JP2019121641A5 - - Google Patents

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Publication number
JP2019121641A5
JP2019121641A5 JP2017253993A JP2017253993A JP2019121641A5 JP 2019121641 A5 JP2019121641 A5 JP 2019121641A5 JP 2017253993 A JP2017253993 A JP 2017253993A JP 2017253993 A JP2017253993 A JP 2017253993A JP 2019121641 A5 JP2019121641 A5 JP 2019121641A5
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JP
Japan
Prior art keywords
carbon atoms
silicon oxide
oxide film
less carbon
different
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Application number
JP2017253993A
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English (en)
Japanese (ja)
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JP6837958B2 (ja
JP2019121641A (ja
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Priority claimed from JP2017253993A external-priority patent/JP6837958B2/ja
Priority to JP2017253993A priority Critical patent/JP6837958B2/ja
Priority to KR1020207017358A priority patent/KR102701367B1/ko
Priority to CN201880083779.4A priority patent/CN111511870B/zh
Priority to US16/958,640 priority patent/US11795346B2/en
Priority to SG11202005634VA priority patent/SG11202005634VA/en
Priority to PCT/JP2018/047344 priority patent/WO2019131545A1/ja
Priority to TW107147620A priority patent/TWI810232B/zh
Publication of JP2019121641A publication Critical patent/JP2019121641A/ja
Publication of JP2019121641A5 publication Critical patent/JP2019121641A5/ja
Priority to JP2021019577A priority patent/JP7133667B2/ja
Publication of JP6837958B2 publication Critical patent/JP6837958B2/ja
Application granted granted Critical
Active legal-status Critical Current
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JP2017253993A 2017-12-28 2017-12-28 酸化珪素膜用研磨液組成物 Active JP6837958B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2017253993A JP6837958B2 (ja) 2017-12-28 2017-12-28 酸化珪素膜用研磨液組成物
KR1020207017358A KR102701367B1 (ko) 2017-12-28 2018-12-21 산화규소막용 연마액 조성물
CN201880083779.4A CN111511870B (zh) 2017-12-28 2018-12-21 氧化硅膜用研磨液组合物
US16/958,640 US11795346B2 (en) 2017-12-28 2018-12-21 Polishing liquid composition for silicon oxide film
SG11202005634VA SG11202005634VA (en) 2017-12-28 2018-12-21 Polishing liquid composition for silicon oxide film
PCT/JP2018/047344 WO2019131545A1 (ja) 2017-12-28 2018-12-21 酸化珪素膜用研磨液組成物
TW107147620A TWI810232B (zh) 2017-12-28 2018-12-28 氧化矽膜用研磨液組合物
JP2021019577A JP7133667B2 (ja) 2017-12-28 2021-02-10 酸化珪素膜用研磨液組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017253993A JP6837958B2 (ja) 2017-12-28 2017-12-28 酸化珪素膜用研磨液組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021019577A Division JP7133667B2 (ja) 2017-12-28 2021-02-10 酸化珪素膜用研磨液組成物

Publications (3)

Publication Number Publication Date
JP2019121641A JP2019121641A (ja) 2019-07-22
JP2019121641A5 true JP2019121641A5 (enExample) 2021-01-14
JP6837958B2 JP6837958B2 (ja) 2021-03-03

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ID=67066422

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017253993A Active JP6837958B2 (ja) 2017-12-28 2017-12-28 酸化珪素膜用研磨液組成物
JP2021019577A Active JP7133667B2 (ja) 2017-12-28 2021-02-10 酸化珪素膜用研磨液組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021019577A Active JP7133667B2 (ja) 2017-12-28 2021-02-10 酸化珪素膜用研磨液組成物

Country Status (7)

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US (1) US11795346B2 (enExample)
JP (2) JP6837958B2 (enExample)
KR (1) KR102701367B1 (enExample)
CN (1) CN111511870B (enExample)
SG (1) SG11202005634VA (enExample)
TW (1) TWI810232B (enExample)
WO (1) WO2019131545A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7252073B2 (ja) * 2019-06-26 2023-04-04 花王株式会社 酸化珪素膜用研磨液組成物
JP7550771B2 (ja) * 2019-09-10 2024-09-13 株式会社フジミインコーポレーテッド 研磨用組成物
JP7464432B2 (ja) * 2019-11-13 2024-04-09 花王株式会社 半導体デバイス用基板に用いる洗浄剤組成物
CN113496868B (zh) * 2020-04-03 2023-03-10 重庆超硅半导体有限公司 一种硅片的抛光后清洗方法
JP7425660B2 (ja) * 2020-04-07 2024-01-31 花王株式会社 酸化珪素膜用研磨液組成物
WO2022102019A1 (ja) * 2020-11-11 2022-05-19 昭和電工マテリアルズ株式会社 研磨液及び研磨方法
CN116507688A (zh) * 2020-11-27 2023-07-28 花王株式会社 氧化硅膜用研磨液组合物

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000109810A (ja) 1998-10-08 2000-04-18 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
JP2003158101A (ja) 2001-11-20 2003-05-30 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び製造方法
JP2004297035A (ja) 2003-03-13 2004-10-21 Hitachi Chem Co Ltd 研磨剤、研磨方法及び電子部品の製造方法
WO2006009160A1 (ja) * 2004-07-23 2006-01-26 Hitachi Chemical Co., Ltd. Ｃｍｐ研磨剤及び基板の研磨方法
US7435356B2 (en) 2004-11-24 2008-10-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Abrasive-free chemical mechanical polishing compositions and methods relating thereto
JP2007103485A (ja) * 2005-09-30 2007-04-19 Fujifilm Corp 研磨方法及びそれに用いる研磨液
CN101375376B (zh) * 2006-01-31 2012-09-19 日立化成工业株式会社 绝缘膜研磨用cmp研磨剂、研磨方法、通过该研磨方法研磨的半导体电子部件
US7732393B2 (en) 2006-03-20 2010-06-08 Cabot Microelectronics Corporation Oxidation-stabilized CMP compositions and methods
WO2007146680A1 (en) * 2006-06-06 2007-12-21 Florida State University Research Foundation , Inc. Stabilized silica colloid
US20090215266A1 (en) 2008-02-22 2009-08-27 Thomas Terence M Polishing Copper-Containing patterned wafers
JP2009260236A (ja) * 2008-03-18 2009-11-05 Hitachi Chem Co Ltd 研磨剤、これを用いた基板の研磨方法並びにこの研磨方法に用いる溶液及びスラリー
KR101678114B1 (ko) 2008-09-26 2016-11-21 로디아 오퍼레이션스 화학적 기계적 폴리싱용 연마제 조성물 및 그의 이용 방법
JP2010272733A (ja) * 2009-05-22 2010-12-02 Hitachi Chem Co Ltd 研磨剤及びこの研磨剤を用いた基板の研磨方法
JP6350861B2 (ja) 2014-07-15 2018-07-04 スピードファム株式会社 コロイダルシリカ及びそれを含有する半導体ウエハ研磨用組成物
JP6655354B2 (ja) * 2014-12-26 2020-02-26 花王株式会社 シリコンウェーハ用研磨液組成物、又はシリコンウェーハ用研磨液組成物キット
US20180265372A1 (en) * 2015-09-30 2018-09-20 Nippon Shokubai Co., Ltd. Zirconium oxide nanoparticles
JP6815092B2 (ja) * 2016-04-12 2021-01-20 花王株式会社 表面処理剤

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