CN115874157A - Substrate holder, substrate processing apparatus, and film forming apparatus - Google Patents

Substrate holder, substrate processing apparatus, and film forming apparatus Download PDF

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Publication number
CN115874157A
CN115874157A CN202211706317.8A CN202211706317A CN115874157A CN 115874157 A CN115874157 A CN 115874157A CN 202211706317 A CN202211706317 A CN 202211706317A CN 115874157 A CN115874157 A CN 115874157A
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CN
China
Prior art keywords
substrate
substrate holder
main surface
frame body
contact
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Pending
Application number
CN202211706317.8A
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Chinese (zh)
Inventor
生长秀隆
熊木智洋
阿部大和
渡部新
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Canon Tokki Corp
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Canon Tokki Corp
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Publication date
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Publication of CN115874157A publication Critical patent/CN115874157A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

The invention provides a substrate holder capable of holding a substrate while suppressing damage to the substrate. A substrate holder (30) holds a substrate (2) so that a region (21 a) to be processed of the substrate (2) is exposed, and is characterized by comprising: clamping portions (310, 320) that clamp both surfaces (21, 22) of the substrate (2) without contacting the corner portions (24) of the substrate (2) at the clamping portions (310, 320); and a contact part (30), wherein the contact part (30) is contacted with the end surface (23) of the substrate (2) without contacting with the corner of the substrate (2).

Description

Substrate holder, substrate processing apparatus, and film forming apparatus
The present application is a divisional application entitled "substrate holder and film forming apparatus" filed on application No. 2018, 11/16/2018, and having an application number of 201811362770.5.
Technical Field
The invention relates to a substrate holder, a substrate processing apparatus and a film forming apparatus.
Background
In film formation processing of a substrate used for a semiconductor device, there is a method of supporting the substrate in a vertically standing state (a posture in which a surface to be processed is vertical) and transferring the substrate between chambers of a film formation apparatus. The substrate is held by a substrate holder in a state where the surface to be processed is opened (exposed) to the outside, and is moved between the chambers by a transfer mechanism that supports the substrate holder (patent document 1). As an example of the structure of the substrate holder, a structure in which a substrate is held by two upper and lower casings by sandwiching the substrate between the casings and fastening the casings with a fastening tool such as a screw is given.
[ Prior art documents ]
[ patent document ]
[ patent document 1 ] International publication No. WO2016/017602
Disclosure of Invention
[ SUMMARY OF THE INVENTION ]
[ problem to be solved by the invention ]
Fig. 8 is a schematic cross-sectional view (cut-off end view) showing the structure of a substrate holder of a conventional example. As shown in fig. 8, the substrate holder 130 has an opening portion for exposing the region to be processed of the substrate 2, and is composed of a first frame 131 abutting on the first surface 21 including the region to be processed of the substrate 2 and a second frame 132 abutting on the second surface 22 of the substrate 2, and is fastened by screws 34. As shown in the portion C of fig. 8, the corner portion 24 of the substrate 2 (the boundary portion between the first surface 21 and the substrate-side end surface 23, and the boundary portion between the second surface 22 and the substrate-side end surface 23) is configured to contact the first frame 131 and the second frame 132. Therefore, chipping (chipping) occurs due to corner chipping) occurs in the corner portion 24 due to a force of tightening, deformation caused by thermal expansion during heating, or the like. The corner 24 of the substrate 2 is a portion where a burr is generated at the time of manufacturing the substrate, and the burr is chipped to generate chips, whereby the inside of the apparatus is contaminated. Even if the amount of chipping is small at the beginning, the range of chipping tends to be large in the subsequent process from this start, and when it occurs, the productivity is greatly affected. As a conventional example of the countermeasure, there is a problem that the substrate is chamfered, but the cost of the substrate increases.
The invention aims to provide a substrate support which can restrain the damage of the substrate and hold the substrate.
[ MEANS FOR solving PROBLEMS ] A method for solving the problems
In order to achieve the above object, the present invention provides a substrate holder for holding a substrate with a region to be processed of the substrate exposed, the substrate holder comprising:
a clamping part which clamps two surfaces of the substrate without contacting with the corner of the substrate; and
and the contact abutting part is in contact abutting contact with the end face of the substrate without contacting with the corner of the substrate.
