CN109957765B - Substrate holder and film forming apparatus - Google Patents
Substrate holder and film forming apparatus Download PDFInfo
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- CN109957765B CN109957765B CN201811362770.5A CN201811362770A CN109957765B CN 109957765 B CN109957765 B CN 109957765B CN 201811362770 A CN201811362770 A CN 201811362770A CN 109957765 B CN109957765 B CN 109957765B
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- substrate
- contact
- substrate holder
- contact portion
- film forming
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Abstract
The invention provides a substrate support capable of holding a substrate with the occurrence of breakage of the substrate suppressed. The substrate holder (30) holds a substrate (2) such that a region (21 a) to be processed of the substrate (2) is exposed, and is characterized by comprising: clamping portions (310, 320), the clamping portions (310, 320) clamping the two sides (21, 22) of the substrate (2) without contacting the corner portions (24) of the substrate (2); and a contact portion (30), wherein the contact portion (30) is in contact with the end surface (23) of the substrate (2) without contacting the corner of the substrate (2).
Description
Technical Field
The present invention relates to a substrate holder and a film forming apparatus.
Background
In film formation processing of a substrate used for a semiconductor device, there is a method in which the substrate is supported in a vertically standing state (in which the surface to be processed is in a vertical posture) and conveyed between chambers of a film formation apparatus. The substrate is held by a substrate holder in a state where the surface to be processed is opened (exposed) to the outside, and is moved between the chambers by a transfer mechanism that supports the substrate holder (patent document 1). As an example of the structure of the substrate holder, a structure in which the substrate is held by sandwiching the substrate between upper and lower frames and fastening the frames by fastening means such as screws is given.
[ Prior Art literature ]
[ patent literature ]
International publication No. WO2016/017602 (patent document 1)
Disclosure of Invention
[ summary of the invention ]
[ problem ] to be solved by the invention
Fig. 8 is a schematic cross-sectional view (cut-off end view) showing the structure of a substrate holder according to the conventional example. As shown in fig. 8, the substrate holder 130 has an opening for exposing the region to be processed of the substrate 2, and is configured by a first frame 131 that abuts against the first surface 21 of the substrate 2 including the region to be processed, and a second frame 132 that abuts against the second surface 22 of the substrate 2, and is fastened by screws 34. As shown in part C of fig. 8, the corner 24 of the substrate 2 (the boundary between the first surface 21 and the substrate-side end surface 23 and the boundary between the second surface 22 and the substrate-side end surface 23) is in contact with the first frame 131 and the second frame 132. Therefore, chipping (chipping) occurs in the corner 24 due to a tightening force, deformation caused by thermal expansion during heating, or the like. The corners 24 of the substrate 2 are portions where burrs are generated during the substrate manufacturing, and chips are generated due to the burr defects, which cause contamination in the device. Further, even if the chipping is small at the beginning, the breakage range tends to be large in the subsequent steps from this point on, and once it occurs, productivity is greatly affected. As a conventional example of countermeasures, there is a problem that the substrate is chamfered, but the cost of the substrate increases.
The invention aims to provide a substrate support capable of holding a substrate in a manner that the occurrence of breakage of the substrate is suppressed.
[ solution ] to solve the problem
In order to achieve the above object, the present invention provides a substrate holder for holding a substrate with a region to be processed of the substrate exposed, comprising:
a clamping part which clamps two sides of the substrate without contacting with the corner of the substrate; a kind of electronic device with high-pressure air-conditioning system
And the contact part is in contact with the end surface of the substrate without contacting with the corner of the substrate.
In order to achieve the above object, the present invention provides a film forming apparatus for performing a film forming process on a substrate, comprising:
a plurality of chambers including a film forming chamber; a kind of electronic device with high-pressure air-conditioning system
And a substrate transfer mechanism that supports the substrate holder and moves between the plurality of chambers.
[ Effect of the invention ]
According to the present invention, the substrate can be held while suppressing the occurrence of breakage of the substrate.
Drawings
Fig. 1 is a schematic cross-sectional view (cut-out end view) of a substrate holder according to an embodiment of the present invention.
Fig. 2 is a schematic perspective exploded view of a substrate support of an embodiment of the present invention.
