JP2019116647A - Substrate holder and film deposition apparatus - Google Patents

Abstract

To provide a substrate holder that can hold a substrate while suppressing occurrence of breakage in the substrate.SOLUTION: A substrate holder 30 for holding a substrate 2 while exposing a treatment region 21a of the substrate 2 includes: holding parts 310, 320 for holding both sides 21, 22 of the substrate 2 in non-contact with a corner part 24 of the substrate 2; an abutment part 330 abutting on an end face 23 of the substrate 2 in non-contact with the corner part 24 of the substrate 2.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate holder and a film forming apparatus.

  In a film formation process of a substrate used for a semiconductor device, there is a method of supporting the substrate in a vertically standing state (in which the surface to be treated is vertical) and transporting between chambers in the film formation apparatus. The substrate is held by the substrate holder in a state where the surface to be treated is opened (exposed) to the outside, and is further moved between the respective chambers by the transfer means for supporting the substrate holder (Patent Document 1). As a structure of a board | substrate holder, the structure which fixes and holds a board | substrate is mentioned as an example by pinching a board | substrate with two upper and lower frames, and fastening a frame with fasteners, such as a screw.

International Publication WO 2016/017602

  FIG. 8 is a schematic cross-sectional view (cut end view) showing the configuration of a substrate holder according to a conventional example. As shown in FIG. 8, the substrate holder 130 has an opening for exposing the processing region of the substrate 2, and the first frame 131 is in contact with the first surface 21 including the processing region of the substrate 2, and the substrate The second frame 132 is in contact with the second surface 22 of the second frame 132, and is fastened with a screw 34. As shown in part C of FIG. 8, the corner 24 of the substrate 2 (the boundary between the first surface 21 and the substrate-side end surface 23 and the boundary between the second surface 22 and the substrate-side end surface 23) is The first frame 131 and the second frame 132 are in contact with each other. Therefore, chipping (deterioration of the corners to generate chips (debris)) is generated at the corner portions 24 due to a force due to tightening, deformation due to thermal expansion at the time of heating, or the like. The corner portion 24 of the substrate 2 is a portion where burrs are generated during substrate manufacture, and the inside of the device is contaminated by chipping the burrs to generate chips. Moreover, even if chipping is small at first, the chipping tends to widen the damage range in the subsequent steps, and once it occurs, it has a great impact on productivity. Although there is chamfering of a substrate as a conventional example of a countermeasure, there exists a subject that the cost of a substrate goes up.

  An object of the present invention is to provide a substrate holder capable of holding a substrate in which the occurrence of breakage of the substrate is suppressed.

In order to achieve the above object, the substrate holder of the present invention is
A substrate holder for holding a substrate by exposing a processing region of the substrate, the substrate holder comprising:
A sandwiching portion that sandwiches both sides of the substrate without contacting the corner of the substrate;
A non-contacting portion at a corner of the substrate, and an abutting portion which abuts on an end surface of the substrate;
And the like.
In order to achieve the above object, the film forming apparatus of the present invention is
A film forming apparatus for forming a film on a substrate, wherein
A plurality of chambers including a deposition chamber,
A substrate transfer unit for supporting the substrate holder and moving between the plurality of chambers;
And the like.

  According to the present invention, the substrate can be held with the occurrence of breakage of the substrate suppressed.

Typical cross-sectional view of the substrate holder according to the embodiment of the present invention (cutting end face view) Typical perspective exploded view of a substrate holder according to an embodiment of the present invention Typical cross-sectional view of the substrate holder according to the embodiment of the present invention (cutting end face view) A schematic plan view of a second frame of a substrate holder according to an embodiment of the present invention Typical cross-sectional view of a substrate holder according to a modification of the embodiment of the present invention (cut end view) Typical cross-sectional view of a substrate holder according to a modification of the embodiment of the present invention (cut end view) Typical top view of the 2nd frame of the substrate holder concerning Example 2 of the present invention Typical cross-sectional view of a substrate holder according to the prior art (cut end view) Schematic of sputtering apparatus in the embodiment of the present invention Schematic of the film-forming apparatus based on the Example of this invention Example of flow chart of film forming process

  Hereinafter, with reference to the drawings, modes for carrying out the present invention will be exemplarily described in detail based on examples. However, the dimensions, materials, shapes, etc. of the components described in this embodiment should be changed as appropriate depending on the configuration of the apparatus to which the invention is applied and various conditions. That is, the scope of the present invention is not intended to be limited to the following embodiments.