In order to achieve the above object, the present invention provides a film deposition apparatus for performing a film deposition process on a substrate, the film deposition apparatus including:
a plurality of chambers including a film forming chamber; and
a substrate transfer mechanism supporting the substrate holder and moving between the plurality of chambers.
[ Effect of the invention ]
According to the present invention, the substrate can be held while suppressing the occurrence of damage to the substrate.
Drawings
Fig. 1 is a schematic cross-sectional view (cut-off end view) of a substrate holder according to an embodiment of the present invention.
Fig. 2 is a schematic perspective exploded view of a substrate holder of an embodiment of the invention.
Fig. 3 is a schematic cross-sectional view (cut-off end view) of a substrate holder according to an embodiment of the present invention.
Fig. 4 is a schematic plan view of the second frame body of the substrate holder of the embodiment of the present invention.
Fig. 5 is a schematic cross-sectional view (cut-off end view) of a substrate holder according to a modification of the embodiment of the present invention.
Fig. 6 is a schematic cross-sectional view (cut-off end view) of a substrate holder according to a modification of the embodiment of the present invention.
Fig. 7 is a schematic plan view of the second frame body of the substrate holder according to embodiment 2 of the present invention.
Fig. 8 is a schematic cross-sectional view of a substrate holder according to a conventional example (cut-off end view).
Fig. 9 is a schematic view of a sputtering apparatus according to an embodiment of the present invention.
FIG. 10 is a schematic view of a film deposition apparatus according to an embodiment of the present invention.
Fig. 11 is an example of a flowchart of the film formation process.
[ description of reference ]
2 \8230, substrate 21 \8230, processed surface (first surface) 22 \8230, back surface (second surface) 23 \8230, end surface 24 \8230, corner 30 \8230, substrate support 31 \8230, substrate pressing piece (first frame) 310 \8230, abutting surface (first abutting portion) 32 \8230, substrate support main body (second frame) 320 \8230, abutting surface (second abutting portion) 33 \8230, positioning pin 330 \8230, front end surface (abutting portion) 34 \8230, screw (fastening mechanism)
Detailed Description
Hereinafter, a mode for carrying out the present invention will be described in detail based on examples with reference to the accompanying drawings. However, the dimensions, materials, shapes, relative arrangements thereof, and the like of the components described in the embodiment are appropriately changed depending on the configuration of the apparatus to which the invention is applied and various conditions. That is, the scope of the present invention is not intended to be limited to the following embodiments.
(example 1)
< overall Structure of film Forming apparatus >
Fig. 10 is a schematic view schematically showing the overall configuration of the film deposition apparatus 1 according to the embodiment of the present invention. The film forming apparatus 1 includes: a storage chamber 11 for storing a substrate 2 to be subjected to film formation; a heating chamber 12 for performing heat treatment of the substrate 2; and a film forming chamber 13 for performing a film forming process on the surface to be processed of the substrate 2. The film forming chamber 13 includes: a substrate processing apparatus 14 for performing a pretreatment such as cleaning of the surface to be processed of the substrate 2 or an etching process before the film formation process; a sputtering apparatus 15 as a film formation processing unit for performing a film formation process on the surface to be processed of the substrate 2. The film deposition apparatus 1 of the present embodiment is configured to transfer the substrate 2 between the chambers in a vertically standing state (in a posture in which the surface to be processed is vertical) (see fig. 9).
Fig. 11 is an example of a flowchart of the film formation process according to the present embodiment. The substrate 2 is sequentially transferred from the storage chamber 11 to the heating chamber 12 (S101), from the heating chamber 12 to the substrate processing apparatus 14 of the film forming chamber 13 (S103), and from the substrate processing apparatus 14 to the sputtering apparatus 15 (S105), and the film forming process is performed. After the substrate 2 is subjected to the heat treatment by the heater 121 in the heating chamber 12 (S102), first, the surface treatment by the substrate treatment apparatus 14 of the film forming chamber 13 is performed (S104). The substrate 2 subjected to the surface treatment is then subjected to a sputtering process using targets 151, 152, 153 made of different materials by the sputtering apparatus 15 (S106), and the film formation process is completed. The flow of the film formation process shown here is merely an example, and the process is not limited to the process described here.
