065 A5 JP2019503065 A5 JP 2019503065A5
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JP
Japan
Prior art keywords
pcb
government
expensive
electrical components
pcbs
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JP2018502711A
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English (en)
Japanese (ja)
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JP2019503065A (ja
JP7022055B2 (ja
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Priority claimed from US14/957,426 external-priority patent/US9504148B1/en
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Publication of JP2019503065A publication Critical patent/JP2019503065A/ja
Publication of JP2019503065A5 publication Critical patent/JP2019503065A5/ja
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Publication of JP7022055B2 publication Critical patent/JP7022055B2/ja
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JP2018502711A 2015-12-02 2016-12-01 選択的接着による高速ｐｃｂプロトタイピング Active JP7022055B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/957,426 2015-12-02
US14/957,426 US9504148B1 (en) 2015-12-02 2015-12-02 Rapid PCB prototyping by selective adhesion
PCT/US2016/064398 WO2017096028A1 (en) 2015-12-02 2016-12-01 Rapid pcb prototyping by selective adhesion

Publications (3)

Publication Number Publication Date
JP2019503065A JP2019503065A (ja) 2019-01-31
JP2019503065A5 true JP2019503065A5 (enExample) 2019-03-22
JP7022055B2 JP7022055B2 (ja) 2022-02-17

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ID=57287878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018502711A Active JP7022055B2 (ja) 2015-12-02 2016-12-01 選択的接着による高速ｐｃｂプロトタイピング

Country Status (3)

Country Link
US (3) US9504148B1 (enExample)
JP (1) JP7022055B2 (enExample)
WO (1) WO2017096028A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6087432B2 (ja) * 2012-06-29 2017-03-01 スリーエム イノベイティブ プロパティズ カンパニー フレキシブルプリント回路及びフレキシブルプリント回路の製造方法
CN108987338B (zh) * 2017-05-31 2021-12-03 南京瀚宇彩欣科技有限责任公司 软性电子装置的形成方法
KR102419893B1 (ko) 2018-01-15 2022-07-12 삼성전자주식회사 보호 부재를 가지는 인쇄 회로 기판 및 이를 포함하는 반도체 패키지 제조 방법
CN108962761A (zh) * 2018-06-05 2018-12-07 信利半导体有限公司 一种cof制备方法
WO2020018256A1 (en) * 2018-07-20 2020-01-23 Shenzhen Royole Technologies Co. Ltd. Stretchable electronics and monolithic integration method for fabricating the same
CN108848626B (zh) * 2018-07-27 2020-10-27 江门崇达电路技术有限公司 一种提升线路板胶带贴合对位精度的方法
US11197401B2 (en) 2019-01-22 2021-12-07 Honeywell Federal Manufacturing & Technologies, Llc System and method for large-scale PCB production including continuous selective adhesion
US20200367358A1 (en) * 2019-05-13 2020-11-19 Honeywell Federal Manufacturing & Technologies, Llc Conductive trace interconnection tape
CN114072436B (zh) * 2019-06-24 2023-12-08 凯米拉公司 聚合结构体及其用途
US11439023B2 (en) * 2020-03-12 2022-09-06 Honeywell Federal Manufacturing & Technologies, Llc System for providing dynamic feedback for selective adhesion PCB production
WO2024151697A1 (en) * 2023-01-12 2024-07-18 Jabil Inc. High current printed electronics cable harness connection

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US4254186A (en) 1978-12-20 1981-03-03 International Business Machines Corporation Process for preparing epoxy laminates for additive plating
DE3029521A1 (de) 1980-08-04 1982-03-04 Helmuth 2058 Lauenburg Schmoock Schaltung mit aufgedruckten leiterbahnen und verfahren zu deren herstellung
EP0185998A1 (en) 1984-12-14 1986-07-02 Dynamics Research Corporation Interconnection circuits made from transfer electroforming
US5017255A (en) 1989-01-23 1991-05-21 Clyde D. Calhoun Method of transferring an inorganic image
JP4477767B2 (ja) 2000-03-31 2010-06-09 日東電工株式会社 金属電極パターン形成方法および金属膜剥離除去用接着シート
JP2002151830A (ja) 2000-11-16 2002-05-24 Lintec Corp 金属箔部品の製造方法
JP4779244B2 (ja) 2001-06-28 2011-09-28 Ｔｄｋ株式会社 機能性層パターンの形成方法
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JP5203108B2 (ja) * 2008-09-12 2013-06-05 新光電気工業株式会社 配線基板及びその製造方法
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JP2012210715A (ja) 2011-03-30 2012-11-01 Kimoto & Co Ltd 金属箔の転写方法
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