JP2019121641A5 - - Google Patents
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- JP2019121641A5 JP2019121641A5 JP2017253993A JP2017253993A JP2019121641A5 JP 2019121641 A5 JP2019121641 A5 JP 2019121641A5 JP 2017253993 A JP2017253993 A JP 2017253993A JP 2017253993 A JP2017253993 A JP 2017253993A JP 2019121641 A5 JP2019121641 A5 JP 2019121641A5
- Authority
- JP
- Japan
- Prior art keywords
- carbon atoms
- silicon oxide
- oxide film
- less carbon
- different
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017253993A JP6837958B2 (ja) | 2017-12-28 | 2017-12-28 | 酸化珪素膜用研磨液組成物 |
| KR1020207017358A KR102701367B1 (ko) | 2017-12-28 | 2018-12-21 | 산화규소막용 연마액 조성물 |
| PCT/JP2018/047344 WO2019131545A1 (ja) | 2017-12-28 | 2018-12-21 | 酸化珪素膜用研磨液組成物 |
| SG11202005634VA SG11202005634VA (en) | 2017-12-28 | 2018-12-21 | Polishing liquid composition for silicon oxide film |
| CN201880083779.4A CN111511870B (zh) | 2017-12-28 | 2018-12-21 | 氧化硅膜用研磨液组合物 |
| US16/958,640 US11795346B2 (en) | 2017-12-28 | 2018-12-21 | Polishing liquid composition for silicon oxide film |
| TW107147620A TWI810232B (zh) | 2017-12-28 | 2018-12-28 | 氧化矽膜用研磨液組合物 |
| JP2021019577A JP7133667B2 (ja) | 2017-12-28 | 2021-02-10 | 酸化珪素膜用研磨液組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017253993A JP6837958B2 (ja) | 2017-12-28 | 2017-12-28 | 酸化珪素膜用研磨液組成物 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021019577A Division JP7133667B2 (ja) | 2017-12-28 | 2021-02-10 | 酸化珪素膜用研磨液組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019121641A JP2019121641A (ja) | 2019-07-22 |
| JP2019121641A5 true JP2019121641A5 (enExample) | 2021-01-14 |
| JP6837958B2 JP6837958B2 (ja) | 2021-03-03 |
Family
ID=67066422
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017253993A Active JP6837958B2 (ja) | 2017-12-28 | 2017-12-28 | 酸化珪素膜用研磨液組成物 |
| JP2021019577A Active JP7133667B2 (ja) | 2017-12-28 | 2021-02-10 | 酸化珪素膜用研磨液組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021019577A Active JP7133667B2 (ja) | 2017-12-28 | 2021-02-10 | 酸化珪素膜用研磨液組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11795346B2 (enExample) |
| JP (2) | JP6837958B2 (enExample) |
| KR (1) | KR102701367B1 (enExample) |
| CN (1) | CN111511870B (enExample) |
| SG (1) | SG11202005634VA (enExample) |
| TW (1) | TWI810232B (enExample) |
| WO (1) | WO2019131545A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7252073B2 (ja) * | 2019-06-26 | 2023-04-04 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
| JP7550771B2 (ja) * | 2019-09-10 | 2024-09-13 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP7464432B2 (ja) * | 2019-11-13 | 2024-04-09 | 花王株式会社 | 半導体デバイス用基板に用いる洗浄剤組成物 |
| CN113496868B (zh) * | 2020-04-03 | 2023-03-10 | 重庆超硅半导体有限公司 | 一种硅片的抛光后清洗方法 |
| JP7425660B2 (ja) * | 2020-04-07 | 2024-01-31 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