The film formation apparatus 1 of the present embodiment can be applied to various electrode formations accompanied by pretreatment, for example. Specific examples thereof include a plating seed film for an FC-BGA (Flip-Chip Ball Grid Array) mounting substrate and a metal laminate film for a SAW (Surface Acoustic Wave) device. Further, a conductive hard film at a junction of an LED, a film formation of a terminal portion film of an MLCC (Multi-Layered Ceramic Capacitor), and the like can be cited. The present invention can also be applied to the formation of an electromagnetic shielding film of an electronic component package or a terminal portion film of a chip resistor. The dimensions of the processing substrate 2 may be, for example, 200mm in length and width by 200mm and 0.7 to 6.0mm in thickness. Examples of the material of the substrate 2 include glass, alumina, ceramics, and LTCC (Low Temperature Co-fired Ceramics).
< substrate transfer Structure and sputtering apparatus >
As described above, the substrate 2 is transferred between the chambers of the film formation apparatus 1 in a vertically standing state, and is also set in a posture in which the surface to be processed 21 is vertical (the surface to be processed 21 faces in the horizontal direction) in the sputtering chamber 51 (chamber). As shown in fig. 9, the substrate 2 is held by the substrate holder 30 in a state where the surface to be processed 21 is opened (exposed), and a peripheral portion of the outer periphery of the region to be processed is held. The substrate holder 30 holding the substrate 2 is supported by the substrate holder support portion 43. The substrate holder support portion 43 includes wheels 431 as a substrate transfer mechanism at a lower portion thereof, and is movably mounted on a rail 432 laid on a bottom surface of the sputtering chamber 51 in a state where the substrate holder 30 is supported. The vertical direction referred to herein is perpendicular to the bottom surface of the sputtering chamber 51 or the upper surface (substrate transfer surface) of the rail 432, and may not coincide with the gravity direction (vertical direction) depending on the apparatus configuration. Similarly, the horizontal direction described here may not coincide with a direction orthogonal to the direction of gravity. That is, in the present embodiment, the explanation is given on the assumption that the installation surface of the substrate holder support portion 43 on the inner wall of each chamber is a horizontal surface, and the directions of the vertical and horizontal directions are defined.
The sputtering chamber 51 of the sputtering apparatus 15 is evacuated to a predetermined high vacuum pressure by the evacuation apparatus 56. The substrate holder 30 moves at a constant speed in the sputtering chamber 51, and during this time, the film formation process by the cathode unit 50 is performed on the substrate 2. In the sputtering chamber 51, the substrate 2 (substrate holder 30) and the cathode unit 50 are arranged so as to face each other in the horizontal direction. The sputtering chamber 51 is adjusted to a vacuum degree (for example, 2 × 10Pa to 2 × 10-5 Pa) suitable for the sputtering process by an exhaust unit 56, and is supplied with a sputtering gas while being controlled in flow rate from a gas supply source 57. Thereby, a sputtering atmosphere is formed inside the sputtering chamber 51. As the sputtering gas, for example, a rare gas such as Ar, kr, or Xe, or a reactive gas for film formation can be used.
The plate-like target 151 as a film forming material is disposed parallel to the conveyance path of the substrate 2, that is, the surface 21 of the substrate 2 to be processed. The cathode electrode 251 is provided in close contact with the target 151 on the side opposite to the substrate 2. The power supply 55 is connected to the cathode electrode 251, and the sputtering chamber 51 is grounded. When a voltage is applied from the power source 55, the cathode electrode 251 serves as a cathode, and the wall of the sputtering chamber 51 serves as an anode.
< sputtering >
By the formation of the sputtering atmosphere and the application of a voltage from the power supply 55 to the cathode electrode 251, a plasma region is generated in the vicinity of the surface of the target 151 facing the substrate 2. The sputtering gas ions generated by the generation of the plasma region collide with the target 151, thereby discharging target particles from the surface of the target 151 facing the substrate 2. Target particles discharged from the target 151 fly toward the substrate 2 and are deposited, thereby forming a film on the surface 21 to be processed of the substrate 2. The targets 152 and 153 are different from the target 151 only in material, and the film formation mechanism by sputtering is the same.
