JP2019503065A5 - - Google Patents

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Publication number
JP2019503065A5
JP2019503065A5 JP2018502711A JP2018502711A JP2019503065A5 JP 2019503065 A5 JP2019503065 A5 JP 2019503065A5 JP 2018502711 A JP2018502711 A JP 2018502711A JP 2018502711 A JP2018502711 A JP 2018502711A JP 2019503065 A5 JP2019503065 A5 JP 2019503065A5
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JP
Japan
Prior art keywords
pcb
government
expensive
electrical components
pcbs
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JP2018502711A
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English (en)
Japanese (ja)
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JP7022055B2 (ja
JP2019503065A (ja
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Priority claimed from US14/957,426 external-priority patent/US9504148B1/en
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Publication of JP2019503065A publication Critical patent/JP2019503065A/ja
Publication of JP2019503065A5 publication Critical patent/JP2019503065A5/ja
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Publication of JP7022055B2 publication Critical patent/JP7022055B2/ja
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JP2018502711A 2015-12-02 2016-12-01 選択的接着による高速ｐｃｂプロトタイピング Active JP7022055B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/957,426 US9504148B1 (en) 2015-12-02 2015-12-02 Rapid PCB prototyping by selective adhesion
US14/957,426 2015-12-02
PCT/US2016/064398 WO2017096028A1 (en) 2015-12-02 2016-12-01 Rapid pcb prototyping by selective adhesion

Publications (3)

Publication Number Publication Date
JP2019503065A JP2019503065A (ja) 2019-01-31
JP2019503065A5 true JP2019503065A5 (enExample) 2019-03-22
JP7022055B2 JP7022055B2 (ja) 2022-02-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018502711A Active JP7022055B2 (ja) 2015-12-02 2016-12-01 選択的接着による高速ｐｃｂプロトタイピング

Country Status (3)

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US (3) US9504148B1 (enExample)
JP (1) JP7022055B2 (enExample)
WO (1) WO2017096028A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104412719B (zh) * 2012-06-29 2018-01-26 3M创新有限公司 柔性印刷电路和制造柔性印刷电路的方法
CN108987338B (zh) * 2017-05-31 2021-12-03 南京瀚宇彩欣科技有限责任公司 软性电子装置的形成方法
KR102419893B1 (ko) 2018-01-15 2022-07-12 삼성전자주식회사 보호 부재를 가지는 인쇄 회로 기판 및 이를 포함하는 반도체 패키지 제조 방법
CN108962761A (zh) * 2018-06-05 2018-12-07 信利半导体有限公司 一种cof制备方法
WO2020018256A1 (en) * 2018-07-20 2020-01-23 Shenzhen Royole Technologies Co. Ltd. Stretchable electronics and monolithic integration method for fabricating the same
CN108848626B (zh) * 2018-07-27 2020-10-27 江门崇达电路技术有限公司 一种提升线路板胶带贴合对位精度的方法
US11197401B2 (en) 2019-01-22 2021-12-07 Honeywell Federal Manufacturing & Technologies, Llc System and method for large-scale PCB production including continuous selective adhesion
US20200367358A1 (en) 2019-05-13 2020-11-19 Honeywell Federal Manufacturing & Technologies, Llc Conductive trace interconnection tape
US20220306510A1 (en) * 2019-06-24 2022-09-29 Kemira Oyj Polymeric structure and its uses
US11439023B2 (en) * 2020-03-12 2022-09-06 Honeywell Federal Manufacturing & Technologies, Llc System for providing dynamic feedback for selective adhesion PCB production
EP4649786A1 (en) * 2023-01-12 2025-11-19 Jabil Inc. High current printed electronics cable harness connection

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EP0185998A1 (en) 1984-12-14 1986-07-02 Dynamics Research Corporation Interconnection circuits made from transfer electroforming
US5017255A (en) 1989-01-23 1991-05-21 Clyde D. Calhoun Method of transferring an inorganic image
JP4477767B2 (ja) 2000-03-31 2010-06-09 日東電工株式会社 金属電極パターン形成方法および金属膜剥離除去用接着シート
JP2002151830A (ja) * 2000-11-16 2002-05-24 Lintec Corp 金属箔部品の製造方法
JP4779244B2 (ja) * 2001-06-28 2011-09-28 Ｔｄｋ株式会社 機能性層パターンの形成方法
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JP5203108B2 (ja) * 2008-09-12 2013-06-05 新光電気工業株式会社 配線基板及びその製造方法
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