Fig. 3 is a schematic cross-sectional view (cut-out end view) of a substrate holder according to an embodiment of the present invention.
Fig. 4 is a schematic plan view of a second frame of a substrate support according to an embodiment of the present invention.
Fig. 5 is a schematic cross-sectional view (cut-out end view) of a substrate holder according to a modification of the embodiment of the present invention.
Fig. 6 is a schematic cross-sectional view (cut-out end view) of a substrate holder according to a modification of the embodiment of the present invention.
Fig. 7 is a schematic plan view of a second frame of the substrate holder of embodiment 2 of the present invention.
Fig. 8 is a schematic cross-sectional view (cut-off end view) of a substrate holder according to a conventional example.
Fig. 9 is a schematic view of a sputtering apparatus according to an embodiment of the present invention.
FIG. 10 is a schematic view of a film forming apparatus according to an embodiment of the present invention.
Fig. 11 is an example of a flowchart of a film formation process.
[ reference numerals description ]
2 … substrate, 21 … processed surface (first surface), 22 … back surface (second surface), 23 … end surface, 24 … corner portion, 30 … substrate holder, 31 … substrate pressing member (first frame), 310 … abutment surface (first abutment portion), 32 … substrate holder main body (second frame), 320 … abutment surface (second abutment portion), 33 … positioning pin, 330 … front end surface (abutment portion), 34 … screw (fastening mechanism)
Detailed Description
The following is a detailed description of an embodiment for carrying out the present invention with reference to the drawings. However, the size, material, shape, relative arrangement, and the like of the structural members described in this embodiment should be appropriately changed according to the structure of the device to which the invention is applied or various conditions. That is, the scope of the present invention is not limited to the following embodiments.
Example 1
< integral Structure of film Forming apparatus >
Fig. 10 is a schematic diagram schematically showing the overall configuration of a film forming apparatus 1 according to an embodiment of the present invention. The film forming apparatus 1 includes: a storage chamber 11 for storing the substrate 2 to be film-formed; a heating chamber 12 for performing a heating process of the substrate 2; and a film forming chamber 13 for performing a film forming process on the surface to be processed of the substrate 2. The film forming chamber 13 includes: a substrate processing apparatus 14 for performing pretreatment such as cleaning or etching of the surface to be processed of the substrate 2 before the film formation process; a sputtering device 15 as a film formation processing section for performing a film formation process on the surface to be processed of the substrate 2. The film forming apparatus 1 of the present embodiment is configured to transfer the substrate 2 between the chambers in a state of being vertically raised (in a posture in which the surface to be processed is vertical) (see fig. 9).
Fig. 11 is an example of a flowchart of the film formation process according to the present embodiment. The substrate 2 is transferred from the storage chamber 11 to the heating chamber 12 (S101), from the heating chamber 12 to the substrate processing apparatus 14 of the film forming chamber 13 (S103), and from the substrate processing apparatus 14 to the sputtering apparatus 15 (S105), and film forming processing is performed. After the substrate 2 is subjected to the heat treatment by the heater 121 in the heating chamber 12 (S102), first, the surface treatment by the substrate treatment apparatus 14 of the film formation chamber 13 is performed (S104). The surface-treated substrate 2 is then subjected to a sputtering process using targets 151, 152, 153 made of various materials by the sputtering apparatus 15 (S106), and the film formation process is completed. The flow of the film formation process shown here is merely an example, and is not limited to the process contents shown here.
The film forming apparatus 1 of the present embodiment can be applied to, for example, various electrode formation accompanied by pretreatment. Specific examples thereof include a plating seed film facing an FC-BGA (Flip-Chip Ball Grid Array) mounting substrate and a film forming of a metal laminate film facing a SAW (Surface Acoustic Wave) device. Further, a conductive hard film at the junction of the LED, a film at the terminal of the MLCC (Multi-Layered Ceramic Capacitor), and the like can be cited. The present invention can also be applied to the formation of an electromagnetic shielding film of an electronic component package or a terminal portion film of a chip resistor. The dimensions of the treatment substrate 2 may be exemplified by dimensions of 200mm in length and width by 200mm and 0.7 to 6.0mm in thickness. Examples of the material of the substrate 2 include glass, alumina, ceramics, LTCC (Low Temperature Co-modified Ceramics: low-temperature co-fired Ceramics), and the like.