< Structure of substrate holder 30 (characteristic of the present embodiment) >
Referring to fig. 1 to 4, a structure of a substrate holder 30, which is a feature of the present embodiment, will be described.
Fig. 1 is a schematic partial sectional view of a substrate holder according to an embodiment of the present invention (cut-off end view). Fig. 2 is a schematic perspective exploded view of a substrate holder of an embodiment of the invention. Fig. 3 is a schematic cross-sectional view (cut-off end view) of the substrate holder according to the embodiment of the present invention, and is a view for explaining a state where the substrate 2 is assembled to the substrate holder 30. Fig. 4 is a schematic plan view of the second frame body of the substrate holder of the embodiment of the invention.
As described above, the substrate holder 30 is configured to hold the substrate 2 with the region to be processed of the substrate 2 exposed, and holds the substrate 2 by substantially sandwiching both surfaces of the substrate 2 by the substrate pusher 31 as a first frame body and the substrate holder main body 32 as a second frame body. The target processing surface 21, which is one surface (first surface) of the substrate 2, is configured by a target processing region 21a to which the above-described film formation process or the like is performed, and a peripheral edge region 21b surrounding an outer side (outer periphery) of the target processing region 21 a.
The substrate holder 31 has a contact surface (first contact portion) 310 that contacts the surface 21 to be processed at a substrate end portion of the peripheral edge portion 21b of the surface 21 to be processed of the substrate 2, that is, at a position inward of a corner portion 24 (substrate end portion) of a boundary between the surface 21 to be processed and the side end surface 23 of the substrate 2. The abutment surface 310 is appropriately set to abut against the peripheral edge region 21b of the surface to be processed 21 at a position inside the corner portion 24 within a range in which the occurrence of chipping can be suppressed. The abutment surface 310 is a distal end surface of a convex portion 311 protruding in the substrate holder 31 in the opposing direction to the substrate holder main body 32. The convex portion 311 is formed in a substantially rectangular ring shape on the opposing portion of the substrate holder 31 that faces the substrate holder main body 32. A groove portion (concave portion) 313 is formed in a portion of the substrate holder 31 facing the substrate holder main body 32, the groove portion (concave portion) 313 being located outside the convex portion 311, and the groove portion (concave portion) 313 is used to form a gap for preventing the substrate holder 31 from contacting the corner portion 24 of the substrate 2. Further, an opening 312 for opening (exposing) the surface to be processed 21 of the substrate 2 to the outside is formed in a position inside the convex portion 311 of the facing portion of the substrate holder main body 32 of the substrate holder 31. The substrate holder 31 is a frame-shaped member that surrounds the periphery of the region 21a to be processed of the substrate 2.
The substrate holder main body 32 has a contact surface (second contact portion) 320 that contacts the back surface 22 at a position inside a corner portion 24 of a boundary between the back surface 22 and the side end surface 23 of the substrate 2, in the back surface 22 on the opposite side of the target surface 21, which is the other surface (second surface) of the substrate 2. The abutment surface 320 is set to abut against the rear surface 22 at a position more or less inside than the corner portion 24 within a range in which the occurrence of chipping can be suppressed. The abutment surface 320 is a distal end surface of a convex portion 321 protruding in the substrate holder main body 32 in a direction opposite to the substrate presser 31. The convex portion 321 is formed in a substantially rectangular ring shape in an opposing portion of the substrate holder body 32 that opposes the substrate presser 31. A groove portion (concave portion) 323 is formed in the substrate holder main body 32 at a position outside the convex portion 321 in the facing portion facing the substrate holder 31, and the groove portion (concave portion) 323 forms a gap for preventing the substrate holder main body 32 from contacting the corner portion 24 of the substrate 2. A concave portion 322 is formed in the facing portion of the substrate holder body 32 facing the substrate holder 31, at a position inside the convex portion 321, and the concave portion 322 faces the back surface 22 of the substrate 2 with a gap. Instead of the concave portion 322, an opening may be provided in the same manner as the opening 312 of the substrate holder 31. That is, the rear surface 22 of the substrate 2 may be configured as a holder structure that is open to the outside.