| KR102783394B1 (ko) * | 2020-11-11 | 2025-03-17 | 가부시끼가이샤 레조낙 | 연마액 및 연마 방법 |
| CN116507688A (zh) * | 2020-11-27 | 2023-07-28 | 花王株式会社 | 氧化硅膜用研磨液组合物 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000109810A (ja) | 1998-10-08 | 2000-04-18 | Hitachi Chem Co Ltd | Ｃｍｐ研磨剤及び基板の研磨方法 |
| JP2003158101A (ja) | 2001-11-20 | 2003-05-30 | Hitachi Chem Co Ltd | Ｃｍｐ研磨剤及び製造方法 |
| JP2004297035A (ja) | 2003-03-13 | 2004-10-21 | Hitachi Chem Co Ltd | 研磨剤、研磨方法及び電子部品の製造方法 |
| EP1796152B1 (en) | 2004-07-23 | 2019-02-27 | Hitachi Chemical Company, Ltd. | Cmp polishing agent and method for polishing substrate |
| US7435356B2 (en) | 2004-11-24 | 2008-10-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Abrasive-free chemical mechanical polishing compositions and methods relating thereto |
| JP2007103485A (ja) * | 2005-09-30 | 2007-04-19 | Fujifilm Corp | 研磨方法及びそれに用いる研磨液 |
| TW201231580A (en) * | 2006-01-31 | 2012-08-01 | Hitachi Chemical Co Ltd | CMP abrasive for polishing insulating film, polishing method and semiconductor electronic parts polished by the polishing method |
| US7732393B2 (en) | 2006-03-20 | 2010-06-08 | Cabot Microelectronics Corporation | Oxidation-stabilized CMP compositions and methods |
| WO2007146680A1 (en) * | 2006-06-06 | 2007-12-21 | Florida State University Research Foundation , Inc. | Stabilized silica colloid |
| US20090215266A1 (en) | 2008-02-22 | 2009-08-27 | Thomas Terence M | Polishing Copper-Containing patterned wafers |
| JP2009260236A (ja) | 2008-03-18 | 2009-11-05 | Hitachi Chem Co Ltd | 研磨剤、これを用いた基板の研磨方法並びにこの研磨方法に用いる溶液及びスラリー |
| JP5632378B2 (ja) | 2008-09-26 | 2014-11-26 | ロディア オペレーションズＲｈｏｄｉａ Ｏｐｅｒａｔｉｏｎｓ | 化学機械研磨用研磨剤組成物及びその使用法 |
| JP2010272733A (ja) * | 2009-05-22 | 2010-12-02 | Hitachi Chem Co Ltd | 研磨剤及びこの研磨剤を用いた基板の研磨方法 |
| JP6350861B2 (ja) | 2014-07-15 | 2018-07-04 | スピードファム株式会社 | コロイダルシリカ及びそれを含有する半導体ウエハ研磨用組成物 |
| JP6655354B2 (ja) * | 2014-12-26 | 2020-02-26 | 花王株式会社 | シリコンウェーハ用研磨液組成物、又はシリコンウェーハ用研磨液組成物キット |
| US20180265372A1 (en) * | 2015-09-30 | 2018-09-20 | Nippon Shokubai Co., Ltd. | Zirconium oxide nanoparticles |
| JP6815092B2 (ja) * | 2016-04-12 | 2021-01-20 | 花王株式会社 | 表面処理剤 |
-
2017
- 2017-12-28 JP JP2017253993A patent/JP6837958B2/ja active Active
-
2018
- 2018-12-21 US US16/958,640 patent/US11795346B2/en active Active
- 2018-12-21 KR KR1020207017358A patent/KR102701367B1/ko active Active
- 2018-12-21 WO PCT/JP2018/047344 patent/WO2019131545A1/ja not_active Ceased
- 2018-12-21 SG SG11202005634VA patent/SG11202005634VA/en unknown
- 2018-12-21 CN CN201880083779.4A patent/CN111511870B/zh active Active
- 2018-12-28 TW TW107147620A patent/TWI810232B/zh active
-
2021
- 2021-02-10 JP JP2021019577A patent/JP7133667B2/ja active Active
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