JP2019102878A5 - - Google Patents

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Publication number
JP2019102878A5
JP2019102878A5 JP2017229140A JP2017229140A JP2019102878A5 JP 2019102878 A5 JP2019102878 A5 JP 2019102878A5 JP 2017229140 A JP2017229140 A JP 2017229140A JP 2017229140 A JP2017229140 A JP 2017229140A JP 2019102878 A5 JP2019102878 A5 JP 2019102878A5
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JP
Japan
Prior art keywords
unit
substrate
signal
connector
imaging device
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Application number
JP2017229140A
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English (en)
Japanese (ja)
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JP2019102878A (ja
JP6980501B2 (ja
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Priority to JP2017229140A priority Critical patent/JP6980501B2/ja
Priority claimed from JP2017229140A external-priority patent/JP6980501B2/ja
Publication of JP2019102878A publication Critical patent/JP2019102878A/ja
Publication of JP2019102878A5 publication Critical patent/JP2019102878A5/ja
Application granted granted Critical
Publication of JP6980501B2 publication Critical patent/JP6980501B2/ja
Expired - Fee Related legal-status Critical Current
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JP2017229140A 2017-11-29 2017-11-29 接続装置および撮像装置 Expired - Fee Related JP6980501B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017229140A JP6980501B2 (ja) 2017-11-29 2017-11-29 接続装置および撮像装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017229140A JP6980501B2 (ja) 2017-11-29 2017-11-29 接続装置および撮像装置

Publications (3)

Publication Number Publication Date
JP2019102878A JP2019102878A (ja) 2019-06-24
JP2019102878A5 true JP2019102878A5 (enExample) 2020-12-24
JP6980501B2 JP6980501B2 (ja) 2021-12-15

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ID=66974210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017229140A Expired - Fee Related JP6980501B2 (ja) 2017-11-29 2017-11-29 接続装置および撮像装置

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JP (1) JP6980501B2 (enExample)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003007373A (ja) * 2001-06-26 2003-01-10 Toshiba Corp 圧接コネクタを有した撮像素子モジュール
JP2007157553A (ja) * 2005-12-06 2007-06-21 National Institute Of Advanced Industrial & Technology 異方導電性フィルムおよび接続対象物の電極構造
JP2011010209A (ja) * 2009-06-29 2011-01-13 Nec Corp 差動信号線路及び配線基板
JP6019657B2 (ja) * 2012-03-26 2016-11-02 富士通株式会社 設計支援プログラム、設計支援方法、設計支援装置および製造方法

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