In the substrate holder main body 32, a positioning pin 33 as an abutting member for positioning the substrate 2 with respect to the substrate holder main body 32 is fixed to the substrate holder main body 32 by a screw 35. The positioning pins 33 have a tip shape gradually narrowing in width in a direction perpendicular to the substrate 2 toward the side end surface 23 of the substrate 2, and the tip end surface 330 thereof abuts against the side end surface 23 of the substrate 2 as an abutting portion. Here, the direction perpendicular to the substrate 2 is synonymous with the thickness direction of the substrate 2, the facing direction of the substrate presser 31 and the substrate holder main body 32, the Z-axis direction in fig. 2 and the like, and the like. The width of the tip surface 330 of the positioning pin 33 in the direction perpendicular to the substrate 2 is smaller than the thickness of the substrate 2, and abuts against the side end surface 22 at a position avoiding contact with the corner portion 24 (in the present embodiment, the central portion in the above direction). The position where the distal end surface 330 abuts against the side end surface 22 may be a position where occurrence of chipping can be suppressed, and may not be the central portion.
The substrate holder body 32 and the substrate holder 31 are fastened and fixed to each other by a screw 34 serving as a fastening means in a state where the positioning pin 33 is in contact with the end surface 23 of the substrate 2 and the substrate 2 is held between the contact surfaces 310 and 320. The substrate holder 31 and the substrate holder body 32 are fastened at a plurality of locations by a plurality of screws 34, and in the present embodiment, the clamping force of each screw 34 is set to 5 to 40cN/m. The screw hole 314 of the substrate holder 31 and the screw hole 324 of the substrate holder body 32 are provided at positions outside the contact position of the positioning pin 33 and the substrate 2 with respect to the substrate 2. By fastening the screw 34, the abutment surfaces 310 and 320 constitute a clamping portion that clamps both surfaces of the substrate 2 in non-contact with the corner portion 24 of the substrate 2. The substrate holder 31, the substrate holder body 32, and the positioning pins 33 are made of SUS in this embodiment, but other metals may be used as long as they have a certain degree of hardness. Further, other materials may be suitably used as long as the desired positioning and holding function can be obtained.
The contact surface 310 of the substrate holder 31 and the contact surface 320 of the substrate holder main body 32 are configured to be in contact with both surfaces of the substrate 2 without being in contact with the corner portion 24 at a position inside the corner portion 24 of the substrate 2, whereby a force acting on the corner portion 24 in the thickness direction (Z direction) of the substrate 2 can be alleviated. Further, the positioning pins 33 are also configured to contact the end surface 23 of the substrate 2 without contacting the corner portions 24 at positions inward of the corner portions 24 of the substrate 2, thereby being able to alleviate forces acting on the corner portions 24 in the width direction of the substrate 2 (the direction parallel to the surfaces 21, 22 of the substrate 2, the XY direction). In this way, the substrate holder 30 does not have a portion that contacts the corner portion 24 of the substrate 2, and thus occurrence of chipping can be suppressed in the substrate 2 that is not chamfered. That is, according to the present embodiment, the substrate can be held while suppressing the occurrence of damage to the substrate.
< Assembly of substrate 2 into substrate holder 30 >
As shown in fig. 3, in assembling the substrate 2 to the substrate holder 30, first, the substrate 2 is placed in a predetermined substrate accommodating portion of the substrate holder body 32, specifically, on the contact surface 320 of the convex portion 321 (fig. 3 a). At this time, the back surface 22 of the substrate 2 is placed on the contact surface 320, and the side end surface 23 of the substrate 2 is brought into contact with the front end surface 330 of the positioning pin 33, whereby the substrate 2 can be positioned in the substrate holder main body 32 (fig. 3B). The substrate holder 32 on which the substrate 2 is positioned is covered with the frame-shaped substrate holder 31 so as to cover the outer periphery (peripheral region 21 b) of the substrate 2, and the substrate 2 is held by the contact surfaces 310 and 320. The substrate 2, the substrate holder 31, and the substrate holder main body 32 are integrally fixed by fastening with screws 34 (fig. 3C).