< substrate conveying Structure and sputtering apparatus >
As described above, the substrate 2 is transferred between the chambers of the film forming apparatus 1 in a vertically standing state, and is set in a posture in which the surface 21 to be processed is vertical (the surface 21 to be processed is oriented in the horizontal direction) in the sputtering chamber 51 (chamber). As shown in fig. 9, the substrate 2 is held by the substrate holder 30 in a state in which the surface 21 to be processed is opened (exposed) and the peripheral edge portion of the outer periphery of the region to be processed is held. The substrate holder 30 holding the substrate 2 is supported by the substrate holder support portion 43. The substrate holder support 43 includes wheels 431 as a substrate transfer mechanism below, and is mounted so as to be movable on rails 432 laid on the bottom surface of the sputtering chamber 51 in a state where the substrate holder 30 is supported. Here, the vertical direction is perpendicular to the bottom surface of the sputtering chamber 51 or the upper surface (substrate transfer surface) of the rail 432, and may not coincide with the gravitational direction (vertical direction) depending on the device configuration. Similarly, the horizontal direction may not coincide with the direction orthogonal to the gravitational direction. That is, in the present embodiment, the description of defining the vertical and horizontal directions is made on the premise that the installation surface of the substrate holder support portion 43 on the inner wall of each chamber is a horizontal plane, but if the direction of the installation surface is changed, the definition of the vertical and horizontal directions is naturally changed correspondingly.
The sputtering chamber 51 of the sputtering apparatus 15 is previously exhausted to a predetermined high vacuum pressure by the exhaust device 56. The substrate holder 30 moves at a constant speed in the sputtering chamber 51, and during this time, a film forming process by the cathode unit 50 is performed on the substrate 2. In the sputtering chamber 51, the substrate 2 (substrate holder 30) and the cathode unit 50 are disposed so as to face each other in the horizontal direction. The sputtering chamber 51 is adjusted to a vacuum degree (for example, 2×10Pa to 2×10-5 Pa) suitable for the sputtering process by the exhaust device 56, and is flow-controlled and supplied with sputtering gas from the gas supply source 57. Thereby, a sputtering atmosphere is formed inside the sputtering chamber 51. As the sputtering gas, for example, rare gases such as Ar, kr, and Xe, or reactive gases for film formation can be used.
The plate-like target 151 as a film-forming material is disposed parallel to the transfer path of the substrate 2, that is, the surface 21 to be processed of the substrate 2. The cathode 251 is provided in close contact with the opposite side of the target 151 to the side facing the substrate 2. The cathode 251 is connected to a power supply 55, and the sputtering chamber 51 is grounded. In the voltage application by the power supply 55, the cathode electrode 251 serves as a cathode, and the wall of the sputtering chamber 51 serves as an anode.
< sputtering >
A plasma region is generated near the surface of the target 151 facing the substrate 2 by the formation of the sputtering atmosphere and the voltage application from the power supply 55 to the cathode electrode 251. The target particles are emitted from the surface of the target 151 facing the substrate 2 due to the collision of the sputtering gas ions generated by the generation of the plasma region with the target 151. The target particles emitted from the target 151 fly toward the substrate 2 and accumulate, thereby forming a film on the surface 21 to be processed of the substrate 2. The targets 152 and 153 are different from the target 151 only in terms of material, and the film formation mechanism by sputtering is the same.
< construction of substrate holder 30 (feature of this embodiment) >)
The structure of the substrate holder 30, which is a feature of the present embodiment, will be described with reference to fig. 1 to 4.
Fig. 1 is a schematic partial cross-sectional view (cut-out end view) of a substrate holder according to an embodiment of the present invention. Fig. 2 is a schematic perspective exploded view of a substrate support of an embodiment of the present invention. Fig. 3 is a schematic cross-sectional view (cut-out end view) of a substrate holder according to an embodiment of the present invention, and is a diagram illustrating a case where the substrate 2 is assembled to the substrate holder 30. Fig. 4 is a schematic plan view of a second frame of a substrate support according to an embodiment of the present invention.