Example 1
<Overall configuration of film forming apparatus>
FIG. 10 is a schematic view schematically showing an entire configuration of a film forming apparatus 1 according to an embodiment of the present invention. The film forming apparatus 1 includes a stocker chamber 11 in which a substrate 2 to be film-formed is accommodated, a heating chamber 12 which heats the substrate 2, and a film-forming chamber 13 which forms a film on the processing target surface of the substrate 2. And. In the film forming chamber 13, a film forming process is performed on the surface to be processed of the substrate 2 and a substrate processing apparatus 14 for performing pretreatment and etching such as cleaning of the surface to be processed of the substrate 2 prior to the film forming process. And a sputtering apparatus 15 as a film forming unit. The film forming apparatus 1 of the present embodiment is configured to transport between the respective chambers in a state in which the substrate 2 is vertically stood (in which the surface to be treated is vertical) (see FIG. 9).

  FIG. 11 is an example of a flowchart of the film forming process in the present embodiment. The substrate 2 is sequentially transported from the stocker chamber 11 to the heating chamber 12 (S101), from the heating chamber 12 to the substrate processing apparatus 14 of the film forming chamber 13 (S103), and from the substrate processing apparatus 14 to the sputtering apparatus 15 (S105). The film forming process is performed. After the substrate 2 is heat-treated by the heater 121 in the heating chamber 12 (S102), first, the surface treatment of the film forming chamber 13 by the substrate processing apparatus 14 is performed (S104). Next, the substrate 2 subjected to the surface treatment is subjected to a sputtering process using targets 151, 152 and 153 made of various different materials by the sputtering apparatus 15 (S106), and the film forming process is completed. The flow of the film-forming process shown here is an example to the last, and it is not limited to the process content shown here.

The film-forming apparatus 1 which concerns on a present Example is applicable to the various electrode formation accompanied by pre-processing, for example. Specific examples thereof include, for example, deposition of a plating seed film for an FC-BGA (Flip-Chip Ball Grid Array) mounting substrate and a metal laminated film for a SAW (Surface Acoustic Wave) device. In addition, a conductive hard film in the bonding portion of the LED, a film formation of a terminal portion film of MLCC (Multi-Layered Ceramic Capacitor), and the like can also be mentioned. In addition, it is applicable also to film-forming of the electromagnetic shielding film in an electronic component package, and the terminal part film of a chip resistor. The size of the processing substrate 2 may be, for example, 200 mm × 200 mm in height and width and 0.7 to 6.0 mm in thickness. The material of the substrate 2 is glass, alumina, ceramic, LTCC (Low
Temperature Co-fired Ceramics: low temperature co-fired ceramics) and the like.

<Substrate transfer configuration and sputtering apparatus>
As described above, the substrate 2 is transported between the chambers of the film forming apparatus 1 in a vertically standing state, and the processing surface 21 is vertical also in the sputtering chamber 51 (chamber) (processing surface 21) Is oriented horizontally). As shown in FIG. 9, the substrate holder 30 holds and holds the peripheral edge of the outer periphery of the processing area in a state where the processing surface 21 is opened (exposed) by the substrate holder 30. The substrate holder 30 holding the substrate 2 is supported by the substrate holder support 43. The substrate holder support portion 43 is provided with a wheel 431 as a substrate transfer means at the lower side, and configured to be movable on the rails 432 laid on the bottom surface of the sputtering chamber 51 in the sputtering chamber 51 with the substrate holder 30 supported. It is done. The term "perpendicular" as used herein means being perpendicular to the bottom surface of the sputtering chamber 51 or the upper surface of the rail 432 (substrate transfer surface), and may not coincide with the gravity direction (vertical direction) depending on the apparatus configuration. . Similarly, the horizontal direction referred to here may not coincide with the direction orthogonal to the gravity direction. That is, in the present embodiment, assuming that the installation surface of the substrate holder support 43 on the inner wall of each chamber is a horizontal plane, the description is made to define the directions of the upper, lower, right and left. Needless to say, the left-right direction also changes accordingly.