< arrangement of positioning pins 33 >
As shown in fig. 4, the positioning pins 33 are provided in plurality. The positioning pins 33 are disposed so as to contact only one of the 4 sides of the substrate 2, which are opposed to each other, of the 2 sides. That is, the positioning pin 33 is in contact with only one of the 2 sides, and the force in the direction of the substrate 2 does not act on the other side from the substrate holder 30. That is, the positioning pins 33 are not disposed so as to face each other in the abutting direction. By configuring the portion of the substrate 2 opposite to the portion in contact with the positioning pin 33 so as not to be position-restricted in the direction along the substrate 2, it is possible to position the substrate 2 while absorbing dimensional changes and the like of the substrate 2 or the substrate holder 30 due to dimensional errors, thermal expansion, and the like.
The positioning pins 33 are disposed at positions in contact with the end surface 23 on one side of the 2 sides out of the 4 sides of the substrate 2 that do not face each other, and at positions in contact with the end surface 23 on the other side. That is, by performing positioning in 2 directions along the direction of the substrate 2, the substrate 2 can be positioned on the substrate holder 30 with high accuracy. Further, by disposing the plurality of positioning pins 33 so as to abut on 1 of the 4 sides of the substrate 2 at different positions, more accurate positioning can be performed. Further, the side of the substrate 2 against which the positioning pins 33 are brought into contact is set to the lower end side among the 4 sides of the substrate 2 when the substrate 2 stands vertically, so that the positioning pins 33 support the end surface 23, which is the lower end surface, of the substrate 2 when the substrate 2 is conveyed. This enables a more stable holding state of the substrate 2.
< modification 1>
Fig. 5 a is a schematic partial sectional view (cut-off end view) of a substrate holder 30a according to modification 1 of embodiment 1 of the present invention. In this modification, the same reference numerals are given to the components common to those of embodiment 1, and the explanation thereof will be omitted. As shown in fig. 5 (a), in the present modification, the positioning pins 33 are disposed in the groove portions 323 of the substrate holder main body 32. The substrate holder body 32 and the substrate holder 31 are configured to abut against each other at portions fastened by the screws 34. In the substrate holder main body 32, the abutment surface 325 that abuts against the substrate holder 31 and the abutment surface 320 that abuts against the substrate 2 (in the Z direction in fig. 2 and the like) have the same height. According to the above configuration, in the step of forming the groove 323 in the production of the substrate holder main body 32, the abutment surfaces 320 and 325 and the installation portion of the positioning pin 23 can be formed, and the production cost can be reduced.
< modification 2>
Fig. 5B is a schematic partial sectional view (cut-off end view) of the substrate holder 30B according to modification 2 of embodiment 1 of the present invention. In this modification, the same reference numerals are given to the same components as those in embodiment 1 and modification 1, and the explanation thereof will be omitted. As shown in fig. 5 (B), in modification 2, unlike modification 1, in the substrate holder 31, the abutment surface 315 that abuts the substrate holder main body 32 and the abutment surface 310 that abuts the substrate 2 (in the Z direction in fig. 2 and the like) are at the same height. According to the above configuration, even in the step of forming the groove portion 313 in the production of the substrate holder 31, the abutment surfaces 310 and 315 can be formed, and the production cost can be reduced.
< modification 3>
Fig. 6 a is a schematic partial sectional view (cut-off end view) of a substrate holder 30c according to modification 3 of example 1 of the present invention. In this modification, the same reference numerals are given to the components common to those of embodiment 1 and modifications 1 and 2, and the explanation thereof is omitted. As shown in fig. 6 (a), in modification 3, a region outside the convex portion 321 in an opposing portion of the substrate holder main body 32 opposing the substrate holder 31 is configured to have groove-like irregularities such as the groove portions 323 in example 1 and the like arranged. Specifically, the region of the substrate holder main body 32 outside the contact surface 320 is constituted by a single surface 326 which forms a gap with the substrate 2 in order to form a non-contact state with the substrate 2. A part of the single surface 326 also serves as a surface that abuts against the installation surface of the positioning pin 33 and the abutment surface 315 of the substrate holder 31. According to the above configuration, the substrate holder main body 32 can be formed into a simple configuration without forming the groove 323 or the installation portion of the positioning pin 33 as in example 1, and the cost in manufacturing the substrate holder main body 32 can be reduced.