As described above, the substrate holder 30 is configured to hold the substrate 2 with the processing region of the substrate 2 exposed, and holds the substrate 2 by sandwiching both sides of the substrate 2 with the substrate pressing member 31 as the first frame and the substrate holder main body 32 as the second frame. The surface 21 to be processed, which is one surface (first surface) of the substrate 2, is composed of a region 21a to be processed to which the film forming process and the like described above are applied, and a peripheral region 21b surrounding the outside (outer periphery) of the region 21a to be processed.
The substrate pressing member 31 has an abutment surface (first abutment portion) 310 that abuts against the surface to be processed 21 at a substrate end portion of the peripheral edge region 21b of the surface to be processed 21 of the substrate 2, that is, at a position inside a corner 24 (substrate end portion) at a boundary between the surface to be processed 21 and the side end surface 23 of the substrate 2. The contact surface 310 is appropriately set to a position on the inner side of the corner 24 so as to be in contact with the peripheral edge region 21b of the surface 21 to be processed within a range where occurrence of chipping can be suppressed. The contact surface 310 is a distal end surface of a convex portion 311 protruding in the substrate pressing member 31 in the opposite direction to the substrate holder main body 32. The convex portion 311 is formed in a substantially rectangular annular shape at a portion of the substrate pressing member 31 facing the substrate holder main body 32. A groove (recess) 313 is formed in a portion of the substrate pressing member 31 facing the substrate holder main body 32, the portion being located outside the convex portion 311, and the groove (recess) 313 is used to form a gap for preventing the substrate pressing member 31 from contacting the corner portion 24 of the substrate 2. Further, an opening 312 is formed in a portion of the substrate pressing member 31 facing the substrate holder main body 32, which is located inward of the convex portion 311, to open (expose) the surface 21 to be processed of the substrate 2 to the outside. The substrate pressing member 31 is a frame-like member surrounding the periphery of the processing region 21a of the substrate 2.
The substrate holder main body 32 has an abutment surface (second abutment portion) 320 that abuts against the rear surface 22 at a position on the rear surface 22 opposite to the other surface (second surface) of the substrate 2, that is, the surface to be processed 21, at an inner side than the corner 24 at which the rear surface 22 abuts against the side end surface 23 of the substrate 2. The contact surface 320 is appropriately set to be in contact with the rear surface 22 at a position further inward than the corner 24 within a range where occurrence of chipping can be suppressed. The contact surface 320 is a distal end surface of a convex portion 321 protruding in the substrate holder main body 32 in the opposite direction to the substrate pressing member 31. The convex portion 321 is formed in a substantially rectangular annular shape at a portion of the substrate holder main body 32 facing the substrate pressing member 31. A groove (recess) 323 is formed in a portion of the substrate holder body 32 facing the substrate pressing member 31, the portion being located outside the convex portion 321, and the groove (recess) 323 is used to form a gap for preventing the substrate holder body 32 from contacting the corner portion 24 of the substrate 2. Further, a recess 322 is formed in a portion of the substrate holder main body 32 facing the substrate pressing member 31 on the inner side of the convex portion 321, and the recess 322 faces the back surface 22 of the substrate 2 with a gap. Instead of the concave portion 322, an opening may be provided in the same manner as the opening 312 of the substrate pressing member 31. That is, the rear surface 22 of the substrate 2 may be formed as a bracket structure that is opened to the outside.
In the substrate holder main body 32, positioning pins 33, which are contact members for positioning the substrate 2 with respect to the substrate holder main body 32, are fixed to the substrate holder main body 32 by screws 35. The positioning pin 33 has a tip shape that gradually narrows in width in a direction perpendicular to the substrate 2 toward the side end surface 23 of the substrate 2, and the tip surface 330 thereof abuts against the side end surface 23 of the substrate 2 as an abutting portion. Here, the direction perpendicular to the substrate 2 is synonymous with the thickness direction of the substrate 2, the direction in which the substrate pressing member 31 faces the substrate holder main body 32, the Z-axis direction in fig. 2, and the like. The width of the tip surface 330 of the positioning pin 33 in the direction perpendicular to the substrate 2 is smaller than the thickness of the substrate 2, and the tip surface is brought into contact with the side end surface 22 at a position avoiding contact with the corner 24 (the central portion in the above direction in the present embodiment). The position where the distal end surface 330 contacts the side end surface 22 may not be the central portion as long as it is a position where occurrence of chipping can be suppressed.