The sputtering chamber 51 of the sputtering device 15 is in a state of being evacuated to a predetermined high vacuum pressure in advance by the exhaust device 56. The substrate holder 30 moves in the sputtering chamber 51 at a constant speed, and in the meantime, the film forming process by the cathode unit 50 is performed on the substrate 2. In the sputtering chamber 51, the substrate 2 (substrate holder 30) and the cathode unit 50 are arranged to face each other in the horizontal direction. The sputtering chamber 51 is adjusted to a degree of vacuum (for example, 2 × 10 Pa to 2 × 10 ⁻⁵ Pa) suitable for the sputtering process by the exhaust device 56, and the flow rate of the sputtering gas is controlled from the gas supply source 57. Supplied. Thus, a sputtering atmosphere is formed inside the sputtering chamber 51. As a sputtering gas, for example, a rare gas such as Ar, Kr, or Xe or a reactive gas for film formation is used.

  The target 151 which is a plate-like film forming material is disposed parallel to the transport path of the substrate 2, that is, the processing surface 21 of the substrate 2. A cathode electrode 251 is provided in close contact with the side of the target 151 opposite to the side facing the substrate 2. A power source 55 is connected to the cathode electrode 251, and the sputtering chamber 51 is grounded. In voltage application by the power source 55, the cathode electrode 251 is a cathode, and the wall of the sputtering chamber 51 is an anode.

<Sputtering>
By the formation of the sputtering atmosphere described above and the application of a voltage from the power source 55 to the cathode electrode 251, a plasma region is generated in the vicinity of the facing surface of the target 151 with the substrate 2. Target particles are emitted from the surface of the target 151 facing the substrate 2 due to the collision of sputtering gas ions generated by the generation of the plasma region and the target 151. The target particles released from the target 151 fly toward the substrate 2 and are deposited, whereby a film is formed on the surface 21 to be processed of the substrate 2. The targets 152 and 153 are also different in material from the target 151, and the film formation processing mechanism by sputtering is the same.

<Configuration of Substrate Holder 30 (Features of this Embodiment)>
The configuration of the substrate holder 30, which is a feature of the present embodiment, will be described with reference to FIGS.
FIG. 1 is a schematic partial cross-sectional view (cut end view) of a substrate holder according to an embodiment of the present invention. FIG. 2 is a schematic perspective exploded view of a substrate holder according to an embodiment of the present invention. FIG. 3 is a schematic cross-sectional view (cutaway end view) of the substrate holder according to the embodiment of the present invention, and is a view for explaining how the substrate 2 is attached to the substrate holder 30. FIG. 4 is a schematic plan view of a second frame of the substrate holder according to the embodiment of the present invention.

  As described above, the substrate holder 30 exposes the processing region of the substrate 2 to hold the substrate 2 and is roughly the substrate pressing member 31 which is the first frame and the second frame. The substrate 2 is held by sandwiching the both surfaces of the substrate 2 with the substrate holder body 32. The to-be-processed surface 21 which is one surface (first surface) of the substrate 2 is composed of the to-be-processed region 21a to be subjected to the film forming process described above and the peripheral region 21b surrounding the outside (outer periphery) thereof. Be done.

  The substrate retainer 31 is inside the substrate end in the peripheral region 21b of the processing surface 21 of the substrate 2, that is, inside the corner 24 (substrate end) of the boundary between the processing surface 21 and the side end surface 23 of the substrate 2. In the position, the contact surface (first contact portion) 310 that contacts the processing surface 21 is provided. It is suitably set in the range which can suppress generation | occurrence | production of a chipping about how much the contact surface 310 is made to contact | abut to the peripheral region 21b of the to-be-processed surface 21 inside inside rather than the corner 24. The contact surface 310 is a tip end surface of the convex portion 311 which protrudes in the direction opposite to the substrate holder main body 32 in the substrate press 31. The convex portion 311 is formed in a substantially rectangular annular shape at a portion facing the substrate holder main body 32 of the substrate retainer 31. A groove (concave portion) for forming a gap that makes the substrate retainer 31 not contact the corner 24 of the substrate 2 outside the convex portion 311 in the portion of the substrate retainer 31 facing the substrate holder body 32 313 are formed. Further, on the inner side of the convex portion 311 in the facing portion of the substrate holder 31 to the substrate holder main body 32, an opening 312 for exposing (exposed) the processing surface 21 of the substrate 2 to the outside is formed. The substrate retainer 31 is a frame-like member surrounding the periphery of the processing area 21 a of the substrate 2.