< modification 4>
Fig. 6B is a schematic partial sectional view (cut-off end view) of a substrate holder 30d according to modification 4 of embodiment 1 of the present invention. In this modification, the same reference numerals are given to the common components as in embodiment 1 and modifications 1 to 3, and the explanation thereof is omitted. As shown in fig. 6 (B), in modification 4, unlike modification 3, a region outside the convex portion 311 in the facing portion of the substrate holder 31 facing the substrate holder main body 32 is configured to have groove-like irregularities such as the groove portions 313 in example 1 and the like. Specifically, the region of the substrate holder 31 outside the contact surface 310 is constituted by a single surface 316 that forms a gap with the substrate 2 in order to form a non-contact state with the substrate 2. A part of the single surface 316 also serves as a surface that abuts against the abutment surface 325 of the substrate holder main body 32. According to the above configuration, the substrate holder 31 can be formed into a simple configuration without forming the groove portion 313 as in example 1, and the cost for manufacturing the substrate holder 31 can be reduced.
(example 2)
Fig. 7 is a schematic plan view of the substrate holder main body 32e of the substrate holder 30e according to embodiment 2 of the present invention. In this embodiment, the same reference numerals are given to the same components as those in embodiment 1 and modifications 1 to 4, and the explanation thereof will be omitted. The substrate holder 30e of example 2 can accommodate and hold 2 substrates. Specifically, as shown in fig. 7, 2 substrates can be held in parallel at the same height in the horizontal direction. Fig. 7 shows only the substrate holder main body 32e and the positioning pins 33, and the illustration of the substrate and the substrate presser is omitted.
As shown in fig. 7, the substrate holder main body 32e is provided with 2 recesses 322a and 322b corresponding to 2 substrates, and the abutment surface 320 and the positioning pin 33 are disposed on the outer peripheries thereof. Here, in the present embodiment, the positioning pins 33e are provided to enter the region between the adjacent substrates and perform positioning of one of the 2 substrates. The positioning pin 33e has a fixing portion 33e1, an extending portion 33e2, and a protruding portion 33e3. The fixing portion 33e1 is fixed to a surface (or an opposing surface) of the substrate holder body 32e outside the substrate arrangement space, which is in contact with the substrate holder by fastening of the screw 34, by a screw 35. The extending portion 33e2 extends from the fixing portion 33e1 to a position facing 1 side of the substrate at a predetermined position between the 2 substrate arrangement spaces. The protruding portion 33e3 protrudes from the side of the extending portion 33e2 toward the substrate arrangement space, and the substrate is positioned by the contact of the front end surface 330e thereof with the above-mentioned 1 side of the substrate.
According to the positioning pin 33e of the present embodiment, in the rack structure in which 2 substrates are arranged in parallel, the abutting portion can be formed by utilizing the space provided for forming the screw fastening portion (the screw hole 324) between the 2 substrate installation spaces. Therefore, according to the present embodiment, 2 substrates can be arranged at the minimum necessary intervals, and the substrates can be held while suppressing the occurrence of damage to the substrates. The positioning structure using the positioning pins 33e according to the present embodiment can be applied to a substrate holder capable of holding a plurality of substrates of 3 or more.
< others >
In the present embodiment, the contact surfaces 310 and 320 (the convex portions 311 and 321) are continuously formed in a substantially rectangular ring shape, but may be intermittently formed.
In the present embodiment, the widths of the contact surfaces 310 and 320 are the same, but may be different. The respective contact positions of the contact surfaces 310 and 320 may be shifted from each other in the width direction of the substrate 2.
The number or arrangement of the positioning pins 33 and the screws 34 is not limited to the number or arrangement in the above embodiments, and may be changed as appropriate. The screw fastening position of the screw 34 is separated from the angle of the base plate by a predetermined distance, and the occurrence of chipping can be prevented more reliably.
The above embodiments and modifications may be combined with each other as much as possible.

Claims (9)

1. A substrate holder that holds a substrate having a first main surface including a region to be processed, a second main surface on a side opposite to the first main surface, and an end surface connecting the first main surface and the second main surface, the substrate holder comprising:
a first frame body having an opening for exposing the region to be processed; and
a second frame body fastened to the first frame body by a fastening mechanism,
the first frame body has a first abutting portion abutting a peripheral edge region outside the region to be processed of the first main surface,
the second frame body has a second abutting portion abutting against a position of the second main surface corresponding to the peripheral edge region, and a third abutting portion abutting against the end surface,
the first abutting portion, the second abutting portion, and the third abutting portion hold the substrate such that a first angle formed by the first main surface and the end surface and a second angle formed by the second main surface and the end surface are separated from any one of the first frame and the second frame.