The substrate pressing member 31 and the substrate holder main body 32 are fastened and fixed to each other by a screw 34 as a fastening mechanism in a state where the positioning pin 33 is in contact with the end surface 23 of the substrate 2 and the substrate 2 is sandwiched between the contact surfaces 310 and 320. The substrate pressing member 31 and the substrate holder main body 32 are fastened at a plurality of positions by a plurality of screws 34, and in this embodiment, the clamping force of each screw 34 is set to 5 to 40cN/m. The screw hole 314 of the substrate pressing member 31 and the screw hole 324 of the substrate holder main body 32 are provided at positions outside the contact position between the positioning pins 33 and the substrate 2 with respect to the substrate 2. By tightening the screw 34, the contact surfaces 310 and 320 constitute a clamping portion that clamps both surfaces of the substrate 2 in a non-contact manner with the corner 24 of the substrate 2. The substrate pressing member 31, the substrate holder main body 32, and the positioning pins 33 are made of SUS in the present embodiment, but other metals may be used as long as they have a certain degree of hardness. Further, other materials may be appropriately used as long as a desired positioning and holding function can be obtained.
The contact surface 310 of the substrate pressing member 31 and the contact surface 320 of the substrate holder main body 32 are configured to be in contact with both surfaces of the substrate 2 without being in contact with the corner 24 at a position inside the corner 24 of the substrate 2, whereby a force acting on the corner 24 in the thickness direction (Z direction) of the substrate 2 can be relaxed. The positioning pins 33 are also configured to be in contact with the end surfaces 23 of the substrate 2 without being in contact with the corner portions 24 at positions inward of the corner portions 24 of the substrate 2, so that the force acting on the corner portions 24 in the width direction of the substrate 2 (the direction parallel to the surfaces 21 and 22 of the substrate 2, XY direction) can be relaxed. In this way, the substrate holder 30 does not have a portion in contact with the corner 24 of the substrate 2, and thus occurrence of chipping can be suppressed in the substrate 2 where chamfering is not performed. That is, according to the present embodiment, the substrate can be held while suppressing the occurrence of breakage of the substrate.
< assembly of substrate 2 to substrate holder 30 >
As shown in fig. 3, in assembling the substrate 2 to the substrate holder 30, first, the substrate 2 is placed in a predetermined substrate accommodating portion of the substrate holder body 32, specifically, on the contact surface 320 of the convex portion 321 (fig. 3 (a)). At this time, the substrate 2 can be positioned on the substrate holder body 32 by placing the rear surface 22 of the substrate 2 on the contact surface 320 and bringing the side end surface 23 of the substrate 2 into contact with the front end surfaces 330 of the positioning pins 33 (fig. 3B). The substrate holder 32 on which the substrate 2 is positioned is configured such that the frame-shaped substrate pressing member 31 covers the outer peripheral edge (peripheral region 21 b) of the substrate 2, and the substrate 2 is held by the contact surfaces 310 and 320. Then, the substrate 2, the substrate pressing member 31, and the substrate holder main body 32 are integrally fixed by fastening with the screws 34 (fig. 3C).
< arrangement of positioning pins 33 >
As shown in fig. 4, a plurality of positioning pins 33 are provided. The plurality of positioning pins 33 are disposed so as to contact only any one of 2 sides facing each other out of the 4 sides of the substrate 2. That is, the positioning pins 33 are only in contact with any one of the 2 sides, and the force in the direction of the substrate 2 is not applied from the substrate holder 30 to the other side. That is, the plurality of positioning pins 33 are not disposed so as to face each other in the contact direction. By configuring the portion of the substrate 2 on the opposite side of the portion that is in contact with the positioning pins 33 so as not to be positionally restricted in the direction along the substrate 2, the substrate 2 can be positioned so as to absorb dimensional changes and the like of the substrate 2 or the substrate holder 30 due to dimensional errors, thermal expansion, and the like.