  The substrate holder main body 32 is the other surface (second surface) of the substrate 2 and is a corner 24 of the boundary between the back surface 22 and the side end surface 23 of the substrate 2 on the back surface 22 opposite to the treated surface 21. At an inner position, a contact surface (second contact portion) 320 that contacts the back surface 22 is provided. It is suitably set in the range which can suppress generation | occurrence | production of a chipping about how much the contact surface 320 is made to contact | abut the back surface 22 inside rather than the corner | angular part 24. FIG. The contact surface 320 is a tip end surface of the convex portion 321 that protrudes in the direction opposite to the substrate retainer 31 in the substrate holder main body 32. The convex portion 321 is formed in a substantially rectangular annular shape at a portion of the substrate holder main body 32 facing the substrate retainer 31. A groove (a recessed portion for forming a gap that makes the substrate holder main body 32 not to be in contact with the corner 24 of the substrate 2 on the outer side than the convex portion 321 in the facing portion of the substrate holder main body 32 with the substrate presser 31 ) 323 are formed. Further, on the inner side of the convex portion 321 in the portion of the substrate holder main body 32 facing the substrate presser 31, a recessed portion 322 is formed facing the back surface 22 of the substrate 2 with a gap therebetween. Note that, instead of the concave portion 322, an opening may be provided as in the case of the opening 312 of the substrate retainer 31. That is, the back surface 22 of the substrate 2 may be opened to the outside.

Positioning pins 33, which are abutment members for positioning the substrate 2 relative to the substrate holder body 32, are fixed to the substrate holder body 32 by screws 35. The positioning pin 33 has a tip shape in which the width in the direction perpendicular to the substrate 2 gradually narrows toward the side end surface 23 of the substrate 2, and the tip surface 330 serves as a butting portion. Abuts on 23. Here, the direction perpendicular to the substrate 2 is synonymous with the thickness direction of the substrate 2, the opposing direction of the substrate holder 31 and the substrate holder main body 32, the Z-axis direction in FIG. The width in the direction perpendicular to the substrate 2 of the front end surface 330 of the positioning pin 33 is smaller than the thickness of the substrate 2 and is a position that avoids contact with the corner 24, in this embodiment the side end face in the center in the above direction. Abuts on 22. The position where the tip end surface 330 abuts on the side end surface 22 may not be the above-mentioned central portion as long as the occurrence of chipping can be suppressed.

  The substrate holding member 31 and the substrate holder main body 32 are fastened and fixed to each other by the screw 34 as fastening means in a state where the positioning pin 33 abuts against the end surface 23 of the substrate 2 and the contact surfaces 310 and 320 sandwich the substrate 2. . The substrate holder 31 and the substrate holder main body 32 are tightened at a plurality of locations by a plurality of screws 34. In this embodiment, the clamping force per screw 34 is 5 to 40 cN / m. The screw holes 314 of the substrate retainer 31 and the screw holes 324 of the substrate holder main body 32 are provided outside the abutting positions of the positioning pins 33 and the substrate 2 with respect to the substrate 2. Due to the fastening of the screw 34, the contact surfaces 310 and 320 form a sandwiching part that sandwiches both sides of the substrate 2 without contacting the corner 24 of the substrate 2. Although the substrate holder 31, the substrate holder body 32, and the positioning pin 33 are manufactured using SUS in this embodiment, other metals may be used as long as they have a certain degree of hardness. Further, as long as a desired positioning and holding function can be obtained, other materials may be adopted as appropriate.

  The contact surface 310 of the substrate holder 31 and the contact surface 320 of the substrate holder main body 32 are in contact with both surfaces of the substrate 2 inside the corner 24 of the substrate 2 and not in contact with the corner 24. Thus, the force acting on the corner 24 in the thickness direction (Z direction) of the substrate 2 can be relaxed. Further, the positioning pin 33 is also in contact with the end face 23 of the substrate 2 inside the corner 24 of the substrate 2 and in non-contact with the corner 24, whereby the width of the substrate 2 with respect to the corner 24 The force acting in the direction (direction parallel to the surfaces 21 and 22 of the substrate 2, XY direction) can be relaxed. As described above, since the substrate holder 30 does not have a portion in contact with the corner portion 24 of the substrate 2, generation of chipping can be suppressed in the substrate 2 which is not chamfered. That is, according to the present embodiment, it is possible to hold the substrate with the occurrence of breakage of the substrate suppressed.

