JP2019204842A5 - - Google Patents
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- Publication number
- JP2019204842A5 JP2019204842A5 JP2018097828A JP2018097828A JP2019204842A5 JP 2019204842 A5 JP2019204842 A5 JP 2019204842A5 JP 2018097828 A JP2018097828 A JP 2018097828A JP 2018097828 A JP2018097828 A JP 2018097828A JP 2019204842 A5 JP2019204842 A5 JP 2019204842A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- tape
- emitting elements
- glue layer
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003292 glue Substances 0.000 claims 6
- 239000000463 material Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 229920001155 polypropylene Polymers 0.000 claims 1
- 229920000915 polyvinyl chloride Polymers 0.000 claims 1
- 239000004800 polyvinyl chloride Substances 0.000 claims 1
Claims (3)
前記分割工程において、前記第１のテープとして、伸縮性のある基材部と糊層からなり、前記糊層が島状に分割されたものを用い、前記島状に分割された糊層に前記複数の発光素子を貼り付け、
前記第１のテープの前記糊層を島状に分割する方法は、前記糊層をブレードまたはレーザーにより切断するか、または前記基材部の上に印刷法若しくはディスペンス法により島状の糊層を形成することを特徴とする発光素子の製造方法。 By attaching a semiconductor wafer having light emitting elements formed on a substrate to a first tape and dividing the semiconductor wafer into a plurality of light emitting elements, and extending the first tape, the plurality of light emitting elements are formed. An extending step of extending the distance between the respective light emitting elements of the element, and, in a state where the distance between the respective light emitting elements of the plurality of light emitting elements is expanded, the plurality of light emitting elements are separated by the first tape. A method of manufacturing a light emitting device, comprising: a transfer process of transferring the light emitting device to a second tape, and a mounting process of bonding the plurality of light emitting devices to a mounting substrate.
In the dividing step, the first tape is made of an elastic base material and a glue layer, and the glue layer is divided into islands, and the glue layer is divided into islands. Paste multiple light emitting elements ,
The method of dividing the glue layer of the first tape into islands is such that the glue layer is cut with a blade or a laser, or the island-like glue layer is printed or dispensed on the base material portion. method of manufacturing a light-emitting device characterized that you formed.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018097828A JP6791208B2 (en) | 2018-05-22 | 2018-05-22 | Manufacturing method of light emitting element |
| PCT/JP2019/015989 WO2019225206A1 (en) | 2018-05-22 | 2019-04-12 | Method of manufacturing light emitting element |
| TW108113626A TW202004851A (en) | 2018-05-22 | 2019-04-18 | Method of manufacturing light emitting element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018097828A JP6791208B2 (en) | 2018-05-22 | 2018-05-22 | Manufacturing method of light emitting element |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019204842A JP2019204842A (en) | 2019-11-28 |
| JP2019204842A5 true JP2019204842A5 (en) | 2020-04-02 |
| JP6791208B2 JP6791208B2 (en) | 2020-11-25 |
Family
ID=68616390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018097828A Active JP6791208B2 (en) | 2018-05-22 | 2018-05-22 | Manufacturing method of light emitting element |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6791208B2 (en) |
| TW (1) | TW202004851A (en) |
| WO (1) | WO2019225206A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112687767B9 (en) * | 2020-12-01 | 2021-12-03 | 华灿光电(苏州）有限公司 | Chip film expanding method |
| JP2024104823A (en) | 2023-01-25 | 2024-08-06 | 株式会社ナノマテリアル研究所 | Manufacturing method of a display device by transferring a wiring substrate for mounting light emitting elements to a display substrate, and display substrate and display device |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003098977A (en) * | 2001-09-19 | 2003-04-04 | Sony Corp | Method of transferring element, method of arraying element and method of manufacturing image display device |
| JP2003093961A (en) * | 2001-09-21 | 2003-04-02 | Sony Corp | Method for applying liquid, method for packaging element, method for transferring element, method for arraying element, and method for manufacturing image display device |
| JP4120223B2 (en) * | 2002-01-16 | 2008-07-16 | ソニー株式会社 | Electronic component manufacturing method and image display apparatus using the same |
| JP4745073B2 (en) * | 2006-02-03 | 2011-08-10 | シチズン電子株式会社 | Manufacturing method of surface mounted light emitting device |
| JP6013806B2 (en) * | 2012-07-03 | 2016-10-25 | 株式会社ディスコ | Wafer processing method |
| JP6116827B2 (en) * | 2012-08-07 | 2017-04-19 | シャープ株式会社 | Semiconductor device manufacturing method and semiconductor device manufacturing apparatus |
| JP6205897B2 (en) * | 2013-06-27 | 2017-10-04 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
| JP6425435B2 (en) * | 2014-07-01 | 2018-11-21 | 株式会社ディスコ | Tip spacing maintenance device |
| WO2016144732A1 (en) * | 2015-03-06 | 2016-09-15 | Koninklijke Philips N.V. | Method for attaching ceramic phosphor plates on light-emitting device (led) dies using a dicing tape, method to form a dicing tape, and dicing tape |
| JP5888455B1 (en) * | 2015-04-01 | 2016-03-22 | 富士ゼロックス株式会社 | Semiconductor manufacturing apparatus and semiconductor chip manufacturing method |
| JP6573072B2 (en) * | 2015-08-27 | 2019-09-11 | 株式会社村田製作所 | Film expansion apparatus and method of manufacturing electronic component using the same |
| US10032827B2 (en) * | 2016-06-29 | 2018-07-24 | Applied Materials, Inc. | Systems and methods for transfer of micro-devices |
| CN106206397B (en) * | 2016-08-05 | 2020-02-07 | 厦门市三安光电科技有限公司 | Film for semiconductor device and method for manufacturing semiconductor device |
-
2018
- 2018-05-22 JP JP2018097828A patent/JP6791208B2/en active Active
-
2019
- 2019-04-12 WO PCT/JP2019/015989 patent/WO2019225206A1/en active Application Filing
- 2019-04-18 TW TW108113626A patent/TW202004851A/en unknown
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