The plurality of positioning pins 33 are disposed at a position where one of the 2 sides, which are not opposed to each other, of the 4 sides of the substrate 2 is brought into contact with the end face 23 and at a position where the other side is brought into contact with the end face 23. That is, by positioning in 2 directions along the direction of the substrate 2, the substrate 2 can be positioned on the substrate holder 30 with high accuracy. Further, by disposing the plurality of positioning pins 33 so as to be brought into contact with 1 side out of the 4 sides of the substrate 2 at different positions, positioning with higher accuracy is enabled. Further, the side of the substrate 2 against which the positioning pins 33 are abutted is the lower end side of the 4 sides of the substrate 2 when the substrate 2 is vertically erected, and the end face 23 of the substrate 2, which is the lower end face, is supported by the positioning pins 33 when the substrate 2 is conveyed. This can realize a more stable holding state of the substrate 2.
< modification 1>
Fig. 5 a is a schematic partial cross-sectional view (cut-off end view) of a substrate holder 30a according to modification 1 of embodiment 1 of the present invention. In this modification, the same reference numerals are given to the structures common to embodiment 1, and a description thereof will be omitted. As shown in fig. 5 (a), in the present modification, the positioning pins 33 are disposed in the groove 323 of the substrate holder main body 32. The substrate pressing member 31 and the substrate holder main body 32 are in contact with each other at a portion fastened by the screw 34. In the substrate holder main body 32, the contact surface 325 with which the substrate pressing member 31 contacts and the contact surface 320 with which the substrate 2 contacts (in the Z direction of fig. 2 and the like) are at the same height. According to the above configuration, in the process of forming the groove 323 in the production of the substrate holder main body 32, the contact surfaces 320 and 325 and the installation portion of the positioning pin 23 can be formed, and the production cost can be reduced.
< modification example 2>
Fig. 5B is a schematic partial cross-sectional view (cut-off end view) of a substrate holder 30B according to modification 2 of embodiment 1 of the present invention. In this modification, the same reference numerals are given to the structures common to embodiment 1 and modification 1, and a description thereof will be omitted. As shown in fig. 5B, in modification 2, unlike modification 1, the contact surface 315 with which the substrate holder main body 32 contacts and the contact surface 310 with which the substrate 2 contacts (in the Z direction of fig. 2 and the like) are at the same height as each other in the substrate pressing member 31. According to the above configuration, even in the process of forming the groove portion 313 in the manufacture of the substrate pressing member 31, the contact surfaces 310 and 315 can be formed, and the manufacturing cost can be reduced.
< modification example 3>
Fig. 6 a is a schematic partial cross-sectional view (cut-off end view) of a substrate holder 30c according to modification 3 of embodiment 1 of the present invention. In this modification, the same reference numerals are given to the structures common to embodiment 1 and modifications 1 and 2, and a description thereof will be omitted. As shown in fig. 6 (a), in modification 3, the region of the substrate holder main body 32, which is located outside the convex portion 321 in the portion facing the substrate pressing member 31, has a groove-like concave-convex shape such as the groove portion 323 of embodiment 1. Specifically, the region of the substrate holder main body 32 outside the contact surface 320 is formed of a single surface 326 that forms a gap with the substrate 2 in order to form a non-contact state with the substrate 2. A part of the single surface 326 also serves as a surface that contacts the installation surface of the positioning pin 33 and the contact surface 315 of the substrate pressing member 31. According to the above configuration, the substrate holder body 32 can be formed in a simple structure without forming the groove 323 and the positioning pin 33 as in embodiment 1, and the cost in manufacturing the substrate holder body 32 can be reduced.
< modification 4>
Fig. 6B is a schematic partial cross-sectional view (cut-off end view) of a substrate holder 30d according to modification 4 of embodiment 1 of the present invention. In this modification, the same reference numerals are given to the structures common to embodiment 1 and modifications 1 to 3, and the description thereof will be omitted. As shown in fig. 6 (B), in modification 4, unlike modification 3, the region of the opposing portion of the substrate pressing member 31 opposing the substrate holder main body 32, which is outside the convex portion 311, is configured to have a groove-like concave-convex shape such as the groove portion 313 of embodiment 1 or the like arranged therein. Specifically, the region of the substrate pressing member 31 outside the contact surface 310 is composed of a single surface 316 that forms a gap with the substrate 2 in order to form a non-contact state with the plate 2. A part of the single surface 316 also serves as a surface that contacts the contact surface 325 of the substrate holder body 32. According to the above configuration, the substrate presser 31 can be formed in a simple configuration that does not require the formation of the groove portion 313 as in embodiment 1, and cost reduction in manufacturing the substrate presser 31 can be achieved.