<Assembly of Substrate 2 to Substrate Holder 30>
As shown in FIG. 3, in assembling the substrate 2 to the substrate holder 30, first, the substrate 2 is placed on a predetermined substrate storage portion in the substrate holder main body 32. It is placed on the contact surface 320 (FIG. 3A). At this time, the substrate 2 is positioned with respect to the substrate holder main body 32 by abutting the side end surface 23 of the substrate 2 against the end surface 330 of the positioning pin 33 while placing the back surface 22 of the substrate 2 on the contact surface 320. It can be done (FIG. 3 (B)). The substrate holder 32 on which the substrate 2 is positioned is covered with the frame-like substrate retainer 31 so as to cover the outer peripheral edge (peripheral region 21 b) of the substrate 2 and the substrate 2 is sandwiched between the contact surfaces 310 and 320. Do. Then, the substrate 2, the substrate retainer 31 and the substrate holder main body 32 are integrally fixed by fastening them with the screws 34 (FIG. 3 (C)).

<Arrangement of Positioning Pin 33>
As shown in FIG. 4, a plurality of positioning pins 33 are provided. The plurality of positioning pins 33 are disposed so as to abut only one of two sides of the substrate 2 facing each other. That is, the positioning pin 33 is made to abut on only one of the two sides, and the force in the direction along the substrate 2 does not act on the other side from the substrate holder 30. That is, the plurality of positioning pins 33 are not arranged to face each other in the butting direction. By setting the position on the side opposite to the portion where the positioning pin 33 in the substrate 2 abuts on the substrate 2 in the direction along the substrate 2, the dimensional change in the substrate 2 or the substrate holder 30 due to dimensional error or thermal expansion etc. To position the substrate 2.

In addition, the plurality of positioning pins 33 are disposed at a position that abuts on the end face 23 on one of two sides not facing each other among the four sides of the substrate 2 and a position to abut on the end face 23 on the other side. Ru. That is, by performing positioning in two directions in the direction along the substrate 2, the substrate 2 can be accurately positioned relative to the substrate holder 30. Further, by arranging the plurality of positioning pins 33 so as to abut on one of four sides of the substrate 2 at different positions, positioning with higher accuracy can be performed. Further, by setting the side of the substrate 2 against which the positioning pin 33 abuts is the side of the lower end of the four sides of the substrate 2 when the substrate 2 is erected vertically, the lower end surface of the substrate 2 during transportation of the substrate 2 It becomes the structure which supports the end surface 23 which becomes with the positioning pin 33. FIG. Thereby, a more stable holding state of the substrate 2 can be realized.

<Modification 1>
FIG. 5A is a schematic partial cross-sectional view (cut end view) of a substrate holder 30a according to a first modification of the first embodiment of the present invention. The same reference numerals as in the first embodiment denote the same parts in the present modification and a description thereof will not be repeated. As shown in FIG. 5A, in the present modification, the positioning pin 33 is arranged in the groove 323 of the substrate holder main body 32. In addition, the substrate presser 31 and the substrate holder main body 32 are configured to abut each other at a portion to which the screw 34 is tightened. Furthermore, in the substrate holder main body 32, the contact surface 325 in contact with the substrate presser 31 and the contact surface 320 in contact with the substrate 2 are configured to have the same height (in the Z direction of FIG. 2 etc.) ing. According to this configuration, in the process of manufacturing the substrate holder body 32, the installation portions of the contact surfaces 320, 325 and the positioning pin 23 can be formed by the step of forming the groove portion 323, thereby reducing the manufacturing cost. Can.

<Modification 2>
FIG. 5 (B) is a schematic partial cross-sectional view (cut end view) of a substrate holder 30b according to a second modification of the first embodiment of the present invention. The same reference numerals as in the first embodiment and the first embodiment denote the same parts in this modification, and a description thereof will not be repeated. As shown in FIG. 5B, in the second modification, unlike the first modification, the contact surface 315 contacting the substrate holder body 32 and the contact surface 310 contacting the substrate 2 in the substrate holder 31 , (In the Z direction in FIG. 2 and the like) are configured to have the same height. According to this configuration, the contact surfaces 310 and 315 can also be formed by the step of forming the groove portion 313 in the manufacture of the substrate holder 31, and the manufacturing cost can be reduced.

