JP2019177410A - 加工方法、加工システム、加工プログラム。 - Google Patents

加工方法、加工システム、加工プログラム。 Download PDF

Info

Publication number
JP2019177410A
JP2019177410A JP2018069064A JP2018069064A JP2019177410A JP 2019177410 A JP2019177410 A JP 2019177410A JP 2018069064 A JP2018069064 A JP 2018069064A JP 2018069064 A JP2018069064 A JP 2018069064A JP 2019177410 A JP2019177410 A JP 2019177410A
Authority
JP
Japan
Prior art keywords
irradiation
processing
laser beam
irradiating
irradiated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018069064A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019177410A5 (https=
Inventor
真 吉田
Makoto Yoshida
真 吉田
敏男 前田
Toshio Maeda
敏男 前田
潤 植田
Jun Ueda
潤 植田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DGshape Corp
Original Assignee
DGshape Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DGshape Corp filed Critical DGshape Corp
Priority to JP2018069064A priority Critical patent/JP2019177410A/ja
Priority to EP19166162.8A priority patent/EP3549710B1/en
Publication of JP2019177410A publication Critical patent/JP2019177410A/ja
Publication of JP2019177410A5 publication Critical patent/JP2019177410A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP2018069064A 2018-03-30 2018-03-30 加工方法、加工システム、加工プログラム。 Pending JP2019177410A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018069064A JP2019177410A (ja) 2018-03-30 2018-03-30 加工方法、加工システム、加工プログラム。
EP19166162.8A EP3549710B1 (en) 2018-03-30 2019-03-29 Processing method, processing system, and computer processing program

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018069064A JP2019177410A (ja) 2018-03-30 2018-03-30 加工方法、加工システム、加工プログラム。

Publications (2)

Publication Number Publication Date
JP2019177410A true JP2019177410A (ja) 2019-10-17
JP2019177410A5 JP2019177410A5 (https=) 2021-02-04

Family

ID=66041200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018069064A Pending JP2019177410A (ja) 2018-03-30 2018-03-30 加工方法、加工システム、加工プログラム。

Country Status (2)

Country Link
EP (1) EP3549710B1 (https=)
JP (1) JP2019177410A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112975158A (zh) * 2021-03-04 2021-06-18 武汉华工激光工程有限责任公司 一种透明脆性材料的横向切割方法及系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007167875A (ja) * 2005-12-20 2007-07-05 Seiko Epson Corp レーザ内部スクライブ方法
JP2009023215A (ja) * 2007-07-19 2009-02-05 Panasonic Electric Works Co Ltd 積層体の割断方法
JP2011051011A (ja) * 2009-08-03 2011-03-17 Hamamatsu Photonics Kk レーザ加工方法及び半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10244439A (ja) 1997-03-04 1998-09-14 Roland D G Kk 加工物の切削方法
DE10216590B4 (de) * 2002-04-14 2007-06-14 Paul Dr. Weigl Verfahren zur maschinellen Fertigung von zahnärztlichen Restaurationen aus Keramik
JP4493967B2 (ja) 2003-10-01 2010-06-30 日立ビアメカニクス株式会社 Ｃｏ２レーザ加工方法およびレーザ加工装置
JP6035127B2 (ja) * 2012-11-29 2016-11-30 三星ダイヤモンド工業株式会社 レーザ加工方法及びレーザ加工装置
WO2014121261A1 (en) * 2013-02-04 2014-08-07 Newport Corporation Method and apparatus for laser cutting transparent and semitransparent substrates
JP6466369B2 (ja) * 2016-06-14 2019-02-06 イムラ アメリカ インコーポレイテッド 超短パルスレーザでの透明材料処理

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007167875A (ja) * 2005-12-20 2007-07-05 Seiko Epson Corp レーザ内部スクライブ方法
JP2009023215A (ja) * 2007-07-19 2009-02-05 Panasonic Electric Works Co Ltd 積層体の割断方法
JP2011051011A (ja) * 2009-08-03 2011-03-17 Hamamatsu Photonics Kk レーザ加工方法及び半導体装置の製造方法

Also Published As

Publication number Publication date
EP3549710B1 (en) 2021-04-21
EP3549710A1 (en) 2019-10-09

Similar Documents

Publication Publication Date Title
JP6325646B1 (ja) ロボットを用いてレーザ加工を行うレーザ加工ロボットシステム及びレーザ加工ロボットの制御方法
JP2009208093A (ja) レーザマーキング装置
BR102016001021A2 (pt) método e sistema para usinar a laser uma peça de trabalho
CN102658431B (zh) 一种自动诊断并校正激光光束发散角及光束质量的装置
JP6753835B2 (ja) レーザ加工装置
WO2018084130A1 (ja) 加工方法、加工システム、加工プログラム
US11666991B2 (en) Laser machining apparatus and laser machining method
JP2019177410A (ja) 加工方法、加工システム、加工プログラム。
JP2018183806A (ja) レーザー加工における焦点出し方法
JP2021113133A (ja) 加工方法、加工システム、加工プログラム
JP2019141884A (ja) 加工方法、加工システム、加工プログラム
JP2020006400A (ja) 加工方法、加工システム、加工プログラム。
JP2012196689A (ja) レーザ加工方法及びそのプログラム
JP2020011268A (ja) 照射経路データの作成方法、加工方法、ｃａｍシステム
JPWO2019065533A1 (ja) ガラス基板の切断装置、切断方法、プログラム、及び記憶媒体
CN104084694B (zh) 直头型激光标识设备
JP5245214B2 (ja) レーザ加工装置およびその方法
CN203973059U (zh) 直头型激光标识设备
JP6908438B2 (ja) 印刷装置
JP2018079493A (ja) 加工方法、加工システム、加工プログラム。
JP2020005769A (ja) 加工方法、加工システム、加工プログラム
JP2021122855A (ja) 加工方法、加工システム、加工プログラム
JP2005313204A (ja) レーザ孔形成装置、レーザ加工装置及びレーザ孔形成方法
WO2019039034A1 (ja) レーザー加工方法、加工物、加工材料
JP2008012538A5 (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20201217

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20201217

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20201217

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20210212

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210309

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20210928