JP2019192726A5 - - Google Patents

Download PDF

Info

Publication number
JP2019192726A5
JP2019192726A5 JP2018082128A JP2018082128A JP2019192726A5 JP 2019192726 A5 JP2019192726 A5 JP 2019192726A5 JP 2018082128 A JP2018082128 A JP 2018082128A JP 2018082128 A JP2018082128 A JP 2018082128A JP 2019192726 A5 JP2019192726 A5 JP 2019192726A5
Authority
JP
Japan
Prior art keywords
focus ring
organic film
forming
plasma processing
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018082128A
Other languages
English (en)
Japanese (ja)
Other versions
JP6920244B2 (ja
JP2019192726A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2018082128A priority Critical patent/JP6920244B2/ja
Priority claimed from JP2018082128A external-priority patent/JP6920244B2/ja
Priority to TW108113148A priority patent/TWI829684B/zh
Priority to KR1020190045992A priority patent/KR102775986B1/ko
Priority to US16/391,518 priority patent/US10923332B2/en
Publication of JP2019192726A publication Critical patent/JP2019192726A/ja
Publication of JP2019192726A5 publication Critical patent/JP2019192726A5/ja
Application granted granted Critical
Publication of JP6920244B2 publication Critical patent/JP6920244B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2018082128A 2018-04-23 2018-04-23 プラズマ処理方法 Active JP6920244B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018082128A JP6920244B2 (ja) 2018-04-23 2018-04-23 プラズマ処理方法
TW108113148A TWI829684B (zh) 2018-04-23 2019-04-16 電漿處理方法
KR1020190045992A KR102775986B1 (ko) 2018-04-23 2019-04-19 플라즈마 처리 방법
US16/391,518 US10923332B2 (en) 2018-04-23 2019-04-23 Plasma processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018082128A JP6920244B2 (ja) 2018-04-23 2018-04-23 プラズマ処理方法

Publications (3)

Publication Number Publication Date
JP2019192726A JP2019192726A (ja) 2019-10-31
JP2019192726A5 true JP2019192726A5 (enExample) 2021-04-22
JP6920244B2 JP6920244B2 (ja) 2021-08-18

Family

ID=68238111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018082128A Active JP6920244B2 (ja) 2018-04-23 2018-04-23 プラズマ処理方法

Country Status (4)

Country Link
US (1) US10923332B2 (enExample)
JP (1) JP6920244B2 (enExample)
KR (1) KR102775986B1 (enExample)
TW (1) TWI829684B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11127572B2 (en) * 2018-08-07 2021-09-21 Silfex, Inc. L-shaped plasma confinement ring for plasma chambers
CN111243934B (zh) * 2020-03-03 2023-02-03 宁波江丰电子材料股份有限公司 一种环件连接部的翻新方法
CN111863695A (zh) * 2020-07-31 2020-10-30 上海华力微电子有限公司 静电卡盘装置及干法刻蚀机台
JP7492928B2 (ja) * 2021-02-10 2024-05-30 東京エレクトロン株式会社 基板支持器、プラズマ処理システム及びプラズマエッチング方法
JP7752492B2 (ja) * 2021-08-10 2025-10-10 東京エレクトロン株式会社 成膜装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020033183A1 (en) * 1999-05-29 2002-03-21 Sheng Sun Method and apparatus for enhanced chamber cleaning
JP4286025B2 (ja) * 2003-03-03 2009-06-24 川崎マイクロエレクトロニクス株式会社 石英治具の再生方法、再生使用方法および半導体装置の製造方法
JP2006173223A (ja) * 2004-12-14 2006-06-29 Toshiba Corp プラズマエッチング装置およびそれを用いたプラズマエッチング方法
US7674393B2 (en) 2005-03-25 2010-03-09 Tokyo Electron Limited Etching method and apparatus
JP4701776B2 (ja) 2005-03-25 2011-06-15 東京エレクトロン株式会社 エッチング方法及びエッチング装置
US7578258B2 (en) * 2006-03-03 2009-08-25 Lam Research Corporation Methods and apparatus for selective pre-coating of a plasma processing chamber
JP5097632B2 (ja) * 2008-07-11 2012-12-12 株式会社日立ハイテクノロジーズ プラズマエッチング処理装置
JP2011151263A (ja) * 2010-01-22 2011-08-04 Tokyo Electron Ltd エッチング方法、エッチング装置及びリング部材
KR101671671B1 (ko) * 2016-05-25 2016-11-01 주식회사 티씨케이 반도체 제조용 부품의 재생방법과 그 재생장치 및 재생부품
JP2018054500A (ja) * 2016-09-29 2018-04-05 東京エレクトロン株式会社 位置検出システム及び処理装置

Similar Documents

Publication Publication Date Title
JP2019192726A5 (enExample)
JP2017152689A5 (enExample)
WO2018109735A3 (en) Preheating of material in an additive manufacturing apparatus
JP2018166142A5 (enExample)
JP2019505088A5 (enExample)
JP2014011357A5 (enExample)
JP2015154047A5 (enExample)
JP2021506117A5 (enExample)
KR20190132561A (ko) 적응형 열 교환 방법 및 균일한 열 교환을 위한 시스템
JP2016530705A5 (enExample)
RU2014128596A (ru) Автоматическое определение коэффициента регуляризации для итерационного восстановления изображения с регуляризацией и/или шумоподавлением изображения
JP2016092208A5 (enExample)
JP2022527768A (ja) 精密光路を備えた大面積三次元プリンタ
TWI603371B (zh) 調節排氣通路之尺寸之電漿處理裝置
EP3654361A3 (en) Bias correction for lithography
KR20140033420A (ko) 기판을 지지 및 제어하기 위한 장치 및 방법들
EP2665091A3 (en) Equipment for substrate surface treatment
JP2015220369A5 (enExample)
KR102200693B1 (ko) 기판 틸팅이 가능한 얼라이너
JP2020063465A5 (ja) 成膜装置、製造システム、有機elパネルの製造システム、成膜方法、及び有機el素子の製造方法
CN114930514B (zh) 用于热处理系统的自适应控制的控制系统
JP2015029045A5 (enExample)
JP2016032028A5 (enExample)
JP2015198121A5 (enExample)
KR102189266B1 (ko) 박막 형성 장치 및 이를 이용한 박막 형성 방법