<Modification 3>
FIG. 6A is a schematic partial cross-sectional view (cutting end view) of a substrate holder 30c according to a third modification of the first embodiment of the present invention. The same reference numerals as in the first embodiment and the first and second modifications in this modification denote the same parts, and a description thereof will not be repeated. As shown in FIG. 6A, in the third modification, the groove outside the convex portion 321 in the portion of the substrate holder main body 32 facing the substrate retainer 31 is a groove like the groove portion 323 of the first embodiment or the like. It is set as the structure which excluded the uneven | corrugated shape of shape. Specifically, the region outside the contact surface 320 in the substrate holder body 32 is constituted by a single surface 326 which forms a gap with the substrate 2 to form a non-contact state with the substrate 2. ing. Then, a part of the single surface 326 also serves as a surface that comes in contact with the mounting surface of the positioning pin 33 and the contact surface 315 of the substrate retainer 31. According to this configuration, the substrate holder main body 32 can be a simple configuration that does not require the formation of the groove 323 and the installation portion of the positioning pin 33 as in the first embodiment, and the cost in manufacturing the substrate holder main body 32. Can be reduced.

<Modification 4>
FIG. 6 (B) is a schematic partial cross-sectional view (cutting end view) of a substrate holder 30d according to the fourth modification of the first embodiment of the present invention. The same reference numerals as in the first embodiment and the first to third modifications in the present modification denote the same parts, and a description thereof will not be repeated. As shown in FIG. 6B, in the fourth modification, unlike the third modification, the region outside the convex portion 311 in the portion of the substrate holder 31 facing the substrate holder main body 32 A groove-like uneven shape such as the groove portion 313 is eliminated. Specifically, the area outside the contact surface 310 of the substrate retainer 31 is the plate 2
And a single face 316 which forms a gap with the substrate 2 in order to form a non-contact state with it. Then, a part of the single surface 316 doubles as a surface in contact with the contact surface 325 of the substrate holder main body 32. According to this configuration, the substrate presser 31 can be a simple configuration that does not require the formation of the groove portion 313 as in the first embodiment, and the cost in manufacturing the substrate presser 31 can be reduced.

(Example 2)
FIG. 7 is a schematic plan view of a substrate holder main body 32e of a substrate holder 30e according to a second embodiment of the present invention. The same reference numerals as in the first embodiment and the first to fourth modifications in the present embodiment denote the same parts, and a description thereof will not be repeated. The substrate holder 30e according to the second embodiment is configured to be able to accommodate and hold two substrates. Specifically, as shown in FIG. 7, the two substrates can be arranged side by side at the same height and held horizontally. 7 shows only the substrate holder main body 32e and the positioning pin 33, and the substrate and the substrate holder are not shown.

  As shown in FIG. 7, the substrate holder body 32e is provided with two recesses 322a and 322b corresponding to the two substrates, respectively, and the contact surface 320 and the positioning pin 33 are disposed on the outer periphery of each. ing. Here, in the present embodiment, a positioning pin 33e is provided which enters into the area between the adjacent substrates and performs positioning of one of the two substrates. The positioning pin 33e has a fixing portion 33e1, an extending portion 33e2, and a protruding portion 33e3. The fixing portion 33e1 is fixed by a screw 35 to a surface (or a surface opposed to the substrate holding member) that is in contact with the substrate retainer by fastening the screw 34 outside the substrate disposition space in the substrate holder body 32e. The extension portion 33e2 extends from the fixed portion 33e1 to a position facing the one side of the substrate at a predetermined position between the two substrate disposition spaces. The protruding portion 33e3 protrudes from the side of the extending portion 33e2 toward the substrate disposition space, and the tip end surface 330e abuts against the one side of the substrate to position the substrate.

  According to the positioning pin 33e of this embodiment, in the holder configuration in which two substrates are arranged side by side, the space provided for forming the screwing point (screw hole 324) between the two substrate installation spaces is used To form a butt portion. Therefore, according to the present embodiment, the two substrates can be arranged at the minimum necessary distance, and the substrate can be held while suppressing the occurrence of breakage of the substrates. In addition, the positioning structure using the positioning pin 33e of a present Example is suitably applicable also to the substrate holder which can hold | maintain three or more board | substrates.