Example 2
Fig. 7 is a schematic plan view of the substrate holder main body 32e of the substrate holder 30e of embodiment 2 of the present invention. In this embodiment, the same reference numerals are given to the structures common to embodiment 1 and modifications 1 to 4, and the description thereof will be omitted. The substrate holder 30e of embodiment 2 can accommodate and hold 2 substrates. Specifically, as shown in fig. 7, 2 substrates can be held in parallel in the horizontal direction at the same height. Fig. 7 shows only the substrate holder main body 32e and the positioning pins 33, and the substrate pressing member are not shown.
As shown in fig. 7, 2 concave portions 322a and 322b are provided in the substrate holder main body 32e corresponding to 2 substrates, respectively, and the contact surface 320 and the positioning pins 33 are disposed on the outer periphery of each. Here, in the present embodiment, a positioning pin 33e is provided which enters a region between adjacent substrates and performs positioning of one of the 2 substrates. The positioning pin 33e has a fixing portion 33e1, an extending portion 33e2, and a protruding portion 33e3. The fixing portion 33e1 is fixed to a surface (or a facing surface) of the substrate holder main body 32e, which is located outside the substrate arrangement space and is in contact with the substrate pressing member by tightening the screw 34, by the screw 35. The extension portion 33e2 extends from the fixing portion 33e1 to a position opposing the 1 sides of the substrate at a predetermined position between the 2 substrate arrangement spaces. The protruding portion 33e3 protrudes from the side of the extending portion 33e2 toward the substrate arrangement space, and the front end surface 330e thereof contacts the 1 side of the substrate to position the substrate.
According to the positioning pin 33e of the present embodiment, in the holder structure in which 2 substrates are arranged in parallel, the contact portion can be formed by using the space provided for forming the screw tightening portion (screw hole 324) between the 2 substrate installation spaces. Therefore, according to the present embodiment, 2 substrates can be arranged at a minimum necessary interval, and the substrates can be held while suppressing breakage of the substrates. The positioning structure using the positioning pins 33e according to the present embodiment can be applied to a substrate holder capable of holding a plurality of substrates of 3 or more.
< others >
In the present embodiment, the contact surfaces 310 and 320 (convex portions 311 and 321) are formed continuously in a substantially rectangular annular shape, but may be formed intermittently.
In the present embodiment, the widths of the contact surfaces 310 and 320 are the same, but may be different. Further, the contact positions of the contact surfaces 310, 320 may be shifted from each other in the width direction of the substrate 2.
The number and arrangement of the positioning pins 33 and the screws 34 are not limited to those in the above embodiments, and may be changed as appropriate. The screw tightening position by the screw 34 is separated from the base plate by a predetermined interval, and chipping can be prevented more reliably.
The above embodiments and modifications can be combined with each other as much as possible.
Claims (14)
1. A substrate holder for holding a substrate with a region to be processed of the substrate exposed, comprising:
a clamping part which clamps two sides of the substrate without contacting with the corner of the substrate so as to inhibit the breakage of the substrate; a kind of electronic device with high-pressure air-conditioning system
A contact portion which contacts the end surface of the substrate without contacting the corner portion of the substrate to inhibit the breakage of the substrate,
the clamping part comprises:
a first contact portion that contacts a first surface of a substrate including the region to be processed at a position inside an end of the substrate in a peripheral region outside the region to be processed of the first surface; a kind of electronic device with high-pressure air-conditioning system
A second contact portion that contacts a second surface of the substrate on a side opposite to the first surface at a position inside the substrate end portion,
the substrate is clamped by the first abutting part and the second abutting part,
the substrate holder further includes:
a first frame having the first contact portion and an opening portion exposing the region to be processed;
a second frame body having the second abutting portion and the contact portion; a kind of electronic device with high-pressure air-conditioning system
And a fastening mechanism for fastening the first frame and the second frame in a state in which the contact portion is in contact with an end surface of the substrate and the substrate is held between the first contact portion and the second contact portion.