2. The substrate support of claim 1,
the first contact portion is in contact with the first main surface at a position spaced inward from the first corner,
the second contact portion is in contact with the second main surface at a position spaced inward from the second angle,
the third contact portion contacts the end surface at a position separated inward from each of the first and second corners.
3. The substrate support according to claim 1 or 2,
the first frame body has a groove portion for forming a gap between the first frame body and the first corner on an outer side of the first abutting portion.
4. The substrate support according to claim 1 or 2,
the second frame body has a groove portion for forming a gap between the second frame body and the second corner on an outer side of the second abutting portion.
5. The substrate support according to claim 1 or 2,
the second frame includes a plurality of the third contact portions.
6. The substrate support according to claim 1 or 2,
the first main face and the second main face are each a rectangle having four sides,
the end surface includes first to fourth portions respectively distinguished corresponding to each of the four sides,
the third abutting portion abuts against the first portion of the end face,
the second portion facing the first portion is separated from both the first housing and the second housing.
7. A substrate processing apparatus is characterized in that,
the substrate holder according to claim 1 or 2 is provided with a transfer mechanism that transfers the substrate holder in a state where the substrate holder holds the substrate in a vertical direction on each of the first main surface and the second main surface.
8. The substrate processing apparatus according to claim 7,
an end surface of the substrate abutting against the third abutting portion is positioned below the vertical direction.
9. A film deposition apparatus is characterized by comprising:
the substrate processing apparatus according to claim 7 or 8; and
and a film forming mechanism for performing a film forming process on the target region of the substrate.
CN202211706317.8A 2017-12-26 2018-11-16 Substrate holder, substrate processing apparatus, and film forming apparatus Pending CN115874157A (en)

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JP2017-250012 2017-12-26
JP2017250012A JP6673894B2 (en) 2017-12-26 2017-12-26 Substrate holder and film forming device
CN201811362770.5A CN109957765B (en) 2017-12-26 2018-11-16 Substrate holder and film forming apparatus

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JP2004221134A (en) * 2003-01-09 2004-08-05 Renesas Technology Corp Apparatus and method of manufacturing semiconductor device
JP2005077845A (en) * 2003-09-01 2005-03-24 Hoya Corp Sputtering system, method for manufacturing substrate with thin film, method for manufacturing mask blank, and method for manufacturing the transfer mask
JP2005252042A (en) * 2004-03-05 2005-09-15 Sci Technol Kk Substrate holding device
TWM342613U (en) * 2008-05-22 2008-10-11 Phoenix Prec Technology Corp Substrate alignment fixture
KR100984171B1 (en) * 2008-05-23 2010-09-28 엘아이지에이디피 주식회사 Substrate clamping apparatus
JP2011124348A (en) * 2009-12-09 2011-06-23 Ulvac Japan Ltd Substrate holder and substrate carrier
JP5546299B2 (en) * 2010-03-17 2014-07-09 株式会社アルバック Clamp device and substrate holder
JP5682910B2 (en) * 2010-10-15 2015-03-11 株式会社アルバック Substrate holder and substrate transfer device
KR102245762B1 (en) * 2014-04-17 2021-04-27 어플라이드 머티어리얼스, 인코포레이티드 Holder, carrier having the same, and method for fixing a substrate
TWI619826B (en) 2014-07-31 2018-04-01 愛發科股份有限公司 Substrate processing apparatus and substrate processing method
KR20160033910A (en) * 2014-09-19 2016-03-29 삼성전자주식회사 Retainer and wafer carrier including the same
JP6662068B2 (en) * 2016-02-02 2020-03-11 いすゞ自動車株式会社 Storage container
JP2017218607A (en) * 2016-06-03 2017-12-14 株式会社島津製作所 Substrate holder

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CN109957765B (en) 2023-09-01
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JP6673894B2 (en) 2020-03-25
KR102365614B1 (en) 2022-02-18
KR20190078480A (en) 2019-07-04

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