<Others>
The contact surfaces 310 and 320 (convex portions 311 and 321) are continuously formed in a substantially rectangular annular shape in this embodiment, but may be formed intermittently.
Further, the widths of the contact surfaces 310 and 320 are formed to be the same width in the present embodiment, but may be different. Further, the contact positions of the contact surfaces 310 and 320 may be mutually shifted in the width direction of the substrate 2.
The number and arrangement of the positioning pins 33 and the screws 34 are not limited to the number and arrangement in each of the above-described embodiments, and can be changed as appropriate. In addition, when the screwing position by the screw 34 is apart from the corner of the substrate by a constant distance, the occurrence of the pitching can be prevented more surely.
The above-mentioned each embodiment and each modification can combine each composition with each other as much as possible.

DESCRIPTION OF SYMBOLS 2 ... Board | substrate, 21 ... Processed surface (1st surface), 22 ... Back surface (2nd surface), 23 ... End surface, 24 ... Corner part, 30 ... Substrate holder, 31 ... Substrate pressing (1st frame) 310: contact surface (first contact portion) 32: substrate holder main body (second frame) 320: contact surface (second contact portion) 33: positioning pin 330: tip surface (push Apply part), 34 ... screw (fastening means)

Claims (16)

A substrate holder for holding a substrate by exposing a processing region of the substrate, the substrate holder comprising:
A sandwiching portion that sandwiches both sides of the substrate without contacting the corner of the substrate;
A non-contacting portion at a corner of the substrate, and an abutting portion which abuts on an end surface of the substrate;
A substrate holder comprising: The holding unit is
A first contact portion that abuts on the first surface at a position inside the end portion of the substrate in a peripheral region outside the processing region of the first surface including the processing region of the substrate;
A second contact portion on the second surface opposite to the first surface of the substrate, the second contact portion being in contact with the second surface at a position inside the end portion of the substrate;
Have
The substrate holder according to claim 1, wherein the substrate is held by the first contact portion and the second contact portion. A first frame having the first contact portion and an opening for exposing the processing region;
A second frame body having the second abutment portion and the abutment portion;
And a fastening means for fastening the first frame and the second frame in a state where the butting portion abuts on the end face of the substrate and the first contact portion and the second contact portion sandwich the substrate. ,
The substrate holder according to claim 2, comprising:   The said 1st frame has the groove part for forming a clearance gap between the said 1st frame and the corner | angular part of a board | substrate in the outer side of the said 1st contact part, It is characterized by the above-mentioned. Substrate holder.   The second frame is characterized in that it has a groove for forming a gap between the second frame and the corner of the substrate outside the second contact portion. The substrate holder described in.   The substrate holder according to any one of claims 1 to 5, wherein a width of the butting portion in a direction perpendicular to the substrate is smaller than a thickness of the substrate.   The substrate holder according to any one of claims 1 to 6, wherein the abutment portion abuts on a central portion of the end surface of the substrate in a direction perpendicular to the substrate.   The substrate holder according to any one of claims 1 to 7, wherein a plurality of the abutment portions are provided.   9. The substrate holder according to claim 8, wherein the plurality of abutment portions are disposed so as to abut only one of two sides facing each other among the four sides of the substrate. The plurality of abutment parts are
An abutting portion which abuts on an end face of one of two sides not facing each other among the four sides of the substrate;
An abutting portion which abuts on an end face of the other of the two sides;
The substrate holder according to claim 8 or 9, further comprising:   The substrate according to any one of claims 8 to 10, wherein the plurality of abutment portions include a plurality of abutment portions which abut on one of four sides of the substrate at different positions. holder. A substrate holder supported so that a surface to be processed of a substrate faces in a horizontal direction by a substrate transfer unit moving between a plurality of chambers in a film forming apparatus.
The substrate holder according to any one of claims 8 to 11, wherein the plurality of the butting portions include a butting portion which abuts on the end face of the lower end side of the substrate. It is possible to hold multiple substrates,
The substrate holder according to any one of claims 8 to 12, wherein at least one of the plurality of abutment portions is disposed between adjacent substrates. A film forming apparatus for forming a film on a substrate, wherein
A plurality of chambers including a deposition chamber,
A substrate transport unit that supports the substrate holder according to any one of claims 1 to 13 and moves between the plurality of chambers.
A film forming apparatus comprising:   15. The film forming apparatus according to claim 14, wherein the substrate transport unit supports the substrate holder such that a surface to be processed of the substrate is vertical. The substrate holder includes a plurality of the abutting portions.
The film forming apparatus according to claim 15, wherein at least one of the plurality of abutment portions abuts on an end surface of the lower end side of the substrate.