2. The substrate support of claim 1,
the first frame body has a groove portion on an outer side of the first contact portion for forming a gap between the first frame body and a corner portion of the substrate.
3. The substrate holder according to claim 1 or 2, wherein,
the second frame body has a groove portion outside the second contact portion for forming a gap between the second frame body and a corner portion of the substrate.
4. The substrate holder according to claim 1 or 2, wherein,
the contact portion has a width in a direction perpendicular to the substrate smaller than a thickness of the substrate.
5. The substrate holder according to claim 1 or 2, wherein,
the contact portion contacts a central portion of the end face of the substrate in a direction perpendicular to the substrate.
6. The substrate holder according to claim 1 or 2, wherein,
the substrate support is provided with a plurality of contact parts.
7. The substrate support of claim 6,
the plurality of contact portions are configured to contact only any one of two sides facing each other out of four sides of the substrate.
8. The substrate support of claim 6,
the plurality of contact portions includes:
a contact portion which contacts an end face of one of two sides of the substrate which are not opposed to each other; a kind of electronic device with high-pressure air-conditioning system
And a contact portion which contacts an end face of the other one of the two sides.
9. The substrate support of claim 6,
the plurality of contact parts comprise a plurality of contact parts which are respectively contacted with one of four sides of the substrate at different positions.
10. The substrate support of claim 6,
the substrate support is supported by a substrate conveying mechanism moving among a plurality of chambers in a film forming device in a mode that the processed surface of the substrate faces to the horizontal direction,
the plurality of contact portions include contact portions that contact an end face of a side of the lower end of the substrate.
11. The substrate support of claim 6,
the substrate support is capable of holding a plurality of substrates,
at least one of the plurality of contact portions is disposed between adjacent substrates.
12. A film forming apparatus for performing a film forming process on a substrate, comprising:
a plurality of chambers including a film forming chamber; a kind of electronic device with high-pressure air-conditioning system
A substrate transfer mechanism that supports the substrate support of claim 1 or 2 and moves between the plurality of chambers.
13. The film forming apparatus according to claim 12, wherein,
the substrate transfer mechanism supports the substrate holder so that a surface to be processed of the substrate is vertical.
14. The film forming apparatus according to claim 13, wherein,
the substrate support is provided with a plurality of contact parts,
at least one of the plurality of contact portions contacts an end face of a side of the lower end of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211706317.8A CN115874157A (en) | 2017-12-26 | 2018-11-16 | Substrate holder, substrate processing apparatus, and film forming apparatus |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-250012 | 2017-12-26 | ||
| JP2017250012A JP6673894B2 (en) | 2017-12-26 | 2017-12-26 | Substrate holder and film forming device |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211706317.8A Division CN115874157A (en) | 2017-12-26 | 2018-11-16 | Substrate holder, substrate processing apparatus, and film forming apparatus |
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| Publication Number | Publication Date |
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| CN109957765A CN109957765A (en) | 2019-07-02 |
| CN109957765B true CN109957765B (en) | 2023-09-01 |
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| CN201811362770.5A Active CN109957765B (en) | 2017-12-26 | 2018-11-16 | Substrate holder and film forming apparatus |
| CN202211706317.8A Pending CN115874157A (en) | 2017-12-26 | 2018-11-16 | Substrate holder, substrate processing apparatus, and film forming apparatus |
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| CN202211706317.8A Pending CN115874157A (en) | 2017-12-26 | 2018-11-16 | Substrate holder, substrate processing apparatus, and film forming apparatus |
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| JP (1) | JP6673894B2 (en) |
| KR (1) | KR102365614B1 (en) |
| CN (2) | CN109957765B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6673894B2 (en) | 2020-03-25 |
| CN115874157A (en) | 2023-03-31 |
| JP2019116647A (en) | 2019-07-18 |
| KR20190078480A (en) | 2019-07-04 |
| CN109957765A (en) | 2019-07-02 |
| KR102365614B1 (en) | 2022-02-18 |
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